Patent application number | Description | Published |
20080251315 | Acoustic septum cap honeycomb - An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of acoustic material and include a resonator portion and a flange portion. The flange portion has an anchoring surface that provides frictional engagement of the septum caps to the honeycomb cells when the caps are inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the anchoring surface of the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond. | 10-16-2008 |
20110073407 | ACOUSTIC SEPTUM CAP HONEYCOMB - An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of acoustic material and include a resonator portion and a flange portion. The flange portion has an anchoring surface that provides frictional engagement of the septum caps to the honeycomb cells when the caps are inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the anchoring surface of the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond. | 03-31-2011 |
20120037449 | ACOUSTIC HONEYCOMB WITH PERFORATED SEPTUM CAPS - An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of flexible material that may be perforated before or after the material is inserted into the honeycomb. The flexible material is sufficiently flexible to allow folding into the shape of a septum cap. The flexible material is also sufficiently stiff to provide frictional engagement and locking of the septum cap to the honeycomb cell when the cap is inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond. | 02-16-2012 |
20130220731 | SPLICING OF CURVED ACOUSTIC HONEYCOMB - Honeycomb sections are bonded together with seams made up of an adhesive that is carried by a honeycomb seam support or a linked-segment seam support. The seams are particularly useful for splicing together curved honeycomb sections that contain acoustic septum. The curved acoustic honeycomb sections are spliced or seamed together to form engine nacelles and other acoustic dampening structures. | 08-29-2013 |
20130299274 | ACOUSTIC STRUCTURE WITH INCREASED BANDWIDTH SUPPRESSION - The bandwidth or acoustical range of a nacelle or other type of acoustic structure is increased by acoustically coupling honeycomb cells together to form pairs of acoustic cells that have an effective acoustic or resonator length that is up to twice that of either acoustic cell taken alone. | 11-14-2013 |
20140013601 | METHOD FOR MAKING ACOUSTIC HONEYCOMB - A method for making an acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of flexible material that may be perforated before or after the material is inserted into the honeycomb. The flexible material is sufficiently flexible to allow folding into the shape of a septum cap. The flexible material is also sufficiently stiff to provide frictional engagement and locking of the septum cap to the honeycomb cell when the cap is inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond. | 01-16-2014 |
20140034417 | SPLICING OF CURVED ACOUSTIC HONEYCOMB - Honeycomb sections are bonded together with seams made up of an adhesive that is carried by a linked-segment seam support. The seams are particularly useful for splicing together curved honeycomb sections that contain acoustic septum. The curved acoustic honeycomb sections are spliced or seamed together to form engine nacelles and other acoustic damping structures. | 02-06-2014 |
20140131136 | ACOUSTIC STRUCTURE WITH INCREASED BANDWIDTH SUPPRESSION - The bandwidth or acoustical range of a nacelle or other type of acoustic structure is increased by acoustically coupling honeycomb cells together to form pairs of acoustic cells that have an effective acoustic or resonator length that is up to twice that of either acoustic cell taken alone. | 05-15-2014 |
20140133964 | ACOUSTIC STRUCTURE WITH INTERNAL THERMAL REGULATORS - Thermally insulating septums are located internally within the cells of an acoustic honeycomb to regulate heat flow into the acoustic structure. The internally located insulating septums protect the honeycomb and acoustic septums located within the honeycomb cells from heat damage that might otherwise be caused by a heat source, such as the hot section of a jet engine. The internal thermal regulators are useful in combination with heat blankets or other thermal insulating structures to provide a reduction in size and/or weight of the insulating structure while still providing the same overall degree of thermal insulation for the acoustic honeycomb. | 05-15-2014 |
Patent application number | Description | Published |
20110093955 | DESIGNING SECURITY INTO SOFTWARE DURING THE DEVELOPMENT LIFECYCLE - Systems, methods, and computer program products are provided for a comprehensive software security system. The overarching software security system described and claimed herein provides for a system that address all of the concerns and vulnerabilities present at the design level (i.e., new software applications) and the production level (i.e., pre-existing software applications) associated with software. Additionally, the system governs the individual security processes and practices. The software security system defines specific security practices and the timing for application of the practices within the overall software development lifecycle. Additionally, the disclosed software security system takes advantage of role specialization, such as security specialization, to increase effectiveness and limit conflicts of interest within the design process. | 04-21-2011 |
20130019315 | DESIGNING SECURITY INTO SOFTWARE DURING THE DEVELOPMENT LIFECYCLE - Systems, methods, and computer program products are provided for a comprehensive software security system. The overarching software security system described and claimed herein provides for a system that address all of the concerns and vulnerabilities present at the design level (i.e., new software applications) and the production level (i.e., pre-existing software applications) associated with software. Additionally, the system governs the individual security processes and practices. The software security system defines specific security practices and the timing for application of the practices within the overall software development lifecycle. Additionally, the disclosed software security system takes advantage of role specialization, such as security specialization, to increase effectiveness and limit conflicts of interest within the design process. | 01-17-2013 |
Patent application number | Description | Published |
20120068386 | METHOD FOR MAKING A RESERVOIR - The invention described herein relates to a method by which a reservoir having desired end connection profiles may be made using shape memory characteristics of crosslinking to compressively seal the connection profiles into the reservoir. | 03-22-2012 |
20130075952 | METHOD OF MAKING AN OVERMOLDED WATERWAY CONNECTION - A process for providing an overmolded waterway comprising inserting a shaft portion of a sacrificial core into an end of a tube, the shaft portion having a first opening therein, the sacrificial core having a second portion comprising a second opening and a contact surface about the second opening, the second opening in fluid communication with the first opening and the inside of the tube, in a mold cavity inserting a core pin transverse to the tube end, the sacrificial core contact surface engaging a mating surface of the core pin closing the second opening, injection overmolding over a portion of the tube end and core pin forming an overmolded waterway having an outlet portion in fluid communication with the second opening and the inside of the tube, and removing the core pin from the second opening through the outlet portion and removing the overmolded waterway from the mold cavity. | 03-28-2013 |
20130147188 | QUICK-CONNECT TUBE COUPLING - A quick-connect fitting includes a polymeric first connector in fluid communication with a first component, and a polymeric second connector in fluid communication with a second component. The first connector is either a male fitting or a female fitting, and the other of the male fitting and female fitting is the second connector. The female fitting includes a longitudinal cylindrical cavity having therein a retaining ring retaining an o-ring, and the male fitting includes a cylindrical body and a tubular sealing element extending longitudinally therefrom positionable within the polymeric female fitting and o-ring in sealing engagement. The quick connect fitting includes a clip pivotably connected to the second connector moving between a first position connecting the female fitting to the male fitting when the male fitting is positioned within the female fitting and a second position in which the male fitting is removable from the female fitting. | 06-13-2013 |
20130256955 | METHOD FOR MAKING A RESERVOIR - A process for making a reservoir including steps of positioning a hollow extrudate at an elevated temperature in a mold cavity, inserting a fitting into an end of the extrudate, sealing an outer surface of the fitting with an interior surface of the extrudate using latent heat within the extrudate, and forming at least a portion of the extrudate against the mold cavity forming a reservoir with the fitting sealed into the reservoir. | 10-03-2013 |
20140001751 | QUICK-CONNECT TUBE COUPLING | 01-02-2014 |
20150338004 | QUICK-CONNECT TUBE COUPLING - A quick-connect fitting includes a polymeric first connector in fluid communication with a first component, and a polymeric second connector in fluid communication with a second component. The first connector is either a male fitting or a female fitting, and the other of the male fitting and female fitting is the second connector. The female fitting includes a longitudinal cylindrical cavity having therein a retaining ring retaining an o-ring, and the male fitting includes a cylindrical body and a tubular sealing element extending longitudinally therefrom positionable within the polymeric female fitting and o-ring in sealing engagement. The quick connect fitting includes a clip pivotably connected to the second connector moving between a first position connecting the female fitting to the male fitting when the male fitting is positioned within the female fitting and a second position in which the male fitting is removable from the female fitting. | 11-26-2015 |
Patent application number | Description | Published |
20080278257 | Managed wideband radio frequency distribution system with signal level enabling interface device - A system and method for managing distribution of wideband radio frequency signals includes detecting an impedance signature of a device connected at the end of transmission medium. A switch is opened to apply a wideband radio frequency signal to a transmission medium for distribution. A biasing voltage can be applied to the transmission medium based on the detected impedance signature. A signal conditioning circuit is selected based on the amplitude of the biasing voltage, and the wideband radio frequency signal is distributed to an output device. | 11-13-2008 |
20090280739 | MANAGED WIDEBAND RADIO FREQUENCY DISTRIBUTION SYSTEM WITH SIGNAL LEVEL ENABLING INTERFACE DEVICE AND IMPEDANCE SIGNATURE DETECTION - A system and method for managing distribution of wideband radio frequency signals includes detecting an impedance signature of a device connected at the end of transmission medium. A switch is opened to apply a wideband radio frequency signal to a transmission medium for distribution. A biasing voltage can be applied to the transmission medium based on the detected impedance signature. A signal conditioning circuit is selected based on the amplitude of the biasing voltage, and the wideband radio frequency signal is distributed to an output device. | 11-12-2009 |
20100009623 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TIA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 01-14-2010 |
20120216231 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TIA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 08-23-2012 |
20130081092 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TTA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 03-28-2013 |
20130266050 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TIA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 10-10-2013 |
20140150038 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TIA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 05-29-2014 |
20150350724 | INTELLIGENT DEVICE SYSTEM AND METHOD FOR DISTRIBUTION OF DIGITAL SIGNALS ON A WIDEBAND SIGNAL DISTRIBUTION SYSTEM - A plurality of intelligent device systems for use with a wideband signal distribution network, and methods for transmitting digital information and receiving digital and non-digital information onto and off of an RF carrier through a wideband signal distribution network, are disclosed. The intelligent device systems provide networks of intelligent devices that modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband signal distribution system, such as an analog carrier system, using existing EIA/TIA 568 standard wiring infrastructure. The methods modulate and demodulate digital video, IP video/data/voice and digital wireless onto, and off of, a wideband distribution system, such as an analog carrier system, and separate IP portions from non-IP portions. | 12-03-2015 |
Patent application number | Description | Published |
20110074341 | NON-CONTACT INTERFACE SYSTEM - An interface system for a sensor wafer may comprise a sensor wafer having a substrate. One or more sensors may be mounted to the substrate. An electronics module may be mounted to the substrate and coupled to the one or more sensors. An energy storage device may be mounted to the substrate and coupled to the electronics module. A secondary coil may be attached to a surface of the sensor wafer, and coupled to the electronics module of the sensor wafer, having a diameter of at least 50 millimeters. A primary coil may be attached to a front opening universal pod (FOUP). The primary coil, may situated and oriented in the FOUP such that the primary coil is concentric with the secondary coil and at least 8, but less than 12 millimeters from the sensor wafer when the sensor wafer is stored in a slot in the FOUP. | 03-31-2011 |
20120203495 | PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPIECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES - A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences. | 08-09-2012 |
20120318966 | WAFER LEVEL SPECTROMETER - A sensor apparatus for measuring characteristics of optical radiation has a substrate and a low profile spectrally selective detection system located within the substrate at one or more spatially separated locations. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 12-20-2012 |
20130155390 | FILM THICKNESS MONITOR - A measurement unit comprising a light source and a photodetector may be formed in a cavity in a substrate. The light source produces light that impinges a material layer and is reflected back to the photodetector. Through methods such as interferometry and ellipsometry, the thickness of the material layer may be calculated from the light intensity data measured by the photodetector. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 06-20-2013 |
20140122654 | AUTOMATED INTERFACE APPARATUS AND METHOD FOR USE IN SEMICONDUCTOR WAFER HANDLING SYSTEMS - Aspects of the present disclosure describe a smart docking station. The smart docking station may contain a data transfer and an electrical connection which allow a sensor wafer to be charged and to upload and download data. The smart docking station may be located at an off-track storage position above a tool. This location enables an automated materials handling system (AMHS) to retrieve the sensor wafer and deliver it to a tool requiring analysis. The sensor wafer may be stored in a smart front opening unified pod (FOUP). It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 05-01-2014 |
20140192840 | HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PLASMA - Aspects of the present disclosure disclose a component module in a process condition measuring device comprises a support for supporting a component, one or more legs configured to suspend the support in a spaced-apart relationship with respect to a substrate. An electrically conductive or low-resistivity semiconductor enclosure is configured to enclose the component, the support and the legs between the substrate and the enclosure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 07-10-2014 |
20140253928 | THICKNESS CHANGE MONITOR WAFER FOR IN SITU FILM THICKNESS MONITORING - An etch rate monitor apparatus has a substrate, an optical element and one or more optical detectors mounted to a common substrate with the one or more detectors sandwiched between the substrate and optical element to detect changes in optical interference signal resulting from changes in optical thickness of the optical element. The optical element is made of a material that allows transmission of light of a wavelength of interest. A reference waveform and data waveform can be collected with the apparatus and cross-correlated to determine a thickness change. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 09-11-2014 |
20140355643 | Method and System for Measuring Heat Flux - A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity. | 12-04-2014 |
20150020972 | PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER - A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s). | 01-22-2015 |
20150176980 | POSITION SENSITIVE SUBSTRATE DEVICE - Some aspects of the present disclosure relate to a system having a substrate device, a substrate support surface, and a substrate handler that positions the substrate device on the substrate support surface. The substrate device and the substrate support surface may have counterpart coarse position units and fine position units. The system may measure coarse positional offsets between the first and second coarse position units, re-position the substrate device on the substrate support surface based on the coarse positional offsets, and subsequently measure fine positional offsets between the first and second fine position units. In some implementations, the substrate device is integrally coupled to the substrate handler via a wireless communication link in order to communicate position information as feedback for further placement. | 06-25-2015 |
Patent application number | Description | Published |
20120125028 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A space-saving, high-density modular data pod system and an energy-efficient cooling system for cooling electronic equipment and method of cooling are disclosed. The cooling system includes a free-cooling system cooling a first fluid in thermal communication with the electronic equipment using atmospheric air and a mechanical sub-cooling system coupled to the free-cooling system. The mechanical system cools a second fluid flowing in the free-cooling system as a function of an amount by which the free-cooling system has exceeded its maximum cooling capacity. The method of cooling includes using a first fluid, enabling heat transfer from the first fluid to a second fluid that has been cooled using atmospheric air, and mechanically cooling the second fluid to the extent that free cooling the first fluid is insufficient to cool the first fluid. The cooling system operates by the wet bulb temperature exceeding a first predetermined wet bulb temperature. | 05-24-2012 |
20120127653 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system. | 05-24-2012 |
20120127657 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system. | 05-24-2012 |
20120133256 | SPACE-SAVING HIGH-DENSITY MODULAR DATA SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks. | 05-31-2012 |
20120279684 | SYSTEMS AND METHODS FOR COOLING ELECTRONIC EQUIPMENT - A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature. | 11-08-2012 |
20120300391 | MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME - A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space. | 11-29-2012 |
20120318492 | COOLING SYSTEMS FOR ELECTRICAL EQUIPMENT - A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system. | 12-20-2012 |
20130047653 | SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS - A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system. | 02-28-2013 |
20140096562 | COOLING SYSTEM INCLUDING A CONTROLLED ATMOSPHERIC HEAT REJECTION CYCLE WITH WATER RE-CAPTURE - The present disclosure relates to a cooling system including a controlled atmospheric heat rejection cycle with water re-capture. The cooling system for cooling a heat load includes a first evaporative section configured to circulate a first fluid to enable heat transfer from the heat load to the first fluid, a second evaporative section in fluid communication with the first evaporative section and configured to circulate the first fluid, and a liquid refrigerant distribution unit in thermal communication with the second evaporative section. The liquid refrigerant distribution unit is configured to circulate a second fluid to enable heat transfer from the first fluid to the second fluid. | 04-10-2014 |
20140285965 | SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS - A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server. | 09-25-2014 |
20140311169 | SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT - Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive. | 10-23-2014 |
20140338391 | MULTI-STAGE EVAPORATIVE HEAT REJECTION PROCESS CYCLE THAT FACILITATES PROCESS COOLING EFFICIENCY, WATER PRODUCTION, AND/OR WATER RECLAMATION FOR FLUID COOLERS AND COOLING TOWERS - An evaporative heat rejection cycle for cooling a heat load is presented, including an environmental pre-cooling primary evaporator, an environmental pre-cooling secondary evaporator, a pre-cooled evaporative heat rejection cycle section in thermal communication with a heat load, and a primary pre-cooling evaporative heat exchanger in thermal communication with air that is drawn into thermal communication with a primary evaporator cycle, to enable heat transfer and moisture elimination from the air to a first fluid, where a portion of the first fluid evaporates and absorbs heat and condenses moisture from the air. | 11-20-2014 |
20150176865 | COOLING SYSTEMS AND METHODS USING TWO COOLING CIRCUITS - The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio. | 06-25-2015 |
20150181770 | AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS - An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil. | 06-25-2015 |
20150192345 | COOLING SYSTEMS AND METHODS USING TWO CIRCUITS WITH WATER FLOW IN SERIES AND COUNTER FLOW ARRANGEMENT - The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio. | 07-09-2015 |
20150195958 | MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME - A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space. | 07-09-2015 |
20150211769 | COOLING SYSTEMS AND METHODS INCORPORATING A PLURAL IN-SERIES PUMPED LIQUID REFRIGERANT TRIM EVAPORATOR CYCLE - The cooling systems and methods of the present disclosure relate to a plural in-series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to incrementally further cool the air intake flow through the second evaporator coil when the temperature of the free-cooled first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature. | 07-30-2015 |