Patent application number | Description | Published |
20090107616 | MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - Provided is a manufacturing method of a multi-layer ceramic substrate. The manufacturing method includes preparing an unsintered ceramic laminated body with a cavity, mounting a chip device within the cavity, filling the cavity, in which the chip device is mounted, with a ceramic slurry, attaching a constrained layer on top and/or bottom of the ceramic laminated body, and firing the ceramic laminated body. Accordingly, since the deformation of the cavity is prevented during the firing of the ceramic laminated body, the dimension precision and reliability of the multi-layer ceramic substrate can be improved. | 04-30-2009 |
20090114433 | MULTI-LAYERED CERAMIC BOARD AND METHOD OF MANUFACTURING THE SAME - There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature. | 05-07-2009 |
20090114434 | METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME - There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste. | 05-07-2009 |
20090117290 | METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE - In a method of manufacturing a non-shrinkage ceramic substrate, a ceramic laminated structure, which is formed of a plurality of laminated green sheets each having an interconnecting pattern and has an external electrode formed on at least one of a top and bottom thereof, is prepared. A metal layer is formed to cover at least a portion of the external electrode. A constraining green sheet is disposed on at least one of the top and bottom of the ceramic laminated structure to suppress a planar shrinkage of the green sheets. The ceramic laminated structure is fired at the firing temperature of the green sheets to oxidize the metal layer. The constraining green sheet and a metal oxide layer, which is formed by oxidizing the metal layer, are removed. Accordingly, an electrode post-firing process can be omitted and the adhering strength between the electrode and the ceramic laminated structure can be increased. | 05-07-2009 |
20090133805 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - There is provided a method of manufacturing a multilayer ceramic substrate that can be easily performed with high efficiency at low cost without affecting the performance of a multilayer ceramic substrate. A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: printing a cutting region onto at least one of a plurality of ceramic green sheets when the plurality of ceramic green sheets are laminated to form the ceramic laminate; firing the ceramic laminate; and cutting the fired ceramic laminate along the cutting region. | 05-28-2009 |
20090135542 | GLASS COMPOSITION, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME - Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi | 05-28-2009 |
20090148667 | Method of manufacturing ceramic laminated substrate and ceramic laminated substrate manufactured using the same - There are provided a method of manufacturing a ceramic laminated substrate in which the ceramic laminated substrate, with a cavity formed therein, can be manufactured by constrained sintering without undergoing deformation of the cavity, and a ceramic laminated substrate manufactured using the same. | 06-11-2009 |
20090159179 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: manufacturing a ceramic laminate including a glass component; laminating constraining layers on upper and lower parts of the ceramic laminate; performing primary firing within a first temperature range that does not allow crystallization of the glass component included in the ceramic laminate; removing the constraining layers and forming an external electrode on the ceramic laminate after the primary firing is completed; and performing secondary firing of the ceramic laminate having the external electrode formed thereon within a second temperature range higher than the first temperature range. | 06-25-2009 |
20100101701 | METHOD OF MANUFACTURING NON-SHRINKING MULTILAYER CERAMIC SUBSTRATE - Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate. | 04-29-2010 |
20100101702 | METHOD OF MANUFACTURING MULTILAYER CERAMIC SUBSTRATE - Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets. | 04-29-2010 |
20110034606 | COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME - Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature. | 02-10-2011 |
20120037588 | Piezoelectric sealing cap and assembly including the same - Disclosed herein is a piezoelectric sealing cap, including: a piezoelectric element generating displacement by a driving voltage; and a sealing part formed to surround the piezoelectric element and sealing a bottle neck when the piezoelectric element is inserted into the bottle neck. | 02-16-2012 |
20120038470 | Haptic feedback device and electronic device having the same - There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator. | 02-16-2012 |
20120038471 | Haptic feedback actuator, haptic feedback device and electronic device - There is provided a haptic feedback actuator, a haptic feedback device and an electronic device. The haptic feedback actuator includes a support plate disposed in a lower portion of a haptic device; one or more actuators disposed on the support plate, each having one end towards a central portion of the support plate and the other end towards a corner of the support plate, and generating vibrations so as to give different types of haptic feedback according to a change in contact pressure applied to the haptic device; and one or more dividing portions, each penetrating the support plate in a thickness direction thereof and dividing the support plate into vibration areas corresponding to the respective actuators. | 02-16-2012 |
20120038969 | ELECTRONIC PAPER DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes. | 02-16-2012 |
20120112607 | CERAMIC COMPOSITION FOR PIEZOELECTRIC ACTUATOR AND PIEZOELECTRIC ACTUATOR INCLUDING THE SAME - Disclosed are a ceramic composition for a piezoelectric actuator and a piezoelectric actuator including the same. The ceramic composition for a piezoelectric actuator includes piezoelectric ceramic powder expressed by a chemical formula, (1−x)Pb(Zr | 05-10-2012 |
20120169183 | CERAMIC COMPOSITION FOR PIEZOELECTRIC ACTUATOR AND METHOD OF MANUFACTURING THE SAME, AND PIEZOELECTRIC ACTUATOR MANUFACTURED BY USING THE SAME - There are provided a ceramic composition for a piezoelectric actuator allowing for low-temperature sintering and a method of manufacturing the same, and a piezoelectric actuator. A Cuo powder and an MnO powder as an sintring additive are added to a PZT-PZN piezoelectric ceramic powder to allow low-temperature sintering at a temperature of 950° C. or lower, and the usage of high-priced palladium (Pd) used as materials for high-temperature inner electrodes is decreased due to lowering of the sintering temperature, and thereby to achieve cost reduction. | 07-05-2012 |
20130134835 | ULTRASONIC SENSOR AND MANUFACTURING METHOD THEREOF - There is provided an ultrasonic sensor including: a piezoelectric vibration element; and a capacitor integrally formed with the piezoelectric vibration element. | 05-30-2013 |