Patent application number | Description | Published |
20080217637 | Light Emitting Diode and Method of Fabricating the Same - The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip. | 09-11-2008 |
20080231214 | LIGHT EMITTING DEVICE HAVING VARIOUS COLOR TEMPERATURE - A light emitting device capable of emitting light having various color temperatures is disclosed. The light emitting device includes a first light emitting part emitting a daylight color having a color temperature of 6000 K or more, a second light emitting part emitting white light having a color temperature less than 6000 K, and a third light emitting part emitting light in a visible range of 580 nm or more. The second and third light emitting parts are operable independently of the first light emitting part, and realize a warm white color having a color temperature of 3000 K or less with the white light emitted from the second light emitting part and the light emitted from the third light emitting part. The light emitting device realizes white light of various spectra and color temperatures corresponding to desired mood and utility. The light emitting device is controlled to emit light having a suitable wavelength or a suitable color temperature depending on the circadian rhythm of human, thereby enabling improvement of the user's health. | 09-25-2008 |
20080237624 | LED PACKAGE WITH METAL PCB - The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. | 10-02-2008 |
20090001393 | MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. | 01-01-2009 |
20100045154 | LIGHT EMITTING DEVICE - The disclosed light emitting device comprises at least one first light emitting element including at least one light emitting chip for emitting light having a wavelength of 400 to 500 nm and a phosphor; and at least one second light emitting element disposed adjacent to the first light emitting element to emit light having a wavelength of 560 to 880 nm. | 02-25-2010 |
20100065876 | LED PACKAGE WITH METAL PCB - The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns. | 03-18-2010 |
20100072506 | ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE - An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip. | 03-25-2010 |
20100202131 | LED PACKAGE AND BACK LIGHT UNIT USING THE SAME - Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant. | 08-12-2010 |
20110181196 | DIMMER FOR A LIGHT EMITTING DEVICE - Exemplary embodiments of the present invention relate to a dimmer for a light emitting device using an alternating (AC) voltage source. The dimmer includes a switch to be switched in response to a switching control signal and to deliver an AC voltage of an AC voltage source to the light emitting device, a current detector to detect an electric current to be provided to the light emitting device and to output a current detection signal, and a controller to output the switching control signal in response to a dimming control signal and the current detection signal. | 07-28-2011 |
20110193111 | MULTI-LIGHT EMITTING DIODE PACKAGE - A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. | 08-11-2011 |
20110279047 | AC LIGHT EMITTING DEVICE, DRIVING DEVICE THEREOF, AND DRIVING METHOD THEREBY - An AC light emitting device, a driving device thereof and a driving method are disclosed. The driving device includes a sub-driving part turned on corresponding to each of positive and negative voltage regions of an AC voltage source to provide current paths for operating at least two LEDs, and a free-charge part charging with a voltage to be supplied to one of the at least two LEDs which is not operated while the other LED is operated by the sub-driving part. The AC light emitting device, the driving device thereof and the driving method thereby can solve problems, such as a decrease in power factor, severe total harmonic distortion, excessive flickering, and the like, due to operating characteristics of the AC light emitting device by application of an AC voltage source thereto. | 11-17-2011 |
20120032223 | ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE - An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip. | 02-09-2012 |
20120056217 | LIGHT EMITTING DIODE PACKAGE - Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 03-08-2012 |
20120139444 | LIGHT EMITTING DEVICE - The disclosed light emitting device comprises at least one first light emitting element including at least one light emitting chip for emitting light having a wavelength of 400 to 500 nm and a phosphor; and at least one second light emitting element disposed adjacent to the first light emitting element to emit light having a wavelength of 560 to 880 nm. | 06-07-2012 |
20140061706 | ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE - An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip. | 03-06-2014 |
20140312380 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 10-23-2014 |