Patent application number | Description | Published |
20080217515 | ILLUMINANCE DETECTION APPARATUS AND SENSOR MODULE - A silicon substrate is used as a substrate body of a wiring substrate and also, plural light receiving elements for outputting a detection signal according to illuminance of light at the time of receiving light applied from the outside, an amplification circuit element for amplifying the detection signal outputted by the light receiving elements, a changeover switch element for performing switching as to whether or not the light receiving element is electrically connected to the amplification circuit element, and a resistor and a capacitor electrically connected to the amplification circuit element are disposed on the wiring substrate. | 09-11-2008 |
20080217522 | ILLUMINANCE DETECTING COMPONENT AND ILLUMINANCE DETECTING APPARATUS - An illuminance detecting component includes: a supporting substrate including a substrate body made of silicon, and pads provided on an upper surface of the substrate body; a plurality of light receiving elements connected electrically to the pads and receiving light irradiated from an outside, the plurality of light receiving elements being arranged in array fashion on the upper surface side; external connection terminals connected electrically to the light receiving elements; and a translucent member provided on the substrate body. In the illuminance detecting component, an airtight space in which the plurality of light receiving elements are accommodated is formed between the translucent member and the substrate body. | 09-11-2008 |
20080259585 | ELECTRONIC APPARATUS - An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the antenna. | 10-23-2008 |
20090029506 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - In a method of manufacturing a semiconductor device | 01-29-2009 |
20090121334 | MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A required number of wiring layers | 05-14-2009 |
20090166811 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device has a semiconductor chip and through electrodes formed passing through the semiconductor chip. A ground layer connected to the through electrode and a patch antenna connected to the through electrode are provided through an inorganic insulating layer formed of SiO | 07-02-2009 |
20090168367 | ELECTRONIC APPARATUS - An electronic apparatus includes an electronic element | 07-02-2009 |
20090267221 | SEMICONDUCTOR DEVICE - An antenna formed on one surface side of a silicon substrate and a semiconductor element provided on the other surface side of the silicon substrate are electrically connected to each other by means of a through via penetrating the silicon substrate. A wiring board is formed separately from the silicon substrate. A passive element is provided on one surface side of the wiring board. A copper core solder ball is provided between the one surface side of the wiring board and the other surface side of the silicon substrate and electrically connects the silicon substrate and the wiring board to each other. | 10-29-2009 |
20100308941 | HIGH-FREQUENCY LINE STRUCTURE ON RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A high-frequency line structure includes a multi-layered resin substrate in which insulating layers of a resin are laminated. A high-frequency-signal input part is arranged on the resin substrate to input a high-frequency signal and supply the high-frequency signal to the resin substrate. A high-frequency-signal output part is arranged in the resin substrate to receive the high-frequency signal from the input part and output the received high-frequency signal. A first metal layer is arranged to encircle the input and output pads and electrically insulated from the input and output parts. A second metal layer is arranged on the resin substrate. A plurality of penetration vias are arranged in the resin substrate to encircle the input part and the output part, and each penetration via being connected to the first and second metal layers. | 12-09-2010 |
20130062754 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a rectangular plane shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a rectangular plane shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode. | 03-14-2013 |
20130062778 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a flat-plate shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a flat-plate shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a first signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode. | 03-14-2013 |
20140209366 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers. | 07-31-2014 |
20140210082 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a first board; a second board joined to the first board; a connection terminal provided between the first board and the second board and electrically connecting the first board and the second board; and an electronic component on at least one of the first board and the second board. The connection terminal serves as an antenna. | 07-31-2014 |