Patent application number | Description | Published |
20080216990 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device comprises at least two heat pipes ( | 09-11-2008 |
20080236798 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a base ( | 10-02-2008 |
20080289798 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device. | 11-27-2008 |
20090000768 | HEAT DISSIPATION DEVICE - A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set. | 01-01-2009 |
20090008065 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set. | 01-08-2009 |
20090016023 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe. | 01-15-2009 |
20090107653 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set. | 04-30-2009 |
20090236076 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof. | 09-24-2009 |