Patent application number | Description | Published |
20090104466 | RUBBER-REINFORCED RESIN, ANTI-STATIC RESIN COMPOSITION, MOLDED ARTICLE AND LAMINATE - The objective of the present invention is to provide a rubber-reinforced resin which, when formed into a molded article, can prevent contamination or soiling of an article contacted with the molded article or a device on the periphery of the molded article and is excellent in impact resistance and transparency, and an anti-static resin composition which is excellent in impact resistance and anti-static properties. The present rubber-reinforced resin comprises a rubber-reinforced copolymeric resin produced by polymerization of 20 to 95 parts by mass of monomer components comprising methyl methacrylate, an aromatic vinyl compound and a cyanidated vinyl compound in the presence of a rubbery polymer having a predetermined volume-average particle diameter, or comprises a mixture of the rubber-reinforced copolymeric resin and a copolymer of the above-mentioned monomer components. Additionally, the present anti-static resin composition comprises the above-mentioned rubber-reinforced resin and a polymer type anti-static agent, wherein the rubbery polymer is contained in an amount from 5% to 40% by mass. In each of the rubber-reinforced resin and the anti-static resin composition, the total amount of substances detected at a retention time of 10 to 24 minutes is 20,000 μg or less per gram of the sample as determined by pyrolysis GC analysis. | 04-23-2009 |
20100016507 | THERMOPLASTIC RESIN, PROCESS FOR PRODUCTION OF THE SAME, AND MOLDED ARTICLE MANUFACTURED FROM THE SAME - The objective of the present invention is to provide a thermoplastic resin capable of producing a thin-walled article such as a film, a sheet and a bag stably by extrusion such as calender molding, and of leading to a thin-walled article wherein an undesirable phenomenon due to flow marks generated on the surface is improved and which is excellent in whitening resistance upon bending, and the like, and a method for the production thereof, a molded article and a composite article comprising thereof. The present thermoplastic resin comprises an acryl-based rubbery polymer reinforced resin having a graft ratio of 80% to 170%, a number-average particle diameter of an acryl-based rubbery polymer of 60 to 150 nm, an intrinsic viscosity of a component dissolved by acetonitrile of 0.4 to 0.8 dl/g, a content of a bound cyanidated vinyl compound in the component dissolved by acetonitrile of 20% to 30% by mass, and standard deviation of a distribution of the content of a bound cyanidated vinyl compound measured using liquid chromatography is 5 or less. | 01-21-2010 |
20100189975 | LAYERED PRODUCT - A layered product is provided which is excellent in heat resistance, difficult to hydrolyze and excellent in weatherability, and has such flexibility that it can hardly crack even when folded, and further is prevented from curling, and thus is excellent in processability, productivity and handleability. The layered product comprises a base layer made of a thermoplastic resin (I) having a glass transition temperature of 120° C. or higher, the base layer being layered on at least one side thereof with a layer made of an aromatic vinyl resin (II) having a lower glass transition temperature than the thermoplastic resin (I). The aromatic vinyl resin (II) is preferably a rubber-reinforced aromatic vinyl resin which contains a rubber-like polymer (a) selected from ethylene-α-olefin rubbers, hydrogenated conjugated diene rubbers, acrylic rubbers, silicone rubbers and silicone/acrylic composite rubbers in an amount of 5-40 parts by mass. The difference in glass transition temperature between the thermoplastic resin (I) and the aromatic vinyl resin (II) is preferably 10° C. or more. | 07-29-2010 |
20110039080 | PRINTING FILM AND FACE MATERIAL - The present invention provides a resin film which is excellent in various properties such as heat resistance, printability, mechanical strength, moisture absorption resistance, film-forming property and flexibility and can be suitably used in the printing applications. There is provided a printing film obtained by molding a thermoplastic resin composition (I) comprising 100 parts by mass in total of a mixed resin comprising 25 to 75% by mass of a rubber-modified styrene-based resin (A) and 25 to 75% by mass of a polyamide-based resin (B). The component (A) comprises a graft copolymer obtained by polymerizing a vinyl-based monomer in the presence of a rubber polymer, or a mixture comprising the graft copolymer and a (co)polymer of the vinyl-based monomer. The vinyl-based monomer comprises an aromatic vinyl compound and a cyanided vinyl compound, and further comprises a functional group-containing vinyl-based monomer in an amount of 0.1 to 1.2% by mass based on the component (A) in which an acetone-soluble component in the component (A) has an intrinsic viscosity of 0.15 to 1.5 dL/g (as measured at 30° C. in methyl ethyl ketone). The composition (I) comprises the rubber polymer in an amount of 5 to 30 parts by mass based on 100 parts by mass of the composition. | 02-17-2011 |
20110043901 | INFRARED REFLECTIVE LAMINATE - This invention provides an infrared reflective layered product, particularly a back sheet for solar cells, which, even when it has a black colored or chromatically colored appearance, can reflect infrared radiation with certain wavelengths to prevent heat accumulation and, at the same time, has excellent heat resistance. The infrared reflective layered product comprises the following layer (B) as a base layer, the following layer (A) layered on one side of the layer (B), and the following layer (C) layered on the other side of the layer (B).
| 02-24-2011 |
20110300373 | MOLDING MATERIAL AND MOLDED ARTICLE FOR LASER FUSION - A molding material and a molded article for laser welding are provided, which comprise a thermoplastic resin (A) comprising a rubber-reinforced resin (A | 12-08-2011 |
20130037098 | INFRARED REFLECTIVE LAMINATE - The infrared reflective layered product can reflect infrared radiation with certain wavelengths to prevent heat accumulation and, at the same time, has excellent heat resistance. The infrared reflective layered product comprises a layer (B) as a base layer, a layer (A) layered on one side of the layer (B), and a layer (C) layered on the other side of the layer (B). | 02-14-2013 |
Patent application number | Description | Published |
20120063129 | LAMP DESIGNED TO USE SOLID-STATE LIGHT EMITTING DEVICE AS LIGHT SOURCE - Provided is a lamp designed to use as a light source a solid-state light emitting device with a simple and inexpensive structure and having an improved heat dissipation performance. A lamp uses a solid-state light emitting device as a light source. A cap is mounted to an external apparatus at the time of use. A housing is made of a translucent material and is connected to the cap. A light-emitting module includes one or a plurality of solid-state light emitting devices and is mounted such that the main-light-emission side (lower side in FIG. | 03-15-2012 |
20120319555 | LED LIGHT SOURCE LAMP - An LED light source lamp has built-in drive circuits in a housing, and is used by being attached to a lamp holder. An LED installation plate is arranged, in a main space of the housing, on an attachment side to the lamp holder. An LED module on a surface, of the LED installation plate, opposite to the lamp holder, is a collection of LEDs driven by the drive circuit. A light diffusion member is arranged so as to block the optical axis of light emitted by each LED of the LED module. Here, the drive circuits are arranged in an outer peripheral space, between the LED module and the light diffusion member, so as not to block the optical axis of light emitted by each LED of the LED module. | 12-20-2012 |
20130249381 | LIGHT BULB SHAPED LAMP AND LIGHTING APPARATUS - A light bulb shaped lamp includes: an LED module including: a base mount; and a semiconductor light-emitting device mounted on the base mount; and lead wires for supplying power to the LED module. The base mount is supported by the lead wires. | 09-26-2013 |
20140071690 | LED LIGHT SOURCE LAMP HAVING DRIVE CIRCUIT ARRANGED IN OUTER PERIPHERY OF LED LIGHT SOURCE - An LED light source lamp includes a housing configured to be attached to a lamp holder; an LED module provided in the housing; a drive circuit provided in the housing and configured to drive the LED module to cause the LED module to emit light; an LED installation plate on which the LED module is installed; a cover arranged to block an optical axis of the LED module and configured to transmit light emitted from the LED module; and a separation member configured to separate the drive circuit from a space between the LED module and the cover in the housing. The LED installation plate has a rear surface, opposite the surface on which the LED module is installed. The rear surface is configured to closely contact the lamp holder, and is a part of the housing. | 03-13-2014 |
20140152177 | LAMP - In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount. | 06-05-2014 |
20150109778 | LIGHT-EMITTING APPARATUS, ILLUMINATION LIGHT SOURCE, AND LIGHTING APPARATUS - A light-emitting apparatus includes a pedestal, a substrate, an LED, an optical component, and a fastener. The LED is mounted on the substrate, and the substrate includes a first through-hole. The substrate is disposed on the pedestal. The optical component is disposed in the emission direction of light from the LED. The fastener passes through the first through-hole and fastens the optical component to the pedestal. A portion of the pedestal or a portion of the optical component is inserted in the first through-hole. | 04-23-2015 |