Yong Kuk
Yong Kuk Cho, Busan-Si KR
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20140318125 | APPARATUS FOR GENERATING SUPERHEATED VAPOR USING WASTE HEAT RECOVERY - An apparatus for generating superheated vapor using waste heat recovery. The apparatus includes a housing having inlet and outlet tanks at both ends through which exhaust gas is introduced and discharged. A plurality of exhaust gas tubes are disposed inside the housing so as to be spaced apart from each other at predetermined distances in a top-bottom direction. A plurality of working fluid tubes alternate with the plurality of wave fin structures. Inlet and outlet pipes through which working fluid is introduced and discharged are disposed on a side surface of the housing. The inlet pipe and the outlet pipe are connected to the plurality of working fluid tubes so as to communicate each of the plurality of working fluid tubes. An upper surface and a lower surface of each of the plurality of working fluid tubes directly adjoin to the adjacent exhaust gas tubes. | 10-30-2014 |
20140352302 | APPARATUS FOR GENERATING SUPERHEATED VAPOR USING WAVE FIN - An apparatus for generating superheated vapor using waste heat recovery. A housing has an inlet tank and an outlet tank at both ends. Exhaust gas is introduced through the inlet tank, and is discharged through the outlet tank. A plurality of wave fin structures are disposed inside the housing so as to be spaced apart from each other at predetermined distances in a top-bottom direction, and include a plurality of peaks and a plurality of valleys which are connected in a transverse direction so as to form wave-like structures in a direction in which the exhaust gas flows. A plurality of working fluid tubes alternate with the plurality of wave fin structures. An inlet pipe through which working fluid is introduced and an outlet pipe through which the working fluid is discharged are disposed on a side surface of the housing. | 12-04-2014 |
20140360707 | WAVE FINS - Wave fins which are disposed inside a heat exchanger housing of a heat exchanger in order to cause a turbulent flow of fluid through direct contact with the fluid. The wave fins include a plurality of hills, a plurality of valleys and a plurality of sidewalls. The hills and valleys are connected to each other via the plurality of sidewalls. The sidewalls partition fluid passages between the hills and the valleys through which fluid passes. The hills, the valleys and the sidewalls form main waveforms that extend in a longitudinal direction so as to be waved in a first radius of curvature. One or more bent portions are formed on intermediate portions of the main waveforms, the bent portions being connected to remaining portions of the main waveforms so as to be bent at a second radius of curvature. | 12-11-2014 |
Yong Kuk Kang, Seongnam KR
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20160065613 | SYSTEM AND METHOD FOR DETECTING MALICIOUS CODE BASED ON WEB - A system and method for detecting malicious code based on the Web are disclosed herein. The system includes a Uniform Resource Locator (URL) collection unit, a data crawling unit, a malicious code candidate extraction unit, and a secure pattern filtering unit. The URL collection unit collects and stores the URL information of a web server. The data crawling unit crawls and stores the contents data of a website. The malicious code candidate extraction unit detects a pattern, matching previously stored malicious pattern information, in the stored data, and extracts an event including the detected pattern as a malicious code candidate. The secure pattern filtering unit detects a pattern, matching previously stored secure pattern information known as being secure, in the extracted malicious code candidate, filters out the event including the detected pattern from the extracted malicious code candidate, and outputs a remaining malicious code candidate as malicious code. | 03-03-2016 |
Yong Kuk Kim, Gyeonggi-Do KR
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20090193721 | ABRASIVE PARTICLES, METHOD OF MANUFACTURING THE ABRASIVE PARTICLES, AND METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY - Disclosed are abrasive particles, a method for manufacturing the abrasive particles, and a method for manufacturing a Chemical Mechanical Polishing (CMP) slurry. The method for manufacturing abrasive particles for the CMP slurry includes preparing a raw material precursor, drying the raw material precursor, and calcining the dried raw material precursor using a calcination furnace where a gas atmosphere having relatively less oxygen in comparison with an air atmosphere is created. | 08-06-2009 |
Yong Kuk Kim, Seoul KR
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20090100765 | POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATE - Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a barrier film in a shallow trench isolation CMP process needed to fabricate ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 μm or less) and which decreases the occurrence of scratches on a flattened surface, and a method of polishing a substrate using the same. | 04-23-2009 |
20090133336 | POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATE - Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a barrier film in a shallow trench isolation CMP process needed to fabricate ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 μm or less) and which decreases the occurrence of scratches on a flattened surface, and a method of polishing a substrate using the same. | 05-28-2009 |
Yong Kuk Kim, Uiwang-Si KR
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20130171823 | CMP Slurry Composition and Polishing Method Using the Same - A CMP slurry composition includes metal oxide particles, a diisocyanate compound, and deionized water. The CMP slurry composition is capable of selectively controlling polishing speed of a wafer surface having a convex portion and a concave portion, such that primary polishing and secondary polishing can be performed rapidly while stopping polishing of the nitride layer upon the secondary polishing. | 07-04-2013 |
Yong Kuk Park, Gyeonggi-Do KR
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20100054369 | FILTER TUNING CIRCUIT FOR WIRELESS COMMUNICATION SYSTEM - A filter tuning circuit for a wireless communication system is provided. A filter tuning circuit includes a comparator and a counter which control a transconvertance value of a differential transconverter to tune a filter. | 03-04-2010 |