Spehar
Christophe Spehar, Ronquieres BE
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20140370238 | System for Forming a Vegetative Textile Element - The present invention relates to a system for forming a vegetative textile element comprising a first impermeable layer having a back face and a front face, a second layer comprising a synthetic felt provided with a water retention capacity and having a back face and a front face, said back face of said second layer facing said front face of said first impermeable layer and a third layer of synthetic polymer having openings as well as a back face and a front face, said back face of said third layer facing said front face of said second layer comprising a synthetic felt. | 12-18-2014 |
James Spehar, Chandler, AZ US
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20140247720 | SIGNAL PATH ISOLATION FOR CONDUCTIVE CIRCUIT PATHS AND MULTIPURPOSE INTERFACES - A device can be configured to provide isolation between conductive circuit paths and to selectively connect one of the conductive circuit paths to a shared interface. Each conductive circuit path can include driver circuitry designed to transmit signals according to a particular protocol and a corresponding signal speed. The shared interface can be, in one instance, a connector designed for connection to other devices. The other devices can be configured to communicate over the shared interface using one or more of the particular protocols provided using the different circuit paths. | 09-04-2014 |
20140268445 | CROSS TALK MITIGATION - Cross-talk is mitigated in a switching circuit. In accordance with one or more embodiments, an apparatus includes a multi-pin connector having signal-carrying electrodes that communicate with a device external to the apparatus, and respective field-effect switches that couple the signal-carrying electrodes to respective communication channels in the apparatus. The switches include a first field-effect semiconductor switch having a gate electrode adjacent a channel region that connects electrodes (e.g., source and drain regions) when a threshold switching voltage is applied to the gate, in which the electrodes are connected between one of the signal-carrying electrodes and a first channel coupled to an electrostatic discharge (ESD) circuit. A bias circuit mitigates cross-talk between the communication channels by biasing the channel region of the first field-effect semiconductor switch (in an off state) to boost the threshold switching voltage over a threshold discharge voltage of the ESD circuit. | 09-18-2014 |
James Raymond Spehar, Chandler, AZ US
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20110057302 | IMPEDANCE OPTIMIZED CHIP SYSTEM - A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips. | 03-10-2011 |
20120137025 | Communication Bus with Shared Pin Set - Bus communications are effected. In accordance with one or more example embodiments, a bus circuit is configured for communicating data in accordance with a main protocol (e.g., as a default), and for communicating with an alternate protocol when signals corresponding to the main protocol are not present. In some implementations, a sense circuit is used with input pins to sense a type of signal for bus communications, and to control communications on the bus with a protocol appropriate for the sensed signals, and for a main protocol when main protocol signals are sensed (e.g., for a default bus operation, or for test operation). | 05-31-2012 |
20120137031 | COMMUNICATION BUS WITH SHARED PIN SET - Bus communications are effected. In accordance with one or more example embodiments, a bus circuit is configured for communicating data in accordance with a main protocol (e.g., as a default), and for communicating with an alternate protocol when signals corresponding to the main protocol are not present. In some implementations, a sense circuit is used with input pins to sense a type of signal for bus communications, and to control communications on the bus with a protocol appropriate for the sensed signals, and for a main protocol when main protocol signals are sensed (e.g., for a default bus operation, or for test operation). | 05-31-2012 |
20120286588 | MEMS SWITCHING CIRCUIT - A switching circuit employs MEMS devices. In connection with various example embodiments, signal switching circuit couples primary and secondary data link connectors having at least two channels and an electrode for each channel. A MEMS switch is coupled to each channel in of the secondary data link connectors, and includes a suspended membrane, first and second contact electrodes (one being in the membrane) and a biasing circuit that biases the membrane for moving the membrane between open and closed positions to contact the electrodes. A switch controller circuit selectively controls the application of an actuation voltage to each of the biasing circuits, thereby selectively actuating the membranes between the open and closed positions for routing signals between the primary and secondary data link connectors. | 11-15-2012 |
20120286846 | SWITCHING CIRCUIT - A switching circuit employs switches operating at low on resistance and high off capacitance. In connection with various example embodiments, a switching circuit selectively couples a communication port to one of two or more internal circuits based upon a type of input at the communication port. A sensor circuit senses the type of the input and, based upon the sensed input type, actuates one or more switches in the switching circuit. | 11-15-2012 |
20130268909 | IMPEDANCE OPTIMIZED CHIP SYSTEM - A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips. | 10-10-2013 |
Jean Marc Spehar, Lambres Iez Douai FR
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20090087671 | COATING COMPOSITIONS EXHIBITING CORROSION RESISTANCE PROPERTIES AND METHODS OF COIL COATING - Disclosed are coating compositions exhibiting corrosion resistance properties. These compositions include a non-chrome corrosion resisting filler and a radiation curable film-forming binder comprising an unsaturated monomer comprising a nitrogen-containing cyclic structure and one ethylenically unsaturated double bond. Also disclosed are methods for roll coating a metal coil. | 04-02-2009 |
Jim R. Spehar, Chandler, AZ US
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20140009001 | DIFFERENTIAL RETURN LOSS SUPPORTING HIGH SPEED BUS INTERFACES - Various aspects of the present disclosure are directed toward methods and apparatus that include a lead frame with a fixed external pin pitch. A differential signal path is provided that is characterized by bond-pad pitch range, wire length and wire diameter. The differential signal path carries signals in a frequency range between 5 GHz and 16.1 GHz with less than about 25 dB differential return loss (DDRL). Further, the signals are processed at a signal-processing node that is electrically coupled to the differential signal path by using the differential signal path to carry signals in a frequency range between 5 GHz and about 16.1 GHz. | 01-09-2014 |
Joseph C. Spehar, Springfield, VA US
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20150084324 | Ski Training Apparatus - A ski training apparatus includes a ski pole having proximal and distal ends. A first guide member is coupled to an upper surface of a respective ski worn by a ski trainee and includes a first receiver portion defining a first open interior area and an open top. A second guide member includes a cylindrical configuration defining open upper and lower ends and an open interior area. A spring connects the second guide member to the first guide member, the spring having a flexible configuration such that the second guide member is repositionable relative to the first guide member. The second guide member is configured to receive the distal end of the ski pole. The second guide member is operatively coupled to the first guide member by the spring such that the ski trainer is selectively in control of the trainee's ski by manipulation of the ski pole. | 03-26-2015 |
Peter T. Spehar, Seabrook, TX US
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20140107865 | SYSTEM, APPARATUS, AND METHOD FOR ACTIVE DEBRIS REMOVAL - Systems, apparatuses, and methods for removal of orbital debris are provided. In one embodiment, an apparatus includes a spacecraft control unit configured to guide and navigate the apparatus to a target. The apparatus also includes a dynamic object characterization unit configured to characterize movement, and a capture feature, of the target. The apparatus further includes a capture and release unit configured to capture a target and deorbit or release the target. The collection of these apparatuses is then employed as multiple, independent and individually operated vehicles launched from a single launch vehicle for the purpose of disposing of multiple debris objects. | 04-17-2014 |
Stefan Spehar, Rimbo SE
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20090098816 | AIR-HANDLING DEVICE - A method for handling air when distributing air inside an elongated vehicle includes supplying air to a roof air duct ( | 04-16-2009 |