Antol
John Antol, Nahant, MA US
Patent application number | Description | Published |
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20150294495 | ULTRASOUND IMAGE THREE-DIMENSIONAL (3D) PICTOGRAM - An ultrasound imaging system includes a transducer array with at least one transducer element. The system further includes an echo processor that processes ultrasound echo signals received by at least one transducer element, producing an image of scanned tissue of interest. The system further includes memory that stores a plurality of 3D pictogram, each representing different anatomical regions of a subject. The system further includes a pictogram processor that identifies a 3D pictogram of the plurality of 3D pictogram corresponding to the scanned tissue of interest. The 3D pictogram includes a 3D pictorial representation of an anatomical region including the scanned tissue of interest. The system further includes a display monitor. The system further includes a rendering engine that displays the image and the 3D pictogram via the display monitor. The 3D pictogram is overlaid over a pictogram region of the displayed image. | 10-15-2015 |
John Joseph Antol, Nahant, MA US
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20140276072 | DOPPLER ULTRASOUND IMAGING - An ultrasound imaging system includes a vector flow imaging processor that processes ultrasound data representing structure flowing through a tubular object and generates vector flow imaging information for a region of interest of the tubular object that is indicative of the structure flowing through a tubular object based thereon and processing circuitry that determines at least one parameter for Doppler imaging based on the vector flow imaging information. | 09-18-2014 |
Joze Eura Antol, Hamburg, PA US
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20090098687 | Integrated circuit package including wire bonds - It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 μm or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion. | 04-16-2009 |
20100022034 | Manufacture of devices including solder bumps - Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly. | 01-28-2010 |
Joze F. Antol, Hamburg, PA US
Patent application number | Description | Published |
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20100201000 | BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE - According to certain embodiments, integrated circuits are fabricated using brittle low-k dielectric material to reduce undesired capacitances between conductive structures. To avoid permanent damage to such dielectric material, bond pads are fabricated with support structures that shield the dielectric material from destructive forces during wire bonding. In one implementation, the support structure includes a passivation structure between the bond pad and the topmost metallization layer. In another implementation, the support structure includes metal features between the topmost metallization layer and the next-topmost metallization layer. In both cases, the region of the next-topmost metallization layer under the bond pad can have multiple metal lines corresponding to different signal routing paths. As such, restrictions on the use of the next-topmost metallization layer for routing purposes are reduced compared to prior-art bond-pad support structures that require the region of the next-topmost metallization layer under the bond pad to be a single metal structure. | 08-12-2010 |