Patent application number | Description | Published |
20090098297 | HEAT-TREATING APPARATUS, HEAT-TREATING METHOD AND STORAGE MEDIUM - A straightening plate provided in its central part with a gas exhaust opening is disposed under a face plate serving as a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate. The temperature-reducing purge ring has an outside diameter substantially equal to that of the straightening plate and is provided in its inner circumference with plural gas jetting holes. The temperature-reducing purge ring is disposed close to the face plate such that a thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes of the temperature-reducing purge ring, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Consequently, a large amount of air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas, so that the face plate can be rapidly cooled. | 04-16-2009 |
20110233187 | HEATING APPARATUS, HEATING METHOD, AND COMPUTER READABLE STORAGE MEDIUM - A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions. | 09-29-2011 |
20110236845 | HEAT PROCESSING APPARATUS AND HEAT PROCESSING METHOD - A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism. | 09-29-2011 |
20140014643 | Heating Device - A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted. | 01-16-2014 |
20140014644 | Heating Device - A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward. | 01-16-2014 |