Biviano
Micahel S. Biviano, State College, PA US
Patent application number | Description | Published |
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20090126495 | Ultrasonic Spectroscopic Method for Chemical Mechanical Planarization - A method of characterizing the surface of a CMP pad by directing an ultrasound pulse at the surface from an ultrasound transducer that is not in contact with the surface and observing the frequency spectrum of the reflected pulse which is indicative of properties of the surface. | 05-21-2009 |
Michael S. Biviano, State College, PA US
Patent application number | Description | Published |
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20090199641 | NON-CONTACT ULTRASOUND MATERIALS SYSTEMS AND MEASUREMENT TECHNIQUES - Apparatus for determining the speed of sound through a specimen comprises an ultrasound sending transducer, an ultrasound receiving transducer, a pair of laser distance sensors, a display device, a controller in communication with the ultrasound sending transducer, the ultrasound receiving transducer and the pair of laser distance sensors and the display device. The ultrasound sending transducer and one laser distance sensor are supported with a transducer surface in a first plane. The ultrasound receiving transducer and one last distance sensor are supported with a transducer surface in a second plane parallel with the first plane. A support for a specimen is provided between the first and second planes. The controller is programmed for gathering data from the ultrasound transducers and the laser distance sensors for calculating the speed of ultrasound in the specimen and displaying the results. | 08-13-2009 |
Vince Biviano, San Jose, CA US
Patent application number | Description | Published |
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20090095818 | Wireless Devices Including Printed Integrated Circuitry and Methods for Manufacturing and Using the Same - Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer. | 04-16-2009 |