Patent application number | Description | Published |
20090095448 | HEAT DISSIPATION DEVICE FOR LED CHIPS - A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips. | 04-16-2009 |
20090095959 | HEAT DISSIPATION DEVICE FOR LED CHIPS - A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips. | 04-16-2009 |
20090151905 | HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. | 06-18-2009 |
20090151906 | HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer. | 06-18-2009 |
20090155099 | PUMP FOR LIQUID COOLING SYSTEM - A pump includes a base ( | 06-18-2009 |
20090162225 | PUMP FOR LIQUID COOLING SYSTEM - A pump comprises a base ( | 06-25-2009 |
20090166003 | HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein. | 07-02-2009 |
20090166004 | HEAT PIPE - A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure. | 07-02-2009 |
20090166005 | VAPOR CHAMBER - A vapor chamber includes a base ( | 07-02-2009 |
20090166008 | HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof. | 07-02-2009 |
20090194254 | HEAT DISSIPATION DEVICE FOR LED LAMP - A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets. | 08-06-2009 |