Patent application number | Description | Published |
20090117731 | SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHOD FOR MAKING THE SAME - A semiconductor interconnection structure is manufactured as follows. First, a substrate with a first dielectric layer and a second dielectric layer is formed. Subsequently, an opening is formed in the second dielectric layer. A thin metal layer and a seed layer are formed in sequence on the surface of the second dielectric layer in the opening, wherein the metal layer comprises at least one metal species having phase segregation property of a second conductor. The wafer of the substrate is subjected to a thermal treatment, by which most of the metal species in the metal layer at a bottom of the opening is diffused to a top surface of the second conductor to form a metal-based oxide layer. Afterwards, the wafer is subjected to planarization, so as to remove the second conductor outside the opening. | 05-07-2009 |
20090218693 | LOW RESISTANCE HIGH RELIABILITY CONTACT VIA AND METAL LINE STRUCTURE FOR SEMICONDUCTOR DEVICE - A semiconductor contact structure includes a copper plug formed within a dual damascene, single damascene or other opening formed in a dielectric material and includes a composite barrier layer between the copper plug and the sidewalls and bottom of the opening. The composite barrier layer preferably includes an ALD TaN layer disposed on the bottom and along the sides of the opening although other suitable ALD layers may be used. A barrier material is disposed between the copper plug and the ALD layer. The barrier layer may be a Mn-based barrier layer, a Cr-based barrier layer, a V-based barrier layer, a Nb-based barrier layer, a Ti-based barrier layer, or other suitable barrier layers. | 09-03-2009 |
20100037219 | PREDICTIVE LOGIC FOR AUTOMATIC WEB FORM COMPLETION - A method, system, and computer program product for autonomously completing a web form based on preferences and conditions established by a user. A predictive logic autonomously completes a web form by determining a requested data type of one or more form objects in the web form. The predictive logic determines a form preference corresponding to an identifier of a selected form object and selects or inserts data of the form preference into the form object. The form preference may be predefined by a user and stored within a form preference database which contains data selections and/or insertions for specific form objects for web forms. The form preference may also specify conditions for triggering events or actions of a web browser. The predictive logic monitors user insertions of a web form and prompts a user to define additional form preferences. | 02-11-2010 |
20140021611 | Novel Copper Etch Scheme for Copper Interconnect Structure - The present disclosure is directed to a method of manufacturing an interconnect structure in which a low-k dielectric layer is formed over a semiconductor substrate followed by formation of a copper or copper alloy layer over the low-k dielectric layer. The copper or copper alloy layer is patterned and etched to form a copper body having recesses, which are then filled with a low-k dielectric material. The method allows for formation of a damascene structures without encountering the various problems presented by non-planar features and by porus low-K dielectric damage. | 01-23-2014 |
20140027908 | Integrated Circuit Interconnects and Methods of Making Same - A copper alloy layer is blanket deposited over a low k dielectric layer and in via openings within the low k dielectric layer. The blanket deposited layer is then anisotropically etch to form horizontal interconnects. The interconnects are annealed to form a metal oxide barrier lining. A second low k dielectric layer is then depositing over the horizontal interconnects. Air gaps can be formed between adjacent interconnects to lower parasitic capacitance therebetween. | 01-30-2014 |
20140084469 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A patterned dielectric layer with a plurality of openings is formed on the substrate. A barrier layer is deposited in the openings by a first tool and a sacrificing protection layer is deposited on the barrier layer by the first tool. The sacrificing layer is removed and a metal layer is deposited on the barrier layer by a second tool. | 03-27-2014 |
20140235049 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including a conductive feature formed in a first insulating material and a second insulating material disposed over the first insulating material. The second insulating material has an opening over the conductive feature. The method includes forming a graphene-based conductive layer over an exposed top surface of the conductive feature within the opening in the second conductive material, and forming a carbon-based adhesive layer over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is formed in the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer. | 08-21-2014 |
20140367857 | Method and Apparatus for Back End of Line Semiconductor Device Processing - Methods and apparatus are disclosed for the back end of line process for fabrication of integrated circuits (ICs). A barrier layer comprising a bottom part and a side part is formed within an opening for a metal contact, wherein the bottom part comprises a graphene material, the side part comprises an amorphous carbon material and covers a sidewall of the opening, and the bottom part and the side part are formed at a same time. A capping layer comprising a first part and a second part is formed on a dielectric layer and a metal contact, wherein the first part comprises a graphene material, the second part of the capping layer comprises an amorphous carbon material on the dielectric layer, and the first part and the second part are formed at a same time. | 12-18-2014 |
20150126030 | Method for Via Plating with Seed Layer - Presented herein is a method for plating comprising providing a substrate having a dielectric layer formed over a trace, and forming a via/trench opening extending through the dielectric layer, the via/trench opening exposing a surface of the trace. The method further comprises forming a seed layer in the via/trench opening and contacting the trace and forming a protection layer over the seed layer. The protection layer is removed and a conductive layer deposited on the seed layer in a single plating process step by applying a plating solution in the via/trench opening. | 05-07-2015 |
20150197849 | Semiconductor Device Metallization Systems and Methods - Semiconductor device metallization systems and methods are disclosed. In some embodiments, a metallization system for semiconductor devices includes a mainframe, and a plurality of modules disposed proximate the mainframe. One of the plurality of modules comprises a physical vapor deposition (PVD) module and one of the plurality of modules comprises an ultraviolet light (UV) cure module. | 07-16-2015 |
20150200164 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device comprises a workpiece including a conductive feature disposed in a first insulating material and a second insulating material disposed over the first insulating material, the second insulating material having an opening over the conductive feature. A graphene-based conductive layer is disposed over an exposed top surface of the conductive feature within the opening in the second insulating material. A carbon-based adhesive layer is disposed over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is disposed within the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer. | 07-16-2015 |
20150255334 | Method for Via Plating with Seed Layer - Presented herein is a method for plating comprising providing a substrate having a dielectric layer formed over a trace, and forming a via/trench opening extending through the dielectric layer, the via/trench opening exposing a surface of the trace. The method further comprises forming a seed layer in the via/trench opening and contacting the trace and forming a protection layer over the seed layer. The protection layer is removed and a conductive layer deposited on the seed layer in a single plating process step by applying a plating solution in the via/trench opening. | 09-10-2015 |
20150255389 | Integrated Circuit Interconnects and Methods of Making Same - A copper alloy layer is blanket deposited over a low k dielectric layer and in via openings within the low k dielectric layer. The blanket deposited layer is then anisotropically etch to form horizontal interconnects. The interconnects are annealed to form a metal oxide barrier lining. A second low k dielectric layer is then depositing over the horizontal interconnects. Air gaps can be formed between adjacent interconnects to lower parasitic capacitance therebetween. | 09-10-2015 |
20150270215 | VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER - The present disclosure relates to a metal interconnect layer formed using a pre-fill process to reduce voids, and an associated method. In some embodiments, the metal interconnect layer has a dielectric layer disposed over a substrate. An opening with an upper portion above a horizontal plane and a lower portion below the horizontal plane extends downwardly through the dielectric layer. A first conductive layer fills the lower portion of the opening. An upper barrier layer is disposed over the first conductive layer covering bottom and sidewall surfaces of the upper portion of the opening. A second conductive layer is disposed over the upper barrier layer filling the upper portion of the opening. | 09-24-2015 |
20150270225 | INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF - The present disclosure provides an interconnect structure, including a substrate, a first conductive feature over the substrate, a second conductive feature over the first conductive feature, and a dielectric layer surrounding the first conductive feature and the second conductive feature. A width of the first conductive feature and a width of the second conductive feature are between 10 nm and 50 nm. The present disclosure also provides a method for manufacturing an interconnect structure, including (1) forming a via opening and a line trench in a dielectric layer, (2) forming a 1-dimensional conductive feature in the via opening, (3) forming a conformal catalyst layer over a sidewall of the line trench, a bottom of the line trench, and a top of the 1-dimensional conductive feature, and (4) removing the conformal catalyst layer from the bottom of the line trench and the top of the 1-dimensional conductive feature. | 09-24-2015 |
20150325522 | INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a semiconductor comprises: providing a substrate; forming an opening in a dielectric layer disposed over the substrate; providing a target with a first type atoms; ionizing the first type atoms provided from the target; providing a bias to the substrate for controlling the moving paths of the ionized first type atoms thereby directing the ionized first type atoms in the opening; and forming a first conductive structure from bottom of the opening with the ionized first type atoms under a pre-determined frequency and a pre-determined pressure. | 11-12-2015 |
20160005648 | Method and Apparatus for Back End of Line Semiconductor Device Processing - A method of forming a device may include: forming an opening through a dielectric layer and an underlying etching stop layer to expose a metal line. The method may further include the step of catalytically growing a graphene layer on an exposed surface of the metal line, and depositing an amorphous carbon layer on sidewalls of the opening. The steps of catalytically growing the graphene layer and depositing the amorphous carbon layer may be performed simultaneously. | 01-07-2016 |
20160049373 | VIA PRE-FILL ON BACK-END-OF-THE-LINE INTERCONNECT LAYER - In some embodiments, the present disclosure relates to a conductive interconnect layer. The conductive interconnect layer has a dielectric layer disposed over a substrate. An opening with an upper portion above a horizontal plane and a lower portion below the horizontal plane extends downwardly through the dielectric layer. A first conductive layer fills the lower portion of the opening. An upper barrier layer is disposed over the first conductive layer covering bottom and sidewall surfaces of the upper portion of the opening. A second conductive layer is disposed over the upper barrier layer filling the upper portion of the opening. | 02-18-2016 |
Patent application number | Description | Published |
20140185600 | MOBILE ROUTER CAPABLE OF AUTOMATICALLY DETECTING NETWORK CONNECTION MODE AND PERFORMING NETWORK CONNECTION SETTING, AND METHOD THEREOF - The present invention is to provide a mobile router, which can connect with a network transmission device capable of wired or wireless networking (e.g., a modem provided by a network service provider, a wireless LAN access point, or a mobile communication access point) in a corresponding one of at least three network connection modes based on a wired Ethernet, a wireless Local Area Network and a wireless Wide Area Network, so as to transmit a network packet from a terminal device (e.g., a desktop computer, a laptop computer, or a mobile phone) to the Internet or vice versa through the network transmission device. The mobile router can automatically detect an applicable network connection mode and automatically apply network connection settings stored in a corresponding profile. If no such corresponding profile exists, the mobile router can automatically store the network connection settings manually input by the user as a profile. | 07-03-2014 |
20140192818 | NETWORK CONNECTION METHOD CAPABLE OF ANALYZING DATA PACKETS IN ORDER TO SELECT CONNECTION ROUTES - The present invention is to provide a network connection method applicable to a network system including a client device and a plurality of source devices, wherein the client device is connected to the Internet through a first connection route (e.g., a power-line network or a cable network) and a second connection route (e.g., a WiFi wireless network) respectively so as to establish a connection channel with each source device, and the client device is able to analyze a data packet received from the source device to determine whether the data packet contains highly delay-sensitive data (e.g., audio/video data and communication data) or delay-insensitive data (e.g., webpage data). When it is determined that the data packet contains highly delay-sensitive data, the data packet is transmitted to the client device through the first connection route which is more stable than the second connection route, otherwise, through the second connection route instead. | 07-10-2014 |
20140204775 | ROUTE SELECTION METHOD FOR USE WHERE PLURAL HETEROGENEOUS NETWORKS ARE AVAILABLE - The present invention is to provide a route selection method which is applicable to a network connection device capable of receiving or transmitting a network packet through at least two heterogeneous networks. Upon receiving the packet, the device performs route performance detection to obtain the current transmission delay rate of each of the heterogeneous networks, and then determines whether the packet is highly sensitive to transmission delay or has a re-transmission mechanism. When it is determined that the packet is highly sensitive to transmission delay or doesn't have the re-transmission mechanism, the device chooses from the plural heterogeneous networks the one with a relatively low transmission delay rate as the route through which to transmit the packet to the Internet; otherwise, the device chooses from the plural heterogeneous networks the one with a relatively high transmission delay rate as the route through which to transmit the packet to the Internet. | 07-24-2014 |
20140310383 | NETWORK SYNCHRONIZATION SYSTEM AND METHOD INVOLVING AUTOMATIC SETTING VIA PHYSICAL LINE - The present invention is to provide a network synchronization system, wherein a first network apparatus is connected to a physical line, stores a first profile at least including a Service Set Identifier (SSID), a pre-shared key and a channel, and can connect to the Internet according to the first profile and send out a detection message, and at least one second network apparatus is also connected to the physical line and can automatically generate a request message according to the detection message. When receiving the request message, the first network apparatus sends out the first profile in reply. Based on the first profile, the second network apparatus adds a second profile including the same SSID and pre-shared key but a different channel to itself, and then makes a seamless connection with the Internet through the physical line and the first network apparatus according to the second profile. | 10-16-2014 |
20140328417 | POWER LINE COMMUNICATION DEVICE SWITCHABLE BETWEEN NOISE DETECTING AND FILTERING FUNCTIONS - The present invention is to provide a PLC device, which includes a power receiving port connected to a power supply for receiving a power signal and a network signal carried by the power signal; a filtering unit having a first end connected to the power receiving port; a power output port connected to a second end of the filtering unit and a load, respectively, for supplying the power signal to the load while the filtering unit filters out noise generated in the power signal by the load; a switching unit having two connecting ends connecting to the first and second ends, respectively, and a control end switchable between the two connecting ends; and a processing unit connected to the control end and including a bridge module for receiving and then transmitting the network signal to a network apparatus, and a detection module for detecting the level of the noise. | 11-06-2014 |
20140358313 | METHOD FOR SELECTING OPTIMAL CENTRAL CONTROLLER IN POWER LINE NETWORK - The present invention is to provide a method for selecting the optimal central controller in a power line network, which is applicable to the power line network including at least one terminal device, at least one network device and a plurality of controllers. The controllers are respectively installed with a central controller evaluation and selection software and connected to the terminal device and/or network device, and can communicate with one other through power line. The method is performed by a central controller, that is determined by negotiation between the controllers, via the software and includes the steps of detecting and calculating the connected states of the controllers in the power line network; selecting the optimal controller according to the connected states, assigning the optimal controller as new central controller, and notifying the new central controller to the other controllers, so as to optimize the performance of the power line network. | 12-04-2014 |
20150055505 | SELECTION METHOD FOR RAPIDLY OBTAINING HOTSPOT INFORMATION - The present invention is to provide a selection method for rapidly obtaining hotspot information, which is applicable to a wireless communication system including at least one mobile terminal device capable of performing a site survey and transmitting a probe request, a plurality of wireless hotspot devices each capable of receiving the probe request, reading a terminal identifier in the probe request and sending the terminal identifier out, and a server of a telecommunication company capable of receiving the terminal identifier. After receiving the terminal identifier, the server compares the terminal identifier against user data in a user database and then sends a text message to the mobile terminal device when determining that the terminal identifier is already registered in the user database, wherein the text message includes SSID and password of a wireless hotspot device to which the mobile terminal device can currently choose to connect for interconnecting the Internet. | 02-26-2015 |
20150124889 | POWER LINE COMMUNICATION DEVICE WITH NOISE DETECTING AND FILTERING FUNCTIONS - The present invention is to provide a PLC device having noise detecting and filtering functions, which includes a power receiving port having one end connected to a power supply unit for receiving a power signal and a network signal; a noise filtering circuit having one end connected to the other end of the power receiving port for filtering noise of the power signal passing therethrough; a power output port connected between the other end of the noise filtering circuit and a load; a noise detecting circuit having two ends connected to a line between the first filtering unit and power receiving port and a line between the first filtering unit and power output port, respectively; and a processing unit connected to a line between the first filtering unit and power receiving port for receiving the network signal from the noise detecting circuit and transmitting the same to a network apparatus. | 05-07-2015 |
20150124890 | POWER LINE COMMUNICATION ADAPTER CAPABLE OF BEING FREELY ASSEMBLED BY ACCESSORIES THEREOF - The present invention is to provide a power line communication adapter capable of being freely assembled by accessories thereof, which includes an anti-noise device having a first male plug for receiving a power line communication signal from a power outlet, a first female socket for connecting the first male plug with an electrical equipment through a filter module, and a first adapting port connected to the first male plug, such that noise generated by the electrical equipment device can be filtered by the filter module without interfering the power line communication signal; and a power line communication device having a power line communication module along with a second adapting port connected thereto such that, when the first and second adapting ports are connected with each other, the power line communication device and the anti-noise device are combined into an anti-noise adapter for receiving and transmitting the power line communication signal. | 05-07-2015 |
20150130275 | SMART SOCKET FOR AUTOMATICALLY SWITCHING BETWEEN ELECTRICITY UTILIZATION MODES - The present invention is to provide a smart socket, which includes a timing unit for obtaining current time; a power receiving/output unit for receiving electricity from an external power supply or outputting electricity to a power storage device; an electricity quantity monitoring unit for detecting power value of electricity received from the power receiving/output unit; a home appliance power supply unit and an electricity selling power supply unit for transmitting electricity to an electronic device and an electricity purchaser circuit, respectively; a switching unit connected to the electricity quantity monitoring unit, home appliance power supply unit and electricity selling power supply unit, and being set with a home appliance mode, a power storage mode and an electricity selling mode; and a processing unit connected to the timing unit, electricity quantity monitoring unit and switching unit for switching mode of the switching unit according to the current time and power value. | 05-14-2015 |
20150212532 | CONTROL SYSTEM CAPABLE OF CHANGING THE STATE OF AN ELECTRICAL APPLIANCE ACCORDING TO EXCEPTIONAL CONDITIONS - The present invention is to provide a control system, which includes a plurality of switch devices each electrically connected between an electrical appliance and a power supply unit for turning on or off the electrical appliance, and a processing server respectively connected to the switch devices and capable of turning the switch device into a turned-on or turn-off state at a predetermined time according to a time schedule stored therein. In addition, the processing server can generate an exception time data when determining an exceptional condition (e.g., a specific event took place, a user did not leave home on time, or the user turned on the electrical appliance on his or her own initiative) occurs, and then change the state of each switch device preferentially according to the exception time data, so as to adjust the time schedule in a timely manner upon determining the occurrences of different exceptional conditions. | 07-30-2015 |
20160099977 | METHOD OF UTILIZING TOKEN TO ENABLE ELECTRONIC DEVICES TO ACT SIMULTANEOUSLY WITH EACH OTHER - The present invention is to provide a method enabling a first electronic device to execute steps of: connecting to a cloud server; establishing connection with a second electronic device to obtain a second device parameter stored in the second electronic device; transmitting a first device parameter stored therein and the second device parameter to the cloud server; receiving and storing a token generated by the cloud server, wherein the token is associated with management data stored in the cloud server when the cloud server determines that the first and second device parameters correspond to the management data; and transmitting the token to the second electronic device; such that the first and second electronic devices are stored with the same token, and the cloud server transmits a control instruction to the first and second electronic devices according to the tokens when the second electronic device is connected to the cloud server. | 04-07-2016 |
Patent application number | Description | Published |
20120001884 | DISPLAY PANEL - A display panel includes a substrate, a pixel array, and a plurality of shift registers. The pixel array is disposed on the substrate. The shift registers are disposed on the substrate for sequentially outputting a plurality of scanning signals to drive the pixel array. Each of the shift registers includes a pull-up transistor and a first reserve transistor. The pull-up transistor raises the voltage level of the corresponding scanning signal. A control terminal of the first reserve transistor is coupled to a control terminal of the pull-up transistor, and a second terminal of the first reserve transistor is coupled to a second terminal of the pull-up transistor. When the pull-up transistor in each of the shift registers has insufficient output ability, a first terminal of the first reserve transistor is coupled to a first terminal of the pull-up transistor. | 01-05-2012 |
20120062533 | GATE DRIVER FOR USE IN A DISPLAY PANEL - A gate driver capable of adjusting power consumption and output capability is proposed. The driving circuit includes a first metallic layer and a second metallic layer on the first metallic layer. The first metallic layer includes a first metallic region with U-shaped indents, a second metallic region, and metallic strips. Each metallic strip is inserted into a U-shaped indent, where a distance between one side of the U-shaped indent and one side of the metallic strip is shorter than that between a side of the metallic strip and a bottom of the U-shaped indent. The second metallic region is under the first metallic region. Etching the first metallic layer to adjust a length of the metallic strip, or etching the second metallic layer to adjust a width of the second metallic layer is proposed to adjust a length of the overlap of the second metallic layer and each metallic strip. | 03-15-2012 |
20120099068 | PIXEL ARRAY STRUCTURE - A pixel array structure including a plurality of first pixels, second pixels, third pixels, a plurality of scan lines and a plurality of data lines is provided. The first pixels are arranged in a first row. The second pixels are arranged in a second row. The third pixels are arranged in a third row. The scan lines and the data lines are electrically connected to the corresponding first pixels, second pixels and third pixels. A first pixel column and a second pixel column are respectively formed at two sides of each data line. The first pixels, the second pixels, and the third pixels in the first pixel column are connected to the scan lines of odd positions. The first pixels, the second pixels, and the third pixels in the second pixel column are connected to the scan lines of even positions. | 04-26-2012 |
20130050171 | LIQUID CRYSTAL DISPLAY WHICH CAN COMPENSATE GATE VOLTAGES AND METHOD THEREOF - A method of compensating gate voltages of a liquid crystal display includes generating a first high gate voltage, a second high gate voltage, and a first low gate voltage; generating a first scan start signal and a reference clock; generating and outputting a second scan start signal, a first clock, a second clock, a third clock, a fourth clock, and the first low gate voltage according to the first high gate voltage, the second high gate voltage, the first low gate voltage, the first scan start signal, and the reference clock; driving a plurality of pixels included by a liquid crystal panel according to the second scan start signal, the first clock, the second clock, the third clock, the fourth clock, and the first low gate voltage to improve frame quality displayed by the liquid crystal panel. | 02-28-2013 |