Patent application number | Description | Published |
20150347110 | SOFTWARE INSTALLATION AND CONFIGURATION - A method to manage an initial software installation and configuration script is provided. The method may include saving, by a plurality of collaboration tools, a new customization associated with the initial software installation and configuration script in an installation and configuration knowledgebase. The method may also include saving, by the plurality of collaboration tools, a new solution associated with the initial software installation and configuration script in the installation and configuration knowledgebase. The method may further include querying, by a search engine or a similarity engine, the installation and configuration knowledgebase for the new customization or the new solution based on a comparison between a criteria provided by an administrator and an index of vocabularies stored in the configuration knowledgebase related to the initial installation and configuration script. Additionally, the method may include returning a search result based on the querying the installation and configuration knowledgebase. | 12-03-2015 |
20150347113 | SOFTWARE INSTALLATION AND CONFIGURATION - A method to manage an initial software installation and configuration script is provided. The method may include saving, by a plurality of collaboration tools, a new customization associated with the initial software installation and configuration script in an installation and configuration knowledgebase. The method may also include saving, by the plurality of collaboration tools, a new solution associated with the initial software installation and configuration script in the installation and configuration knowledgebase. The method may further include querying, by a search engine or a similarity engine, the installation and configuration knowledgebase for the new customization or the new solution based on a comparison between a criteria provided by an administrator and an index of vocabularies stored in the configuration knowledgebase related to the initial installation and configuration script. Additionally, the method may include returning a search result based on the querying the installation and configuration knowledgebase. | 12-03-2015 |
Patent application number | Description | Published |
20090087956 | Dummy Contact Fill to Improve Post Contact Chemical Mechanical Polish Topography - State of the art Integrated Circuits (ICs) encompass a variety of circuits, which have a wide variety of contact densities as measured in regions from 10 to 1000 microns in size. Fabrication processes for contacts have difficulty with high and low contact densities on the same IC, leading to a high incidence of electrical shorts and reduced operating speed of the circuits. This problem is expected to worsen as feature sizes shrink in future technology nodes. This invention is an electrically non-functional contact, known as a dummy contact, that is utilized to attain a more uniform distribution of contacts across an IC, which allows contact fabrication processes to produce ICs with fewer defects, and a method for forming said dummy contacts in ICs. | 04-02-2009 |
20090278238 | TSVS HAVING CHEMICALLY EXPOSED TSV TIPS FOR INTEGRATED CIRCUIT DEVICES - A method for fabricating ICs including via-first through substrate vias (TSVs) and ICs and electronic assemblies therefrom. A substrate having a substrate thickness including a top semiconductor surface and a bottom surface is provided including at least one embedded TSV including a dielectric liner and an electrically conductive filler material formed on the dielectric liner. A portion of the bottom surface of the substrate is mechanically removed to approach but not reach the embedded TSV tip. A protective substrate layer having a protective layer thickness remains over the tip of the embedded TSV after the mechanical removing. Chemical etching exclusive of mechanical etching for removing the protective substrate layer is used form an integral TSV tip that has an exposed tip portion that generally protrudes from the bottom surface of the substrate. The chemical etching is generally a three step chemical etch. | 11-12-2009 |
20110018107 | TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices - A method for fabricating ICs including via-first through substrate vias (TSVs) and ICs and electronic assemblies therefrom. A substrate having a substrate thickness including a top semiconductor surface and a bottom surface is provided including at least one embedded TSV including a dielectric liner and an electrically conductive filler material formed on the dielectric liner. A portion of the bottom surface of the substrate is mechanically removed to approach but not reach the embedded TSV tip. A protective substrate layer having a protective layer thickness remains over the tip of the embedded TSV after the mechanical removing. Chemical etching exclusive of mechanical etching for removing the protective substrate layer is used form an integral TSV tip that has an exposed tip portion that generally protrudes from the bottom surface of the substrate. The chemical etching is generally a three step chemical etch. | 01-27-2011 |
20120142183 | ALUMINUM ENHANCED PALLADIUM CMP PROCESS - A process of forming an integrated circuit using a palladium CMP operation in which 25 to 125 ppm aluminum is added to the CMP slurry, allowing a palladium removal rate of at least 80 nanometers per minute at a polish pad pressure less than 9 psi and a surface speed between 1.9 and 2.2 meters per second. The palladium CMP operation may be applied to form a palladium bond pad cap after which an external bond element is formed on the palladium bond pad cap. Alternatively, the palladium CMP operation may be applied to form a palladium interconnect conductor in a first dielectric layer. | 06-07-2012 |