Patent application number | Description | Published |
20110062375 | SILICON WAFER RECLAMATION PROCESS - An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate. | 03-17-2011 |
20140145283 | Photodiode with Concave Reflector - A photodiode structure includes a photodiode and a concave reflector disposed below the photodiode. The concave reflector is arranged to reflect incident light from above back toward the photodiode. | 05-29-2014 |
20140210029 | Backside Illumination Image Sensor Chips and Methods for Forming the Same - A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with respective ones of the first plurality of edges. The semiconductor substrate further includes a second portion extending from one of the second plurality of edges to one of the first plurality of edges of the die. The second portion includes a first end connected to the one of the second plurality of edges, and a second end having an edge aligned to the one of the first plurality of edges of the die. | 07-31-2014 |
20150044810 | Backside Illumination Image Sensor Chips and Methods for Forming the Same - A die includes a first plurality of edges, and a semiconductor substrate in the die. The semiconductor substrate includes a first portion including a second plurality of edges misaligned with respective ones of the first plurality of edges. The semiconductor substrate further includes a second portion extending from one of the second plurality of edges to one of the first plurality of edges of the die. The second portion includes a first end connected to the one of the second plurality of edges, and a second end having an edge aligned to the one of the first plurality of edges of the die. | 02-12-2015 |
Patent application number | Description | Published |
20090087929 | METHOD AND SYSTEM FOR IMPROVING WET CHEMICAL BATH PROCESS STABILITY AND PRODUCTIVITY IN SEMICONDUCTOR MANUFACTURING - A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing. | 04-02-2009 |
20090111269 | SILICON WAFER RECLAMATION PROCESS - By exposing a process control wafer having a porous low-k-dielectric layer thereon in an HF-based low-k dielectric etching solvent comprising a dilating additive and a passivating additive, the pores in the low-k dielectric layer are dilated some of which connect with one another to form one or more continuous channels extending through the thickness of the dielectric layer and allowing the HF-based solvent to reach down to the substrate. Then the passivating additive component of the HF-based etching solvent forms a passivation layer at the dielectric layer and the substrate interface that protects substrate from the HF-based etchant. | 04-30-2009 |
20090233447 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a dielectric layer deposited thereon involves removing most of the dielectric layer by plasma etching leaving a residual film of the dielectric and then removing the residual dielectric film by a wet etching process. The combination of the dry and wet etching provides effective removal of the dielectric material without damaging the wafer substrate and any residual wet etching byproduct particulate remaining on the wafer substrate is then removed by APM cleaning and scrubbing. | 09-17-2009 |
20110223767 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a low-k dielectric layer deposited thereon involves etching a portion of the low-k dielectric layer using a plasma resulting in a residual film of the low-k dielectric layer and byproduct particulates of carbon on the substrate. The residual dielectric film is removed by wet etching with a low polarization organic solvent that includes HF and a surfactant. | 09-15-2011 |
20140367820 | Methods of Manufacturing and Using a Photodiode with Concave Reflector - A photodiode structure includes a photodiode and a concave reflector disposed below the photodiode. The concave reflector is arranged to reflect incident light from above back toward the photodiode. | 12-18-2014 |