Patent application number | Description | Published |
20090086445 | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME - A method of making an electronic circuit device includes expelling air from a gap between a circuit board and an electronic element mounted on only a first side of the circuit board by filling the gap with a filling member, placing the circuit board in a mold cavity such that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board with a resin material by injecting the resin material into the cavity. | 04-02-2009 |
20090086446 | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME - A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing. | 04-02-2009 |
20090086447 | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME - A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material. | 04-02-2009 |
20100242273 | Method of producing electronic device - A method of producing an electronic device includes a molding of a first casing to seal a first face of a circuit board and electronic parts mounted on the first face. The producing method further includes a mounting of electronic parts on a second face of the circuit board opposite from the first face, after the molding of the first casing is finished. The producing method further includes a molding of a second casing to seal the second face of the circuit board and the electronic parts mounted on the second face. The molding of the second casing integrates the first casing and the second casing with each other. | 09-30-2010 |
20100246146 | Electronic device and method of producing the same - A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet. | 09-30-2010 |
20120306116 | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME - A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing. | 12-06-2012 |
20130039024 | CARD KEY - A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings. | 02-14-2013 |