Patent application number | Description | Published |
20090086427 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 04-02-2009 |
20090095979 | Power Module - A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a first main electrode is formed, and a second main surface on which a second main electrode in contact with the first main substrate surface is formed; a heat conduction portion disposed on the first main substrate surface in a residual region of a region on which the semiconductor device is disposed; and an upper cooling portion disposed on the heat conduction portion. | 04-16-2009 |
20090166893 | SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes: an insulating substrate; a metal bonding member being disposed on the insulating substrate and having a porous region and a metal region, the porous region being provided with multiple pores therein and being adjacent to the metal region in a plane direction of the insulating substrate; a solder material impregnated into the pores; a semiconductor element disposed on the surface of the porous region in the metal bonding member; a bonding wire connected to the surface of the metal region in the metal bonding member. This makes it possible to provide a semiconductor device having improved electrical conductivity and thermal conductivity, and enabling the weight reduction. | 07-02-2009 |
20100265664 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 10-21-2010 |
20110069457 | Semiconductor Device - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 03-24-2011 |
20120229985 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units. | 09-13-2012 |
Patent application number | Description | Published |
20100001454 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device for feeding a sheet-form recording medium includes: a sheet accommodating portion for accommodating a sheet stack constituted by a plurality of sheets of the sheet-form recording medium; and a first warm air unit having a first blowing port for blowing warm air toward an upper face of the sheet stack accommodated in the sheet accommodating portion. The sheet feeding device preferably further includes a second warm air unit having a second blowing port for blowing warm air onto a side face of the sheet stack that is parallel to a sheet feeding direction. | 01-07-2010 |
20100025919 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device includes a sheet accommodating portion for accommodating a sheet stack. A sheet carrying plate carries the sheet stack and has an upstream end supported in the sheet accommodating portion for rotation. A pickup roller contacts an upper face of the sheet stack and dispatches an uppermost sheet. An elevator displaces the sheet carrying plate between a feeding position where the upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side of the sheet stack in the sheet accommodating portion, the side being parallel to the sheet feeding direction. A controller controls the elevator so that the sheet carrying plate is displaced between the feeding position and the separating position during a warm air blowing operation. | 02-04-2010 |
20100032890 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING SHEET FEEDING DEVICE - A sheet feeding device has a sheet accommodating portion for accommodating a sheet stack, a sheet carrying plate for carrying the sheet stack and a pickup roller that dispatches the uppermost sheet of the stack. An elevator displaces the sheet carrying plate between a sheet feeding position where an upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side face of the sheet stack. A controller causes the first warm air mechanism to blow warm air to the side face of the sheet stack and causes the elevator to displace the sheet carrying plate between the sheet feeding position and the separating position. | 02-11-2010 |
20100059929 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feeding device has: a sheet accommodating portion that accommodates a sheet stack of a plurality of sheets; a sheet carrying plate that is provided within the sheet accommodating portion and stacks the sheet stack thereon; a pickup roller that contacts an upper face of the sheet stack and dispatches a sheet on an uppermost layer of the sheet stack, an elevator mechanism that displaces the sheet carrying plate between a sheet feeding position in which the upper face of the sheet stack contacts the pickup roller, and a separating position in which the upper face of the sheet stack separates from the pickup roller by a predetermined distance; and a controller that controls an operation of the elevator mechanism such that the sheet carrying plate is lowered to the separating position after a sheet feeding operation for feeding a sheet at the sheet feeding position is completed. | 03-11-2010 |
Patent application number | Description | Published |
20110274517 | SHEET POST-PROCESSING APPARATUS - A sheet post-processing apparatus is provided that includes a first delivery path that guides a sheet to a first post-processing portion, a delivery holding path having a first holding path which branches off from a branch point of the first delivery path and a second holding path which is formed to be continuous with the first holding path and joins together with the first delivery path; a second delivery path that branches off from a branch point of the first holding path and guides the sheet to the second post-processing portion; a first path switching portion that is provided at the branch point of the first delivery path; and a second path switching portion that is provided at the branch point of the first holding path. | 11-10-2011 |
20130313771 | SHEET POST-PROCESSING DEVICE, AND IMAGE FORMING APPARATUS INCLUDING SHEET POST-PROCESSING DEVICE - A sheet post-processing apparatus according to one aspect of the present disclosure includes a switching member, a stapler, and a movement driving portion. The switching member switches the conveying direction of a sheet introduced from an image forming apparatus. The stapler staples a bundle of sheets obtained by performing stacking processing for a plurality of the sheets introduced from the image forming apparatus. The movement driving portion moves the stapler. Further, the stapler operates the switching member by being moved by the movement driving portion, thereby switching the conveying direction of the sheet. | 11-28-2013 |
20140270837 | COMBINED UNITS AND IMAGE FORMING SYSTEM - An image forming system includes an image forming apparatus, a post-processing apparatus, a fixed member, a first connector, a connecting member, and a second connector. The mage forming apparatus includes the fixed member on which the first connector is mounted and the post-processing apparatus includes connecting member on which the second connector is mounted. The connecting member is movable in a front-back direction and configured so as to be displaced between an engaging position in which the connecting member is engaged with the fixed member and a disengaging position in which the connecting member is disengaged from the fixed member. The first connector and the second connector are disconnected from each other when the connecting member is set to the disengaging position, and connected to each other when the connecting member is set to the engaging position. | 09-18-2014 |
20140293378 | IMAGE FORMING APPARATUS - An image forming apparatus according to one aspect of the present disclosure includes an apparatus body, a document sheet feed apparatus, a wiring cord, a guide portion, and a wiring cord cover. The apparatus body includes a document sheet reading portion therein. The document sheet feed apparatus is configured to be openable and closable relative to a document sheet placing surface of the apparatus body. The wiring cord is configured to electrically connect between the apparatus body and the document sheet feed apparatus. The guide portion is configured to surround the wiring cord. The wiring cord cover is mounted detachably to the apparatus body in a state where the wiring cord cover has the wiring cord disposed therein. | 10-02-2014 |
Patent application number | Description | Published |
20120112201 | HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE - A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high melting point metal layer disposed at a back side of the low melting point metal layer. The low melting point metal layer, the first high melting point metal layer, and the second high melting point metal layer are mutually alloyed by transient liquid phase bonding, by annealing not less than a melting temperature of the low melting point metal layer, diffusing the metal of the low melting point metal layer into an alloy of the first high melting point metal layer and the second high melting point metal layer. The high melting point soldering layer has a higher melting point temperature than that of the low melting point metal layer. It is provided a binary based high melting point soldering layer having TLP bonding of a high melting point according to a low temperature processing, a fabrication method for the high melting point soldering layer and a semiconductor device to which the high melting point soldering layer is applied. | 05-10-2012 |
20130001782 | LAMINATED HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE - The laminated high melting point soldering layer includes: a laminated structure which laminated a plurality of three-layered structures, the respective three-layered structures including a low melting point metal thin film layer and a high melting point metal thin film layers disposed on a surface and a back side surface of the low melting point metal thin film layer; a first high melting point metal layer disposed on the surface of the laminated structure; and a second high melting point metal layer disposed on the back side surface of the laminated structure. The low melting point metal thin film layer and the high melting point metal thin film layer are mutually alloyed by TLP, and the laminated structure, and the first high melting point metal layer and the second high melting point metal layer are mutually alloyed by the TLP bonding. | 01-03-2013 |
20130009256 | SEMICONDUCTOR DEVICE - The semiconductor device according to the present invention includes a semiconductor layer of a first conductivity type, body regions of a second conductivity type plurally formed on a surface layer portion of the semiconductor layer at an interval, a source region of the first conductivity type formed on a surface layer portion of each body region, a gate insulating film provided on the semiconductor layer to extend between the body regions adjacent to each other, a gate electrode provided on the gate insulating film and opposed to the body regions, and a field relaxation portion provided between the body regions adjacent to each other for relaxing an electric field generated in the gate insulating film. | 01-10-2013 |
20130082284 | ELECTRONIC CIRCUIT - An electronic circuit includes a bipolar device, a unipolar device connected in parallel to the bipolar device, and an output line connected to the bipolar device and to the unipolar device. An inductance between the unipolar device and the output line is smaller than an inductance between the bipolar device and the output line. | 04-04-2013 |
20130175549 | SEMICONDUCTOR DEVICE - A semiconductor device ( | 07-11-2013 |
20130248981 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME - A semiconductor device includes a first conductive-type semiconductor layer, a second conductive-type body region formed in a surficial portion of the semiconductor layer, a first conductive-type source region formed in a surficial portion of the body region, a gate insulating film provided on the semiconductor layer and containing nitrogen atoms, the gate insulating film including a first portion in contact with the semiconductor layer outside the body region, a second portion in contact with the body region, and a third portion in contact with the source region, and a gate electrode provided on the gate insulating film in an area extending across the semiconductor layer outside the body region, the body region, and the source region. The third portion of the gate insulating film has a thickness greater than the thickness of the first portion and the thickness of the second portion. | 09-26-2013 |
20140231926 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of which is connected to a unipolar device, said semiconductor device being capable of improving the reliability of wire bonding. A package ( | 08-21-2014 |
Patent application number | Description | Published |
20130204635 | SCHEDULE PRESENTATION DEVICE - In a schedule presentation device that presents to a user examination schedule information including an execution time of an examination and an examination room to perform the examination, an examination information processing unit processes examination information. An examination information storage stores the examination information. A screen image generating unit generates an examination schedule screen image including an unallocated examination display region and a schedule display region. An examination information processing unit extracts: unallocated examination information on examinations to which an execution time or an examination room is not allocated; and allocated examination information on examinations to which an execution time and an examination room are allocated, from the examination information. The screen image generating unit generates data for displaying the unallocated examination information in the unallocated examination display region, and data for displaying the allocated examination information in the examination schedule screen image. | 08-08-2013 |
20140300719 | INSPECTION MANAGEMENT APPARATUS, SYSTEM, AND METHOD, AND COMPUTER READABLE RECORDING MEDIUM - An inspection management apparatus includes: a schedule generation unit that, based on a scheduled start date and time of examination, a scheduled start date and time of observation, a predictive transfer time of image data from a receiving device to an inspection management apparatus, and a predictive image processing time for each type of image processing, calculates an image transfer start date and time from the receiving device to the inspection management apparatus, and calculates an image processing start date and time of the transferred image data; and a control unit that starts acquisition of the image data transmitted from the receiving device when the image transfer start date and time comes, and causes, when the image processing start date and time comes, an image processing unit to perform specified image processing on the image data that the transfer has been started on the image transfer start date and time. | 10-09-2014 |