Patent application number | Description | Published |
20080252855 | PROJECTION OPTICAL SYSTEM - Provided is a projection optical system. The projection optical system includes: A projection optical system comprising: a first optical part that comprises at least one optical lens, and projects and displays light beams; a second optical part that comprises an image forming element and at least one optical lens, and emits incident light beams as light beams with images; and a third optical part that comprises a light source unit and a deflector that is located between the first and second optical parts, and directs light beams emitted from the light source unit to the second optical part and directs the light beams with images emitted from the second optical part to the first optical part. | 10-16-2008 |
20080280441 | Method of Forming Isolation Layer of Flash Memory Device - An embodiment of the invention relates to a method of forming an isolation layer of a flash memory device. An isolation layer is formed using a PSZ-based material and a nitride film of liner form is deposited on a trench before the PSZ film is deposited. An oxide film can be prevented from remaining on a top of the sidewalls of a conductive film for a floating gate through an etch process employing the etch rate. The thickness of a dielectric film can be prevented from increasing when a dielectric film is deposited. Accordingly, the contact area of the floating gate and the dielectric film can be increased and the coupling ratio between the floating gate and the control gate can be improved. | 11-13-2008 |
20080298461 | VIDEO SIGNAL PROCESSING APPARATUS, DISPLAY APPARATUS AND VIDEO SIGNAL PROCESSING METHOD - A video signal processing apparatus and method and a display apparatus are provided. The video signal processing apparatus includes: an input unit through which a video signal is input; a signal processing unit which processes the video signal input through the input unit, wherein signal processing unit encodes the video signal if a transmission distance from the transmitting unit to the display apparatus is greater than a reference distance; and a transmitting unit which transmits the video signal processed by the signal processing unit to a display apparatus using wireless communication. | 12-04-2008 |
20090085193 | Heat-releasing printed circuit board and semiconductor chip package - A heat-releasing printed circuit board and semiconductor chip package are disclosed. The heat-releasing printed circuit board includes an insulation layer, on a surface of which a circuit pattern is formed, and a solder resist, which is stacked on the insulation layer, where the solder resist contains carbon nanotubes. The heat-releasing printed circuit board allows the heat generated in a semiconductor chip to be dispersed in several directions of the board or package, to improve heat-releasing property. | 04-02-2009 |
20090114278 | DYE-SENSITIZED SOLAR CELL AND FABRICATION METHOD THEREOF - A dye-sensitized solar cell and a fabrication method thereof are disclosed. A method for fabricating a dye-sensitized solar cell, includes forming a sacrifice layer comprising colloidal particles on a transparent conductive substrate, supplying a photoelectrode material comprising transition metal oxide nano particles onto the sacrifice layer, thereby filling the transition metal oxide nano particles between the colloidal particles, removing the sacrifice layer by thermal treatment to prepare a photoelectrode having an inverse opal structure, and adsorbing dye molecules onto the photoelectrode. | 05-07-2009 |
20090298435 | TRANSMISSION APPARATUS, RECEPTION APPARATUS, TRANSMISSION SYSTEM WHICH COMBINES THESE, AND TRANSMISSION AND RECEPTION METHOD THEREOF - A transmission apparatus, a reception apparatus, a transmission system which combines these, and a transmission and reception method thereof are provided. The transmission apparatus includes a first transmission unit which transmits data via a channel in a first band, a second transmission unit which transmits data via a channel in a second band, and a transmission control unit which controls the first transmission unit to stop transmitting the data via the channel in the first band if interference is sensed in the channel in the first band. Accordingly, data can be provided without data interruption in a wireless environment where there is interference. | 12-03-2009 |
20100029091 | Method of Forming Tunnel Insulation Layer in Flash Memory Device - A method of forming a tunnel insulating layer in a flash memory device, comprising: forming an oxide layer on a semiconductor substrate, forming a nitrogen-containing layer to a surface of the oxide layer, and forming a nitrogen-accumulating layer on an interface defined between the semiconductor substrate and the oxide layer. | 02-04-2010 |
20100132982 | Package substrate including solder resist layer having pattern parts and method of fabricating the same - Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate. | 06-03-2010 |
20100247892 | ELECTROCONDUCTIVE PARTICLE AND ANISOTROPIC CONDUCTIVE FILM COMPRISING SAME - The present invention discloses an electroconductive particle comprising (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices. | 09-30-2010 |
20100264549 | Trench Substrate and Method Of Manufacturing The Same - Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon. | 10-21-2010 |
20100321351 | DISPLAY APPARATUS AND METHOD FOR DISPLAYING THEREOF - Provided is a display apparatus and method for displaying. The display apparatus includes: a control unit which controls a display unit to display a first graphic representing the display apparatus, a second graphic representing an external device, and a third graphic representing a connection status between the display apparatus and the external device, wherein the control unit controls the display unit to change the third graphic, if one or more external device is attached to the display apparatus. | 12-23-2010 |
20110079421 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof. | 04-07-2011 |
20110089138 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed is a method of manufacturing a printed circuit board, including (A) forming a first circuit layer on a base substrate and forming a first insulating layer thereon, (B) forming trenches including dummy trenches and wiring trenches on the first insulating layer and plating the trenches, thus providing a trench circuit layer including a dummy circuit pattern and a wiring circuit pattern, (C) removing the dummy circuit pattern of the trench circuit layer, and (D) forming a second insulating layer on the trench circuit layer from which the dummy circuit pattern was removed. The method reduces deviation of plating thickness and thus realizes the design density of a trench circuit layer. | 04-21-2011 |
20110131599 | MEDIA PROCESSING APPARATUS AND CONTROLLING METHOD THEREOF - A media processing apparatus is provided. The media processing apparatus includes an interface unit which is connected to each of a plurality of terminal devices through a communication interface including a video channel, an audio channel, and a data channel, a processor which receives a control signal from a first terminal device having control rights, a control unit which notifies the first terminal device if there is an access attempt from at least one of a second terminal device and transfers the control rights to the second terminal device if a message to permit the transfer of the control rights is received from the first terminal device. Accordingly, control rights may be transferred and shared in a reasonable manner. | 06-02-2011 |
20110174368 | COMPOSITE ELECTROLYTE AND THE PREPARATION METHOD THEREOF, AND DYE-SENSITIZED SOLAR CELL USING THE SAME - A composite electrolyte, a preparation method thereof, and a dye-sensitized solar cell based on an electrolyte with hollow particles of metal oxide are disclosed. A dye-sensitized solar cell includes a photoelectrode substrate, a counter electrode substrate facing the photoelectrode substrate, a light absorbing layer formed on an inner surface of the photoelectrode substrate and having a dye adsorbed thereto, and a composite electrolyte, characterized in that an electrolyte is mixed with hollow particles composed of metal oxide particulates, filled between the light absorbing layer and the counter electrode substrate. | 07-21-2011 |
20120007162 | METHOD OF FORMING SEMICONDUCTOR DEVICES - A semiconductor device includes an insulating layer and an undoped polysilicon layer that are stacked over a semiconductor substrate. The semiconductor substrate is exposed by removing the portions of the undoped polysilicon layer and the insulating layer. The trenches are formed by etching the exposed semiconductor substrate. Isolation layers are formed in the trenches, and a doped polysilicon layer is formed by implanting impurities into the undoped polysilicon layer. | 01-12-2012 |
20120077333 | TRENCH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon. | 03-29-2012 |
20120122348 | CONNECTOR AND INTERFACE DEVICE - A connector and an interface device are provided. The connector includes: a plurality of contact locations having sequentially designated numbers; and a housing which houses the plurality of contact locations. The plurality of contact locations include: a first device pair contact location group which is configured to transmit data between a first pair of devices; a second device pair contact location group which is configured to transmit data between a second pair of devices; a third device pair contact location group which is configured to transmit data between a third pair of devices; and a fourth device pair contact location group which is configured to transmit data between a fourth pair of devices. | 05-17-2012 |
20120139474 | METHOD FOR CHARGING EXTERNAL DEVICE AND DISPLAYING APPARATUS USING THEREOF - A method for charging an external device and a display using the method are provided. The method includes, determining whether the external device is chargeable and connected to the display through a connector when the displaying apparatus is in a standby mode; and if it is determined that the external device is chargeable and connected, charging the external device through the connector in the standby mode. The display includes a power supply that supplies standby power or main power; a connection checker which determines, in a standby mode, whether an external device is connected and is a chargeable device; and a controller. The controller controls the power supply to output standby power to the external device while the connection checker determines whether the external device is connected and is a chargeable device, and if the external device is connected is a chargeable, controls the power supply to output main power to charge the external device. | 06-07-2012 |
20120241706 | RESISTANCE SWITCHABLE CONDUCTIVE FILLER FOR RERAM AND ITS PREPARATION METHOD - Disclosed are a resistive random-access memory (ReRAM) based on resistive switching using a resistance-switchable conductive filler and a method for preparing the same. When a resistance-switchable conductive filler prepared by coating a conductive filler with a material whose resistance is changeable is mixed with a dielectric material, the dielectric material is given the resistive switching characteristics without losing its inherent properties. Therefore, various resistance-switchable materials having various properties can be prepared by mixing the resistance-switchable conductive filler with different dielectric materials. The resulting resistance-switchable material shows resistive switching characteristics comparable to those of the existing metal oxide film-based resistance-switchable materials. Accordingly, a ReRAM device having the inherent properties of a dielectric material can be prepared using the resistance-switchable conductive filler. | 09-27-2012 |
20130252394 | PREPARATION METHOD FOR RESISTANCE SWITCHABLE CONDUCTIVE FILLER FOR RERAM - Disclosed are methods for preparing a resistive random-access memory (ReRAM) based on resistive switching using a resistance-switchable conductive filler. When a resistance-switchable conductive filler prepared by coating a conductive filler with a material whose resistance is changeable is mixed with a dielectric material, the dielectric material is given the resistive switching characteristics without losing its inherent properties. Therefore, various resistance-switchable materials having various properties can be prepared by mixing the resistance-switchable conductive filler with different dielectric materials. The resulting resistance-switchable material shows resistive switching characteristics comparable to those of the existing metal oxide film-based resistance-switchable materials. Accordingly, a ReRAM device having the inherent properties of a dielectric material can be prepared using the resistance-switchable conductive filler. | 09-26-2013 |
20130310495 | ELASTOMER COMPOSITE WITH IMPROVED DIELECTRIC PROPERTIES AND PRODUCTION METHOD THEREOF - Disclosed is an elastomer-conductive filler composite with improved dielectric properties. The composite includes conductive fillers and an ionic liquid dispersing the conductive fillers. The ionic liquid is used as a dispersant to effectively enhance the dispersion of the conductive fillers, achieving a high dielectric constant and a low dielectric loss of the composite without deteriorating the physical properties of the conductive fillers. The use of the ionic liquid can reduce the number of processing steps and the presence of the conductive fillers at a low concentration in the composite can minimize deterioration of the physical properties of the elastomer. Further disclosed is a method for producing the composite. | 11-21-2013 |
20140271444 | FRACTIONATION OF 2-DIMENSIONAL PLATE PARTICLES BY SIZE SELECTIVE ADHESION WITH SPHERICAL PARTICLES - The present disclosure relates to a method for size-selective separation of 2-dimensional plate particles using spherical particles. Since the separation method of 2-dimensional plate particles according to the present disclosure is simple, economical and extensible to large-scale applications, it can contribute greatly to commercialization of plate particles by reducing cost and preventing deterioration of physical properties. The 2-dimensional plate particles having uniform size can be useful in such applications as transparent electrodes, solar cells, composites, drug delivery, biosensors, etc. | 09-18-2014 |
20150069484 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes stacked groups each including interlayer insulating patterns and conductive patterns and stacked in at least two tiers, wherein the insulating patterns and the conductive patterns are alternately stacked over a substrate and separated by slits, and a support body including holes and formed between the stacked groups. | 03-12-2015 |
20150073072 | ELASTOMER-CONDUCTIVE FILLER COMPOSITE FOR FLEXIBLE ELECTRONIC MATERIALS AND METHOD FOR PREPARING SAME - The present disclosure relates to an elastomer-conductive filler composite for a flexible electronic material having improved dielectric property and elastic modulus, and a method for preparing same. The elastomer-conductive filler composite according to the embodiments of the present disclosure solves the problem of the existing insulator-conductor composite that elastic modulus increases and adhesion property decreases with the increase in dielectric constant as the content of the conductive filler in elastomer increases. In particular, since the composite has a high dielectric constant in spite of a low content of the conductive filler and since the elastic modulus increased because of the conductive filler can be recovered by the plasticizer, the sensitivity of a sensor can be improved. Accordingly, it can be usefully used for flexible substrates and flexible touch panels or touchscreens, touchpads, etc. including them. | 03-12-2015 |