Patent application number | Description | Published |
20090084594 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance. | 04-02-2009 |
20090090547 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 04-09-2009 |
20090199399 | METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS - A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern. | 08-13-2009 |
20090231827 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad. | 09-17-2009 |
20090255716 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers. | 10-15-2009 |
20090260857 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate. | 10-22-2009 |
20100108637 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board manufacturing method including forming conductor posts, which are of substantially uniform thickness and with which the top surfaces are protected by a resist, on a conductor pattern disposed on an upper surface of a build-up layer formed on a core substrate, shaping the conductor posts to have a constriction by adjusting the time of immersion in an etching solution that etches the conductor posts, forming a low elastic modulus layer of substantially the same height as the conductor posts after removing the resist at the top surfaces, and forming mounting electrodes on upper surfaces of the conductor posts. | 05-06-2010 |
20110063806 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer. | 03-17-2011 |
20110100700 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 05-05-2011 |