Patent application number | Description | Published |
20080251287 | SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion. | 10-16-2008 |
20090020889 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF - A plurality of quadrilateral-shaped semiconductor elements are stacked on the one surface of a circuit substrate. A side surface wiring for making electrical connection between each of the electrode terminals of the semiconductor elements and a pad formed on the circuit substrate is formed by applying a conductive paste containing conductive particles. A metal wire whose one end is connected to the electrode terminal is extended along a tapered surface formed by cutting off an edge of the electrode terminal surface on which the electrode terminal is formed among edges formed along each of the sides of the semiconductor element. At least a part of the metal wire extended from each of the electrode terminals of the semiconductor elements to the tapered surface is electrically connected to the side surface wiring. | 01-22-2009 |
20090023247 | METHOD FOR FORMING SIDE WIRINGS - After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to one another. In this case, as the semiconductor element, a semiconductor element | 01-22-2009 |
20090081867 | METHOD OF MANUFACTURING SUBSTRATE - The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film. | 03-26-2009 |
20090093117 | METHOD OF MANUFACTURING SUBSTRATE - A method of manufacturing a substrate, includes: (a) forming the through hole by etching the silicon substrate from a first surface of the silicon substrate by a Bosch process; (b) forming a thermal oxide film such that the thermal oxide film covers the first surface of the silicon substrate, a second surface of the silicon substrate opposite to the first surface, and a surface of the silicon substrate corresponding to a side surface of the through hole, by thermally oxidizing the silicon substrate where the through hole is formed; (c) removing the thermal oxide film; (d) forming an insulating film such that the insulating film covers the first and second surfaces of the silicon substrate and the surface of the silicon substrate corresponding to the side surface of the through hole; and (e) forming the through electrode in the through hole on which the insulating film is formed. | 04-09-2009 |
20090095974 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package including a base body having a recessed portion for installing an electronic component on one surface, the recessed portion including an inner bottom surface, inclined surface and a shoulder part and a wiring pattern having one end positioned in the inner bottom surface of the recessed portion and the other end extending to an outside region of the recessed portion beyond the shoulder part of the recessed portion. The shoulder part of the recessed portion is a smoothly curved surface. | 04-16-2009 |
20090098712 | SUBSTRATE DIVIDING METHOD - A method of dividing a substrate | 04-16-2009 |
20090108411 | SILICON SUBSTRATE FOR PACKAGE - In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity. | 04-30-2009 |
20090115049 | SEMICONDUCTOR PACKAGE - A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates. | 05-07-2009 |
20090206861 | SEMICONDUCTOR INSPECTING DEVICE - In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate. | 08-20-2009 |
20090284276 | PROBE CARD - A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip. | 11-19-2009 |
20100001304 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode includes an LED element, a fluorescent material provided so as to cover the LED element, a substrate on which the LED element is mounted and made of ceramics or silicon, and a pair of electrode pads which are electrically connected to the LED element on the substrate. | 01-07-2010 |
20100038772 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board. | 02-18-2010 |
20100089631 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A wiring board, includes a substrate main body; a piercing electrode configured to pierce the substrate main body; a first wiring pattern provided at a first surface side of the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of the piercing electrode, the pad being where an electronic component is mounted; and a second wiring pattern provided at a second surface side of the substrate main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an outside connection pad, the outside connection pad being electrically connected to another end part of the piercing electrode. | 04-15-2010 |
20100108361 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces. | 05-06-2010 |
20100133677 | SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME - A plurality of chip sealing bodies stacked on a wiring substrate with a connection terminal. The chip sealing body includes a semiconductor chip having a semiconductor integrated circuit, a pad and a conductive connecting material, and a resin sealing the semiconductor chip. The chip sealing body is shaped into a cubic form in which a portion of the conductive connecting material except an end portion located on an external device side and all surfaces of semiconductor chip is sealed by the resin and the end portion of the conductive connecting material located on the external device side is exposed from the cubic form. A conductive bonding wire connects the end portions of the conductive connecting materials and the connection terminal respectively. A resin sealing material seals the plurality of chip sealing bodies, the conductive bonding wire, and the wiring substrate. | 06-03-2010 |
20100155928 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME - A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode. | 06-24-2010 |
20100190295 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device, includes the steps of: (a) providing a support including a plane having a first region for mounting a chip thereon and a second region provided around the first region; (b) forming an insulating resin layer in a semi-curing state on the plane; (c) forming, on the insulating resin layer, a first opening portion for exposing the first region; (d) fitting a chip in the first opening portion to mount the chip on the first region; and (e) completely curing the insulating resin layer after the step (d). | 07-29-2010 |
20100212950 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion. | 08-26-2010 |
20100321936 | LIGHTING APPARATUS - It is a lighting apparatus | 12-23-2010 |
20110032710 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate. | 02-10-2011 |
20110150405 | METHOD OF MANUFACTURING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE AND OPTICAL TRANSMISSION DEVICE - A method for manufacturing an optical waveguide which includes a core configured to transmit an optical signal, and a mirror portion configured to reflect the optical signal, the method includes: forming a mask layer patterned in a predetermined shape, on a first crystal plane of a substrate made of a crystalline material; etching the first crystal plane by a wet-etching using the mask layer to form a groove having a plurality of crystal planes; providing a metallic reflection film on at least one of the plurality of crystal planes to form the mirror portion; and providing the groove with a core material to form the core. | 06-23-2011 |
20110156242 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a silicon wafer comprising a first surface and a second surface opposite to the first surface; (b) forming vias through the silicon wafer in its thickness direction; (c) forming wiring patterns on the first surface of the silicon wafer such that the wiring patterns are electrically connected to the vias; (d) bonding a MEMS element wafer comprising MEMS elements onto the second surface of the silicon wafer such that the MEMS elements are electrically connected to the vias; (e) dividing the MEMS element wafer into the respective MEMS elements; (f) bonding a lid having concave portions therein onto the second surface of the silicon wafer such that the respective MEMS elements face a corresponding one of the concave portions; and (g) dicing the lid and the silicon wafer. | 06-30-2011 |
20110227218 | SILICON SUBSTRATE FOR PACKAGE - In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity. | 09-22-2011 |
20110260744 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. | 10-27-2011 |
20110272821 | Wiring Substrate Manufacturing Method and Wiring Substrate - A wiring substrate manufactured by thinning a silicon substrate, which is coated by an insulation film, from a lower surface to an upper surface to form a substrate body. The substrate body is etched using a resist, which includes an opening, as a mask and the insulation film as an etching stopper layer to form a through hole and a cover, which covers an opening of the through hole at the upper surface of the substrate body. In a state in which the cover is formed, a functional element is formed on the upper surface of a further insulation film at the upper side of the substrate body. Then, a through electrode is formed in at least the through hole. | 11-10-2011 |
20120325529 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion. | 12-27-2012 |
20130000955 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part. | 01-03-2013 |
20130121009 | Light Emitting Device - A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion. | 05-16-2013 |
20130163632 | LIGHT EMITTING DEVICE - A light emitting device includes: a first light emitting element mounting unit including: a first substrate; a first light emitting element on a first surface of the first substrate; and a first substrate holder which includes a first column, and a first protrusion which extends from the first column toward the first light emitting element and bonded to the first surface of the first substrate; and a second light emitting element mounting unit including: a second substrate; a second light emitting element mounted on a first surface of the second substrate; and a second substrate holder which includes: a second column, and a second protrusion which extends from the second column toward the second light emitting element and bonded to the first surface of the second substrate. The second light emitting element mounting unit is stacked on the first light emitting element mounting unit. | 06-27-2013 |
20140042616 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a silicon substrate; a copper post connected to one surface of the silicon substrate; a semiconductor element having a linear expansion coefficient different from that of the silicon substrate; a metal layer provided between the semiconductor element and the silicon substrate to cover the copper post; a first alloy layer provided between the copper post and the semiconductor element, wherein the first alloy layer includes alloy of gold and a metal of the metal layer; and a second alloy layer provided between the metal layer and the semiconductor element, wherein the second alloy layer includes alloy of gold and the metal of the metal layer. | 02-13-2014 |
20140055157 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. | 02-27-2014 |
20140266274 | PROBE GUIDE PLATE AND METHOD FOR MANUFACTURING THE SAME - There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed. | 09-18-2014 |
20140266275 | GUIDE PLATE FOR PROBE CARD - The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film. | 09-18-2014 |