Patent application number | Description | Published |
20100085058 | TRAINLINE INTEGRITY LOCOMOTIVE TEST DEVICE - A trainline integrity locomotive test device is provided that is configured to provide conventionally provided End-Of-Train (EOT) functionality required for a single locomotive test as well as functionality necessary for troubleshooting electrical problems in trainline electrical conductors, wherein the trainline integrity locomotive test device includes a reduced number of components in comparison with a conventional EOT device. Additionally, the test device is provided in more compact, durable and robust form relative to conventional EOT devices. As part of the transmission of trainline integrity data from the test device to the Head-End-Unit, a communications heartbeat signal is substituted for brake pipe pressure conventionally detected by EOT devices, so as to provide an indication of data communication reliability. | 04-08-2010 |
20110126732 | AUXILLIARY SMART POWER SYSTEM FOR ECP EQUIPPED TRAIN - A controlled power system is in a train having electric controlled pneumatic (ECP) brakes on cars of the train connected to a trainline which carries electric power and control signals and having at lease one auxiliary device on some of the cars. The power system on a car having the auxiliary device includes a power module connecting the auxiliary device to a source of power when activated; and a first controller, including a transceiver, for activating the power module to the connect the source of power to the auxiliary device in response to a power up signal on the trainline. | 06-02-2011 |
20140257605 | ON-BOARD BRAKE SYSTEM DIAGNOSTIC AND REPORTING SYSTEM - A brake valve diagnostic and reporting system for a pneumatic only brake valve on a rail car which includes a brake pipe transducer for measuring brake pipe pressure; and a brake cylinder transducer for measuring brake cylinder pressure. A processor receives measurements from the transducers, compares the measurements against stored brake performance profiles, determines brake status from the comparison and prepares an event report for preselected brake statuses. A wireless transmitter connected to the processor transmits the report. An energy storage device powers the processor and transmitter. | 09-11-2014 |
Patent application number | Description | Published |
20140183757 | SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT - A method of fabricating a semiconductor device includes forming a passivation layer on a least one capping layer of the semiconductor device, and forming an encapsulant layer on the passivation layer. The method further includes patterning the encapsulant layer to expose a portion of the passivation layer and forming a final via opening in the passivation layer. A conductive material is deposited in the final via opening. The method further includes planarizing the conductive material until reaching a remaining portion of the encapsulant layer such that the conductive material is flush with the encapsulant layer and the passivation layer is preserved. | 07-03-2014 |
20140319522 | FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES - Disclosed are a method for metallization during semiconductor wafer processing and the resulting structures. In this method, a passivation layer is patterned with first openings aligned above and extending vertically to metal structures below. A mask layer is formed and patterned with second openings aligned above the first openings, thereby forming two-tier openings extending vertically through the mask layer and passivation layer to the metal structures below. An electrodeposition process forms, in the two-tier openings, both under-bump pad(s) and additional metal feature(s), which are different from the under-bump pad(s) (e.g., a wirebond pad; a final vertical section of a crackstop structure; and/or a probe pad). Each under-bump pad and additional metal feature initially comprises copper with metal cap layers thereon. The mask layer is removed, an additional mask layer is formed and patterned with third opening(s) exposing only the under-bump pad(s) and solder material is deposited on the under-bump pad(s). | 10-30-2014 |
20160035641 | SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT - A method of fabricating a semiconductor device includes forming a passivation layer on a least one capping layer of the semiconductor device, and forming an encapsulant layer on the passivation layer. The method further includes patterning the encapsulant layer to expose a portion of the passivation layer and forming a final via opening in the passivation layer. A conductive material is deposited in the final via opening. The method further includes planarizing the conductive material until reaching a remaining portion of the encapsulant layer such that the conductive material is flush with the encapsulant layer and the passivation layer is preserved. | 02-04-2016 |
Patent application number | Description | Published |
20100295240 | LARGE FORMAT STACKING TRAY FOR AN IMAGE PRODUCTION DEVICE - A large format stacking tray in an image production device is disclosed. The large format stacking tray may include a tray body of a first length that may be attachable to a stacker device in a finishing module of the image production device, and a tray top surface located on top of the tray body on which a media stack containing one or more media sheets rests upon after being output by the image production device. The tray top surface has a first end and a second end opposite the first end. The tray top surface may be sloped between the first end and the second end in a manner that permits media sheets that are longer than the first length to be output and stacked onto the stacker device. | 11-25-2010 |
20110064507 | Media Inversion System for A Continuous Web Printer - A continuous web inversion system for use in a continuous web imaging device includes a first turn bar positioned to receive a substantially continuous web moving in a first direction with a first surface facing in a printing direction and to flip the web and direct it in a second direction perpendicular to the first direction. A second turn bar is positioned to receive the continuous web from the first turn bar to flip the web and direct it in a third direction opposite the first direction. A third turn bar is positioned to receive the continuous web from the second turn bar to flip the web and direct it in the first direction with a second surface of the web facing in the printing direction. The second and the third turn bars are coupled together and supported for translation along an axis perpendicular to the first direction. A sensor is configured to generate a signal indicative of a lateral position of the continuous web exiting the third turn bar. A driver is operably coupled to at least one of the second and the third turn bars to adjust a position of the third turn bar along the axis based on the signal. | 03-17-2011 |
20110150552 | Spreader Module for Duplex Continuous Feed Imaging Devices - A modular roll bar assembly for use in a continuous web imaging device includes a plurality of roll bars and a support frame configured to operably support the plurality of roll bars such that the plurality of roll bars define a web path having a non-linear shape with an entrance end and an exit end. The entrance end is configured to receive a substantially continuous web of substrate material, and the plurality of roll bars is configured to guide the continuous web past the exit end. A load cell is operably coupled to the support frame and configured to generate a signal indicative of a down force applied to the support frame. A controller is operably coupled to the load cell to receive the signal and to correlate the down force applied to the support frame indicated by the signal to a tension measurement value for the continuous web. | 06-23-2011 |
20130002779 | Media Inversion System For A Continuous Web Printer - A continuous web inversion system used in a continuous web imaging device includes a first, a second, and a third turn bar. The web moves over the three turn bars to invert the web for duplex printing. The second and third turn bars are operatively connected to one another for translation in a plane and a driver is operatively connected to one of the second and third turn bars to translate the bars in the plane. A sensor is configured to generate a signal indicative of a lateral position of the continuous web exiting the third turn bar. The driver adjusts a position of the third turn bar with reference to the signal generated by the sensor. | 01-03-2013 |
20130336690 | APPARATUS, METHOD AND SYSTEM FOR CONTROLLING NIP GEOMETRY IN A PRINTING SYSTEM - An apparatus, system and method are provided for fusing an image to a substrate at a fusing nip defined by a first pressure member and a pressure belt in a belt-roll fuser. The belt-roll fuser has a fuser belt having a portion that faces a surface of the first pressure member at the fusing nip. The pressure belt has a portion that faces another portion of the fuser belt at the fusing nip. The belt-roll fuser also has a group of elements configured to constrain the pressure belt such that another portion of the pressure belt faces a surface of a backing element at the fusing nip. | 12-19-2013 |
Patent application number | Description | Published |
20090185712 | METHOD FOR REAL-TIME VISUALIZATION OF CARIES CONDITION - A method for displaying live video of a tooth identifies a tooth tissue region in a viewable image frame obtained from a video stream and processes pixel data within the tooth tissue region to identify a suspected caries site. Intensity values for pixels that correspond to the suspected caries site are modified and a highlighted viewable image frame is formed as a combination of the modified intensity values corresponding to the suspected caries site and other pixel values in the viewable image frame. The highlighted viewable image frame is displayed in video form. | 07-23-2009 |
20090274998 | OPTICAL DETECTION OF DENTAL CARIES - A method for caries detection uses an image capture device ( | 11-05-2009 |
20100165089 | APPARATUS FOR CARIES DETECTION - An apparatus for imaging a tooth having a light source with a first spectral range and a second spectral range. A polarizing beamsplitter ( | 07-01-2010 |
20120237890 | APPARATUS FOR CARIES DETECTION - An apparatus for obtaining an image of a tooth having at least one light source providing incident light having a first spectral range for obtaining a reflectance image from the tooth and a second spectral range for exciting a fluorescence image from the tooth. A polarizing beamsplitter in the path of the incident light from both sources directs light having a first polarization state toward the tooth and directs light from the tooth having a second polarization state along a return path toward a sensor, wherein the second polarization state is orthogonal to the first polarization state. A first lens in the return path directs image-bearing light from the tooth toward the sensor, and obtains image data from the portion of the light having the second polarization state. A long-pass filter in the return path attenuates light in the second spectral range. | 09-20-2012 |
20130302746 | APPARATUS FOR CARIES DETECTION - An apparatus for obtaining an image of a tooth having at least one light source providing incident light having a first spectral range for obtaining a reflectance image from the tooth and a second spectral range for exciting a fluorescence image from the tooth. A polarizing beamsplitter in the path of the incident light from both sources directs light having a first polarization state toward the tooth and directs light from the tooth having a second polarization state along a return path toward a sensor, wherein the second polarization state is orthogonal to the first polarization state. A first lens in the return path directs image-bearing light from the tooth toward the sensor, and obtains image data from the portion of the light having the second polarization state. A long-pass filter in the return path attenuates light in the second spectral range. | 11-14-2013 |
20150245770 | APPARATUS FOR CARIES DETECTION - An apparatus for obtaining an image of a tooth having at least one light source providing incident light having a first spectral range for obtaining a reflectance image from the tooth and a second spectral range for exciting a fluorescence image from the tooth. A polarizing beamsplitter in the path of the incident light from both sources directs light having a first polarization state toward the tooth and directs light from the tooth having a second polarization state along a return path toward a sensor, wherein the second polarization state is orthogonal to the first polarization state. A first lens in the return path directs image-bearing light from the tooth toward the sensor, and obtains image data from the portion of the light having the second polarization state. A long-pass filter in the return path attenuates light in the second spectral range. | 09-03-2015 |
Patent application number | Description | Published |
20080217777 | EMBEDDED BARRIER FOR DIELECTRIC ENCAPSULATION - A semiconductor interconnect structure and method providing an embedded barrier layer to prevent damage to the dielectric material during or after Chemical Mechanical Polishing. The method employs a combination of an embedded film, etchback, using either selective CoWP or a conformal cap such as a SiCNH film, to protect the dielectric material from the CMP process as well as subsequent etch, clean and deposition steps of the next interconnect level. | 09-11-2008 |
20080231312 | Structure for modeling stress-induced degradation of conductive interconnects - A structure representative of a conductive interconnect of a microelectronic element is provided, which may include a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between the upper and lower surfaces, the upper surface defining a horizontally extending plane. The structure may also include a lower via having a top end in conductive communication with the metallic plate and a bottom end vertically displaced from the top end. A lower conductive or semiconductive element can be in contact with the bottom end of the lower via. An upper metallic via can lie in at least substantial vertical alignment with the lower conductive via, the upper metallic via having a bottom end in conductive communication with the metallic plate and a top end vertically displaced from the bottom end. The upper metallic via may have a width at least about ten times than the length of the metallic plate and about ten times smaller than the width of the metallic plate. The structure may further include an upper metallic line element in contact with the top end of the upper metallic via. | 09-25-2008 |
20090006014 | Non-Destructive Electrical Characterization Macro and Methodology for In-Line Interconnect Spacing Monitoring - A method for determining a line-to-line spacing of a device. The method includes experimentally determining a slope k | 01-01-2009 |
20090146143 | TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNESSES FOR DUAL DAMASCENE PROCESSING - A test structure for integrated circuit (IC) device fabrication includes a plurality of test structure chains formed at various regions of an IC wafer, each of the plurality of test structure chains including one or more vias; each of the one or more vias in contact with a conductive line disposed thereabove, the conductive line being configured such that at least one dimension thereof varies from chain to chain so as to produce variations in seed layer and liner layer thickness from chain to chain for the same deposition process conditions. | 06-11-2009 |
20100164116 | ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT - A liner-to-liner direct contact is formed between an upper metallic liner of a conductive via and a lower metallic liner of a metal line below. The liner-to-liner contact impedes abrupt electromigration failures and enhances electromigration resistance of the metal interconnect structure. The at least one dielectric material portion may include a plurality of dielectric material portions arranged to insure direct contact of between the upper metallic liner and the lower metallic liner. Alternatively, the at least one dielectric material portion may comprise a single dielectric portion of which the area has a sufficient lateral overlap with the area of the conductive via to insure that a liner-to-liner direct contact is formed within the range of allowed lithographic overlay variations. | 07-01-2010 |
20120119366 | ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT - A liner-to-liner direct contact is formed between an upper metallic liner of a conductive via and a lower metallic liner of a metal line below. The liner-to-liner contact impedes abrupt electromigration failures and enhances electromigration resistance of the metal interconnect structure. The at least one dielectric material portion may include a plurality of dielectric material portions arranged to insure direct contact of between the upper metallic liner and the lower metallic liner. Alternatively, the at least one dielectric material portion may comprise a single dielectric portion of which the area has a sufficient lateral overlap with the area of the conductive via to insure that a liner-to-liner direct contact is formed within the range of allowed lithographic overlay variations. | 05-17-2012 |
20150262899 | METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY - A test structure used to determine reliability performance includes a patterned metallization structure having multiple interfaces, which provide stress risers. A dielectric material surrounds the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design. | 09-17-2015 |