Patent application number | Description | Published |
20080241747 | Positive Resist Composition and Method of Forming Resist Pattern - A positive resist composition that exhibits a large exposure margin, and excellent levels of resolution and dry etching resistance, as well as a method of forming a resist pattern that uses the positive resist composition. This resist composition includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) contains a structural unit (a1) represented by a general formula (I) shown below, a structural unit (a2) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acid dissociable, dissolution inhibiting group (II) represented by a general formula (II) shown below, and a structural unit (a3) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acyclic acid dissociable, dissolution inhibiting group (III). | 10-02-2008 |
20090029284 | PATTERN COATING MATERIAL AND PATTERN FORMING METHOD - There are provided a coating material which improves an etching resistance of a pattern in an etching process using a pattern formed on a substrate as a mask. | 01-29-2009 |
20100247799 | APPLICATION LIQUID AND METHOD FOR FORMATION OF A SILICA-BASED COATING FILM USING THE APPLICATION LIQUID - An application liquid capable of forming a dense silica-based coating film even when embedded into a fine groove, and a method for formation of a silica-based coating film using the application liquid are provided. An application liquid is used including (A) a siloxane polymer, and (B) a base generator represented by the following general formula (I): | 09-30-2010 |
20110065053 | MATERIAL FOR FORMING PROTECTIVE FILM AND METHOD FOR FORMING PHOTORESIST PATTERN - The present invention provides a material for forming a protective film that has favorable alkali solubility and gives a protective film excelling in water repellency, as well as a method for forming a photoresist pattern using this material for forming a protective film. The material for forming a protective film of the present invention contains an alkali-soluble polymer having a unit derived from a monomer represented by the following general formula (A-1) as a constitutional unit. | 03-17-2011 |
20130017501 | METHOD OF FORMING RESIST PATTERNAANM Nakamura; TsuyoshiAACI Kawasaki-shiAACO JPAAGP Nakamura; Tsuyoshi Kawasaki-shi JPAANM Ishikawa; KiyoshiAACI Kawasaki-shiAACO JPAAGP Ishikawa; Kiyoshi Kawasaki-shi JP - A method of forming a resist pattern, comprising: a step of forming a resist film on a substrate using a resist composition containing a base component (A) which exhibits decreased solubility in an organic solvent under action of acid and an acid-generator component (B) which generates acid upon exposure; a step of subjecting the resist film to exposure; a step of patterning the resist film by a negative-tone development using a developing solution containing the organic solvent to form a resist pattern; a step of applying a coating material to the resist pattern, thereby forming a coating film; a step of performing a thermal treatment at a temperature lower than the softening point of the resist pattern, thereby heat shrinking the coating film to narrow an interval between the resist pattern; and a step of removing the coating film. | 01-17-2013 |
20150044617 | METHOD FOR FORMING RESIST PATTERN - A method of forming a resist pattern, and a film including a metal-containing compound formed on the resist pattern while developing the resist pattern. The method uses an organic solvent developer liquid, in which a metal compound capable of generating a hydroxyl group upon hydrolysis is dissolved in an organic solvent that does not have a functional group that reacts with the metal compound. | 02-12-2015 |
Patent application number | Description | Published |
20100176983 | ANALOG-TO-DIGITAL CONVERTER CIRCUIT - An analog-to-digital converter circuit includes: a capacitor array including a plurality of first capacitors, each having a first terminal connecting to a common node and having a capacitance represented by the nth power of 2 (2 | 07-15-2010 |
20100259432 | DIGITAL-TO-ANALOG CONVERTER AND SUCCESSIVE APPROXIMATION TYPE ANALOG-TO-DIGITAL CONVERTER INCLUDING THE SAME - A digital-to-analog converter generates a voltage from power supply and ground voltages, generates upper and lower limit reference voltages for a reference width which regards the generated voltage as an intermediate potential, converts a change in an analog input signal with respect to the upper and lower limit reference voltages into a digital code, and performs a control in order to achieve a sample and hold of the analog input signal. | 10-14-2010 |
20110215956 | ANALOG-TO-DIGITAL CONVERTER AND CORRECTION METHOD THEREOF - An analog-to-digital (AD) converter device, includes: a capacitive digital-to-analog converter (DAC) including a reference capacitor group having capacitors which are weighted with a ratio, one terminal of each of the capacitors being coupled to a common signal line, the other terminal of each of the capacitors being coupled to one of reference power supplies via one of switches; a comparator to compare a voltage of the common signal line with a reference voltage; a successive approximation routine circuit to control the switches based on a comparison result of the comparator; an offset correction circuit to correct an offset of the comparator; and a DAC correction circuit to correct an error in a voltage change of the common signal line, the offset correction circuit and the DAC correction circuit performing a correction so that a residual offset of the comparator and a residual error of the capacitive DAC cancel. | 09-08-2011 |
Patent application number | Description | Published |
20090155546 | FILM-FORMING COMPOSITION, METHOD FOR PATTERN FORMATION, AND THREE-DIMENSIONAL MOLD - Disclosed are a film-forming composition which can form a pattern having an enhanced contrast by the action of uneven surface morphology produced after image development, and a method for forming a pattern and a three-dimensional mold using the composition. A composition comprising at least one of a hydrolysate and a condensation product of an alkoxy metal compound represented by the chemical formula (A), the composition additionally comprising a compound which can respond to at least one of light and heat to control the solubility of a finished film in a developing solution. | 06-18-2009 |
20090263631 | FILM FORMING COMPOSITION FOR NANOIMPRINTING AND METHOD FOR PATTERN FORMATION - This invention provides a film forming composition for nanoimprinting, which has excellent resistance to etching with oxygen gas, can prevent the separation of a transfer pattern, can eliminate a problem of a holing time on a substrate, and is also excellent in transferability, and photosensitive resist, a nanostructure, a method for pattern formation using the same, and a program for realizing the method for pattern formation. The film forming composition for nanoimprinting comprises a polymeric silicon compound having the function of causing a photocuring reaction. Preferably, the polymeric silicon compound has a functional group cleavable as a result of response to electromagnetic waves and causes a curing reaction upon exposure to electromagnetic waves. More preferred are siloxane polymer compounds, silicon carbide polymer compounds, polysilane polymer compounds, and silazane polymer compounds, or any mixture thereof. | 10-22-2009 |
20100035177 | METHOD FOR FORMING PATTERN, AND MATERIAL FOR FORMING COATING FILM - A novel method for forming a pattern capable of decreasing the number of steps in a double patterning process, and a material for forming a coating film suitably used in the method for forming a pattern are provided. First resist film ( | 02-11-2010 |
20100090372 | COATING FORMATION AGENT FOR PATTERN MICRO-FABRICATION, AND MICROPATTERN FORMATION METHOD USING THE SAME - Provided are a coating formation agent for pattern micro-fabrication, and a method for forming a micropattern using the same, which enables: suppression and/or control of variation of the micro-fabrication size without being accompanied by defect generation following the micro-fabrication process even in ultramicro-fabrication particularly on the order of no greater than 120 nm, or a micro-fabrication process of a resist pattern with an increased aspect ratio; maintainance of a favorable resist pattern configuration after the micro-fabrication process while keeping the desired micro-fabrication size; and also avoidance of defects resulting from development of bacteria and the like after application of the coating formation agent for pattern micro-fabrication. The coating formation agent for pattern micro-fabrication of the present invention is a coating formation agent used for forming a micropattern by coating on a substrate having a photoresist pattern, the coating formation agent including: as component (a), a water soluble polymer; and, as component (b), at least one selected from quaternary ammonium hydroxide, alicyclic ammonium hydroxide and morpholinium hydroxide. | 04-15-2010 |
20100255429 | FINE PATTERN FORMING METHOD AND COAT FILM FORMING MATERIAL - Provided are a fine pattern forming method for forming a fine resin pattern having an excellent shape on a supporting body, and a coat film forming material used in the fine pattern forming method. A photosensitive resin composition is applied on the supporting body, selectively exposed and developed to form a first resin pattern. On the surface of the first resin pattern, a coat film composed of a water-soluble resin film is formed to form a coat pattern, then, on the supporting body whereupon the coat pattern is formed, a resin composition containing a photo-acid generating agent is applied, and the entire surface is exposed. Then, the work is cleaned by a solvent, and a second resin pattern wherein a resin film is formed on the surface of the coat pattern is formed. The coat film is formed by using the coat film forming material composed of an aqueous solution containing a water soluble resin and a water soluble cross-linking agent. | 10-07-2010 |