Patent application number | Description | Published |
20110286241 | LIGHT SOURCE MODULE - A light source module including a back frame, a light guide plate (LGP), and at least one light emitting device is provided. The back frame has a baseboard. The LGP is disposed on the back frame, and has a first surface, a second surface opposite to the first surface, and a light incident surface, wherein the second surface faces toward the baseboard. The light emitting device is disposed beside the light incident surface. The light source module further includes a thermal insulating element, which is disposed between the baseboard and the second surface, and is located adjacent to the light incident surface. | 11-24-2011 |
20120147627 | LIGHT GUIDE MODULE, BACKLIGHT MODULE AND FABRICATION METHOD OF LIGHT GUIDE MODULE - A light guide module includes a light guide plate and a diffuse reflector. The light guide plate has a light incidence surface, a light exiting surface, and a bottom surface, wherein the light exiting surface is opposite to the bottom surface, and the light incidence surface is connected with the light exiting surface and the bottom surface. The diffuse reflector is secured to the bottom surface of the light guide plate by an adhesive pattern layer, wherein the adhesive pattern layer is formed by a plurality of light-transmissive adhesive gels, and these light-transmissive adhesive gels do not contain any diffusive particles. A backlight module using the light guide module mentioned above and a fabricating method for the light guide module are also provided. | 06-14-2012 |
Patent application number | Description | Published |
20090079893 | Mold Frame and Bezel and Liquid Crystal Display Containing the Same - A mold frame and a bezel are disclosed. The mold frame includes a bottom portion having a first side, wherein the first side has a first end and a second end opposite to the first end, and there is only one stopper set disposed on the first side. The stopper set is composed of a plurality of stoppers sequentially arranged from the first end to the second end, wherein the first stopper of the stopper set is spaced a first distance apart from the first end; and/or the last stopper of the stopper set is spaced a second distance apart from the second end. The bezel is used for accommodating the aforementioned mold frame, and includes a first side structure having a first opening; and/or a second side structure having a second opening. A liquid crystal display is also disclosed, and includes the mold frame and bezel. | 03-26-2009 |
20100284202 | BACKLIGHT UNIT - A backlight unit includes a light guide plate and a plurality of light sources. A side of the light guide plate is provided with an optical microstructure including a plurality of convex lens members aligned along the side. The height-to-pitch ratios of the convex lens members in the central region of the optical microstructure are different from those of the convex lens members in the side regions of the optical microstructure. For example, the height-to-pitch ratios of the convex lens members in the central region of the optical microstructure are larger than the height-to-pitch ratios of the convex lens members in the side regions of the optical microstructure. The light sources may be light emitting diodes (LED) directed toward the optical microstructure. | 11-11-2010 |
20110037717 | Backlight Module with Low Electromagnetic Interference and Display Device Using the Same - A backlight module and a display device using the same are provided. The display device includes a display panel, an electromagnetic touch panel, and the backlight module overlapping one another. The backlight module has a light guide plate and a light source module consisting of a flexible circuit board strip and a plurality of light sources disposed thereon. The flexible circuit board strip includes a light source section, a connection section, and a signal transmission section. The light source section and the signal transmission section extend along a light entrance edge and a side edge adjacent to the light entrance edge of the light guide plate, respectively. Two ends of the connection section are connected to the light source section and the signal transmission section, respectively. The connection section includes at least one first fold making the light source disposing plane of the light source section and the wiring disposing plane of the signal transmission section be no coplanar and also makes the wiring disposing plane be perpendicular to the plane of the side edge of the light guide plate. | 02-17-2011 |
20110128722 | Double-Side Display Panel with Backlight Module Used Therein and Manufacture Method Thereof - A backlight module and a display device using the same are provided. The display device further includes a first panel and a second panel disposed on opposite sides of the backlight module. The backlight module has a light module and a back plate with a through hole formed on it. The light module includes a flexible circuit board having a first strip and a second strip. A plurality of first light sources and second light sources are respectively disposed on the first strip and the second strip. The flexible circuit board passes through the through hole, and the first strip and the second strip are on two opposite sides of the back plate. The first strip and the first light sources are distributed along a side of the first panel while a portion of the second strip is bent to extend along a side of the second strip. | 06-02-2011 |
20110134366 | Backlight Module and Display Device Having the Same - The present invention discloses a backlight module and a display device comprising the backlight module. The backlight module includes a light source, a light guide plate and a frame, wherein the light guide plate has a light entrance end and a first side. An angle is included between the light entrance end and the first side, wherein a plurality of light diffusing structures are formed on the light entrance end. The light source is disposed at a position corresponding to the light entrance end and emits a light toward the light diffusing structures. The frame has a first wall facing an inner surface of the first side. A centre line perpendicular to the light entrance end is defined on the light guide plate, wherein the distance between the inner surface and the centre line increases in a direction toward the light source. | 06-09-2011 |
20110234098 | Power Transmission Circuit with EMI Shielding, Lighting Module, and Panel Display Module - A power transmission circuit, a light source module including the power transmission circuit, and a panel display device are provided. The power transmission circuit includes a substrate, a power transmission layer, a metal shielding layer, a first protective layer, and a second protective layer. The substrate has a first surface and a second surface with the power transmission layer and the metal shielding layer respectively formed thereon. The metal shielding layer covers a projection region of a transmission section of the power transmission layer. The first and second protective layers are respectively disposed on the power transmission layer and the metal shielding layer and opposite to the substrate to protect the power transmission layer and the metal shielding layer. | 09-29-2011 |
20120155111 | BACKLIGHT MODULE - A reflective back cover made of plastic material having micro cellular structures is processed by compression molding and cutting so as to have a monolithical structure. The white material of the reflective back cover reflects lights such that the back cover can be an integral component featuring multiple functions of various components. With the thickness control of the reflective back cover, a concave can be formed at the side of the back cover where a light source is contained and the concave further retains the light source and its flexible printed circuit board. With the incorporation of the reflective back cover, the thickness of the backlight module can be reduced and a reliable and repetitive manufacturing of the backlight module can be introduced. | 06-21-2012 |
20120313889 | Touch Display Apparatus - A touch Display apparatus is disclosed. The touch Display apparatus includes a backlight module and a sensing plate. The backlight module includes a support member, a light guide plate, and a backlight source. The support member is formed by a non-metallic material and has a bottom and a plurality of sidewalls. The sides of the bottom connect with the sidewalls respectively to form a containing space. The light guide plate is disposed in the containing space and has a light emitting surface. A side of the containing space has a light incident end. The backlight source is disposed corresponding to the light incident end in the containing space. The backlight source generates a light emitting to the light incident end. The sensing plate is disposed on a lower surface of the bottom and senses an action of an item above the support member through an electromagnetic reaction. | 12-13-2012 |
20130003339 | SUPPORTING BASE AND DISPLAY DEVICE EMPLOYING THE SAME - A supporting base includes a bottom plate and a plurality of stepwise supporting structures connected with and raised up from a plurality of side edges of the bottom plate. Each stepwise supporting structure includes a plurality of raising segments and at least one supporting segment. The plurality of raising segments and the at least one supporting segment are alternately arranged. The at least one supporting segment is substantially parallel to the bottom plate. The lowest raising segment has a bottom end connected with one of the side edges of the bottom plate. A thickness of at least one of the at least one supporting segment is greater than that of at least one of the plurality of raising segments. A display device using the support base is also provided to improve assembling efficiency and reduce cost. | 01-03-2013 |
20130038809 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device includes a backlight module, a liquid crystal display panel, an insulating cover and a touch panel assembly. The insulating cover includes a reflective bottom plate for supporting the backlight module, at least one first sidewall with a first end and an opposite second end, at least one second sidewall with a third end and an opposite fourth end and a supporting plate connected to the opposite second end of the first sidewall and the third end of the second sidewall. The supporting plate is arranged in parallel with the reflective bottom plate and has an upper surface for supporting the liquid crystal display panel. The securing frame has a first end portion fixed to a lower surface of the supporting and a second end portion. | 02-14-2013 |
20140160375 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device includes a backlight module, a liquid crystal display panel, an insulating cover and a touch panel assembly. The insulating cover includes a reflective bottom plate for supporting the backlight module, at least one first sidewall with a first end and an opposite second end, at least one second sidewall with a third end and an opposite fourth end and a supporting plate connected to the opposite second end of the first sidewall and the third end of the second sidewall. The supporting plate is arranged in parallel with the reflective bottom plate and has an upper surface for supporting the liquid crystal display panel. The securing frame has a first end portion fixed to a lower surface of the supporting and a second end portion. | 06-12-2014 |
20140321154 | BACKLIGHT MODULE - A reflective back cover made of plastic material having micro cellular structures is processed by compression molding and cutting so as to have a monolithical structure. The white material of the reflective back cover reflects lights such that the back cover can be an integral component featuring multiple functions of various components. With the thickness control of the reflective back cover, a concave can be formed at the side of the back cover where a light source is contained and the concave further retains the light source and its flexible printed circuit board. With the incorporation of the reflective back cover, the thickness of the backlight module can be reduced and a reliable and repetitive manufacturing of the backlight module can be introduced. | 10-30-2014 |
Patent application number | Description | Published |
20140070403 | Packaging Methods and Packaged Devices - Packaging methods and packaged devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes forming a first redistribution layer (RDL) over a carrier, and forming a plurality of through assembly vias (TAVs) over the first RDL. An integrated circuit die is coupled over the first RDL, and a molding compound is formed over the first RDL, the TAVs, and the integrated circuit die. A second RDL is formed over the molding compound, the TAVs, and the integrated circuit die. | 03-13-2014 |
20140131858 | Warpage Control of Semiconductor Die Package - Various embodiments of mechanisms for forming a die package using a compressive dielectric layer to contact and to surround through substrate vias (TSVs) in the die package are provided. The compressive dielectric layer reduces or eliminates bowing of the die package. As a result, the risk of broken redistribution layer (RDL) due to bowing is reduced or eliminated. In addition, the compressive dielectric layer, which is formed between the conductive TSV columns and surrounding molding compound, improves the adhesion between the conductive TSV columns and the molding compound. Consequently, the reliability of the die package is improved. | 05-15-2014 |
20140239507 | Peripheral Electrical Connection of Package on Package - Various embodiments of mechanisms for forming a die package using through sidewall vias (TsVs), which are formed by sawing through substrate via (TSV) in half, at edges of dies described enable various semiconductor dies and passive components be electrically connected to achieve targeted electrical performance. Redistribution structures with redistribution layers (RDLs) are used along with the TsVs to enable the electrical connections. Since the TsVs are away from the device regions, the device regions do not suffer from the stress caused by the TSV formation. In addition, electrical connections between upper and lower dies by the TsVs increases the efficiency of the area utilization of the die package. | 08-28-2014 |
Patent application number | Description | Published |
20140183633 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes partially manufacturing a fin field effect transistor (FinFET) including a semiconductor fin comprising a first semiconductive material and a second semiconductive material disposed over the first semiconductive material. A top portion of the second semiconductive material of the semiconductor fin is removed, and a top portion of the first semiconductive material is exposed. A top portion first semiconductive material is removed from beneath the second semiconductive material. The first semiconductive material and the second semiconductive material are oxidized, forming a first oxide comprising a first thickness on the first semiconductive material and a second oxide comprising a second thickness on the second semiconductive material, the first thickness being greater than the second thickness. The second oxide is removed from the second semiconductive material, and manufacturing of the FinFET is completed. | 07-03-2014 |
20140206164 | Chemical Mechanical Polish in the Growth of Semiconductor Regions - A method includes performing a first planarization step to remove portions of a semiconductor region over isolation regions. The first planarization step has a first selectivity, with the first selectivity being a ratio of a first removal rate of the semiconductor region to a second removal rate of the isolation regions. After the isolation regions are exposed, a second planarization step is performed on the isolation regions and a portion of the semiconductor region between the isolation regions. The second planarization step has a second selectivity lower than the first selectivity, with the second selectivity being a ratio of a third removal rate of the portion of semiconductor region to a fourth removal rate of the isolation regions. | 07-24-2014 |
20140264362 | Method and Apparatus for Forming a CMOS Device - A method and apparatus for forming a CMOS device are provided. The CMOS device may include an N-type channel region formed of an III-V material and a P-type channel region formed of a germanium material. Over each channel may be formed corresponding gates and source/drain regions. The source/drain regions may be formed of a germanium material and one or more metallization layers. An anneal may be performed to form ohmic contacts for the source/drain regions. Openings may be formed in a dielectric layer covering the device and conductive plugs may be formed to provide contact to the source/drain regions. | 09-18-2014 |
20140273366 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes providing a workpiece including an n-type field effect transistor (N-FET) region, a p-type FET (P-FET) region, and an insulating material disposed over the N-FET region and the P-FET region. The method includes patterning the insulating material to expose a portion of the N-FET region and a portion of the P-FET region, and forming an oxide layer over the exposed portion of the N-FET region and the exposed portion of the P-FET region. The oxide layer over the P-FET region is altered, and a metal layer is formed over a portion of the N-FET region and the P-FET region. The workpiece is annealed to form a metal-insulator-semiconductor (MIS) tunnel diode over the N-FET region and a silicide or germinide material over the P-FET region. | 09-18-2014 |
20140273412 | Methods for Wet Clean of Oxide Layers over Epitaxial Layers - Methods for an oxide layer over an epitaxial layer. In an embodiment, a method includes forming an epitaxial layer of semiconductor material over a semiconductor substrate; forming an oxide layer over the epitaxial layer; applying a solution including an oxidizer to the oxide layer; and cleaning the oxide layer with a cleaning solution. In another embodiment, a densification process is applied to an oxide layer including treating with thermal energy, UV energy, or both. In an embodiment for a gate-all-around device, the cleaning process is applied to an oxide layer over an epitaxial portion of a fin. Additional methods are disclosed. | 09-18-2014 |
20150028389 | SEMICONDUCTOR DEVICES COMPRISING A FIN - A semiconductor device may include a fin disposed over a workpiece. The fin may include: a first semiconductive material disposed over the workpiece; an oxide of the first semiconductive material disposed over the first semiconductive material; a second conductive material disposed over and spaced apart from the oxide of the first semiconductive material; a first insulating material disposed around and lining the second semiconductive material; a conductive material disposed around the first insulating material; and a second insulating material disposed between the oxide of the first semiconductive material and a portion of the conductive material facing the workpiece, the second insulating material further lining sidewalls of the conductive material. | 01-29-2015 |