Patent application number | Description | Published |
20090079648 | HIGH FREQUENCY MODULE - To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss. | 03-26-2009 |
20090127674 | MULTILAYER DIELECTRIC SUBSTRATE AND SEMICONDUCTOR PACKAGE - A multilayer dielectric substrate that mounts a semiconductor device in a cavity formed on a substrate. The multilayer dielectric substrate includes an opening formed in a surface-layer grounding conductor on the substrate in the cavity, and an impedance transformer, with a length of about ¼ of an in-substrate effective wavelength of a signal wave, electrically connected through the opening to the cavity. The multilayer dielectric substrate further includes a short-circuited end dielectric transmission line with a length of about ¼ of the in-substrate effective wavelength of the signal wave, a coupling opening formed on an inner-layer grounding conductor in a connecting section of the impedance transformer and the dielectric transmission line, and a resistor formed in the coupling opening. | 05-21-2009 |
20090309680 | WAVEGUIDE CONNECTION STRUCTURE - A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave. | 12-17-2009 |
20100117711 | SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT - A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit. | 05-13-2010 |
20100315177 | EVEN HARMONIC MIXER - Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about ½ wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about ¼ wavelength at the RF signal frequency. | 12-16-2010 |
20100315799 | HIGH FREQUENCY STORING CASE AND HIGH FREQUENCY MODULE - A cavity configured by electrically connecting an earth conductor formed on a multilayer dielectric substrate and on which a plurality of high frequency circuits are mounted, and a shield cover member. A waveguide aperture is formed on the earth conductor on which the high frequency circuits are mounted and is electrically coupled to the cavity, and an end-short-circuited dielectric waveguide formed in a direction of layer lamination of the multilayer dielectric substrate is connected to the waveguide aperture, and has a length approximately ¼ of an effective wavelength in the substrate of a signal wave. Spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity. | 12-16-2010 |
20110163919 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE - Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate ( | 07-07-2011 |
20110175793 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE - Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate ( | 07-21-2011 |
20110187482 | WAVEGUIDE CONNECTION STRUCTURE - A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern. | 08-04-2011 |
20110241805 | WAVEGUIDE CONNECTION BETWEEN A MULTILAYER WAVEGUIDE SUBSTRATE AND A METAL WAVEGUIDE SUBSTRATE INCLUDING A CHOKE STRUCTURE IN THE MULTILAYER WAVEGUIDE - A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where μ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave. | 10-06-2011 |
20140085858 | HIGH-FREQUENCY PACKAGE - A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element. | 03-27-2014 |
20150257254 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE - Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate ( | 09-10-2015 |
20150299370 | METHOD FOR PRODUCING A POLYMER, POLYMER SOLUTION AND POLYMER - The present invention provides a method for producing a polymer by efficiently removing residue of metals such as titanium, aluminum and lithium from a polymer solution containing the residue of these metals to successfully obtain a purified polymer solution containing a smaller amount of the metal residue and having satisfactory color tone and transparency, a polymer solution and a polymer obtained by the production method. | 10-22-2015 |
20150353669 | Method for Producing Polymer - A method for producing a polymer has: a polymerization step of polymerizing at least a conjugated diene monomer in a hydrocarbon solvent using an organolithium compound as a polymerization initiator, and obtaining a polymer; and, following steps (1) to (4), successively performing after the polymerization step: (1) a step of mixing an acid and water of 20 to 300 parts by mass into the solution containing the polymer of 100 parts by mass, (2) a step of adjusting an amount of the water to 10 parts by mass or less based on 100 parts by mass of the solution containing the polymer, (3) a step of adding a carbon oxide gas and/or a compound to be decarboxylated to the solution containing the polymer, and (4) a step of removing a solvent from the solution containing the polymer until a concentration of the polymer reaches 95 mass % or more. | 12-10-2015 |
Patent application number | Description | Published |
20090108225 | VALVE DEVICE AND MANUALLY OPERATED SHUTOFF VALVE DEVICE - In a valve device for selectively opening and closing a flow passage formed to open on a valve seat by a valve body through a resin-made seat, a hollow portion is formed on either one of the valve body and the valve seat and receives the resin-made seat therein, the resin-made seat has a thickness so that the resin-made seat partly protrudes from the hollow portion, and when the valve body is operated to close the flow passage, the resin-made seat is compressed to bring an end surface of the valve body into contact with the valve seat. | 04-30-2009 |
20090283154 | FLUID SUPPLY VALVE ATTACHMENT DEVICE - A fluid supply valve attachment device that has a tank, a fixing member in which a recessed fitting section is formed, a fluid supply valve that is inserted in and fixed to the recessed fitting section, a first seal member which seals a space between the tank and the fixing member, and a second seal member which seals a space between the fixing member and the fluid supply valve. The maximum inside diameter of the recessed fitting section is defined as D, a distance between a cross-sectional center of the first seal member and a cross-sectional center of the second seal member in a direction that a central axial line of the recessed fitting section extends in an attached state is defined as L | 11-19-2009 |
20090285650 | COMPONENT HOLDING DEVICE - A component holding device includes: a fixing member that has a first inner wall surface that forms a first hole into which gas can be entered and a component can be inserted; a component holding section that is fit to the first hole of the fixing member and that holds the component; a sealing section that is provided in the first hole and that seals the component holding section to prevent water from entering into the first hole of the fixing member; and a vent path that is provided in at least one of the fixing member and the component holding section so as to communicate with a gas residual section in the component insertion hole and that discharges leaked gas in the gas residual section to outside air. | 11-19-2009 |
20090288723 | VALVE DEVICE - A valve device includes: a valve housing defining a cylindrical space connected to a high-pressure source, and having a first communication hole open at a valve seat located at a bottom portion of the valve housing and providing fluid communication between the cylindrical space and a low-pressure source; a seal member arranged in the cylindrical space and providing or shutting off fluid communication between the high-pressure and low-pressure sources so that the seal member moves away from or contacts the valve seat; and a stem having an accommodating recess at one end of the stem and moved axially. The seal member is fitted and held in the accommodating recess. The seal member has a second communication hole that provides fluid communication between a bottom face of the accommodating recess and the low-pressure source when the seal member is in contact with the valve seat. | 11-26-2009 |
20090308465 | VALVE DEVICE - A valve device includes: a valve member that controls flow of a fluid, and a body that has a valve insertion hole in which the valve member is inserted, and whose inner surface is cylindrically formed, and into which the fluid flows, and a lead-in passage that has an opening in the inner surface of the valve insertion hole, and that causes the fluid to flow into the valve insertion hole. A line representing the direction of extension of the lead-in passage is tilted from a line normal to the inner surface of the valve insertion hole at a position of the opening of the lead-in passage, in a view in the axis direction of the valve insertion hole. | 12-17-2009 |
20110114867 | PRESSURE REDUCING VALVE - A pressure reducing valve ( | 05-19-2011 |
20160104903 | VALVE DEVICE - A valve device includes a body, a solenoid valve accommodated in an accommodation hole of the body, and a joint member fixed to the body. The solenoid valve includes: a sleeve having a tubular shape and fitted in the accommodation hole, and including an introduction passage and a delivery passage; and a valve element configured to open and close the passages. A U-seal is disposed between an outer wall surface of the sleeve and an inner wall surface of the accommodation hole. The body has an attachment hole that is located downstream of the delivery passage of the sleeve and opens on an outer surface of the body. The joint member including a backflow reduction valve is fixed to the attachment hole. | 04-14-2016 |
Patent application number | Description | Published |
20090136752 | INSULATED WIRE USING A RESIN COMPOSITION - An insulated wire uses a resin composition. The insulated wire includes a conductor; and an insulating material provided on the conductor, the insulating material includes a polyester resin in 100 parts by weight, a non-bromine flame retardant agent in 1-30 parts by weight, a polyorganosiloxane core-graft copolymer in 1-50 parts by weight, an inorganic porous filler in 0.1-50 parts by weight; and a hydrolysis resistance modifier in 0.05-10 parts by weight. | 05-28-2009 |
20110290525 | FLUORINE-CONTAINING ELASTOMER COVERED ELECTRIC WIRE, AND METHOD FOR MAKING SAME - A fluorine-containing elastomer covered electric wire includes a conductor, and a covering layer on a periphery of the conductor. The covering layer includes a composition including 100 parts by weight of a tetrafluoroethylene-propylene system copolymer and 0.1 to 10 parts by weight of a fatty acid amide. | 12-01-2011 |
20130240239 | PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION, PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT INSULATED ELECTRIC WIRE AND PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT CABLE - A phosphorus-free based halogen-free flame-retardant resin composition includes a base polymer including a copolymer of ethylene and α-olefin having carbon number of 3 to 8 polymerized by a metallocene catalyst as a main component, and 5 to 30 weight % of an ethylene-vinyl acetate copolymer that has a melt flow rate of not less than 50 g/min and a vinyl acetate content of not less than 40%, a metal hydroxide blended with the base polymer in a ratio of 100 to 250 parts by weight relative to 100 parts by weight of the base polymer, and a mineral oil blended with the base polymer in a ratio of 1 to 20 parts by weight relative to 100 parts by weight of the base polymer. | 09-19-2013 |