Patent application number | Description | Published |
20150275699 | METHOD FOR AUTOMATICALLY CONTROLLING A VAPOR CONTENT OF A WORKING MEDIUM HEATED IN A VAPORIZER OF A SYSTEM FOR CARRYING OUT A THERMODYNAMIC CYCLE, CONTROL UNIT FOR A SYSTEM, SYSTEM FOR A THERMODYNAMIC CYCLE, AND ARRANGEMENT CONSISTING OF AN INTERNAL COMBUSTION ENGINE AND A SYSTEM - A method for automatically controlling a steam content of a working medium heated in an evaporator of a system for carrying out a thermodynamic cycle with the following steps: carrying out a phase separation for the working medium downstream from the evaporator, wherein liquid components are separated from vapor components of the working medium; conducting the separated liquid components to a reservoir; determining a level in the reservoir; and varying a control variable for automatically controlling the steam content as a function of the level. | 10-01-2015 |
20150275778 | SYSTEM FOR A THERMODYNAMIC CYCLE, CONTROL UNIT FOR A SYSTEM FOR A THERMODYNAMIC CYCLE, METHOD FOR OPERATING A SYSTEM, AND ARRANGEMENT WITH AN INTERNAL COMBUSTION ENGINE AND A SYSTEM - A system for a thermodynamic cycle with a circuit for a working medium, wherein a medium quantity-variation device is provided, which is connected to the circuit in such a way and so configured that the quantity of working medium present in the circuit is changeable by the medium quantity-variation device during the operation of the system. | 10-01-2015 |
20150276283 | METHOD FOR OPERATING A SYSTEM FOR A THERMODYNAMIC CYCLE WITH A MULTI-FLOW EVAPORATOR, CONTROL UNIT FOR A SYSTEM, SYSTEM FOR A THERMODYNAMIC CYCLE WITH A MULTI-FLOW EVAPORATOR, AND ARRANGEMENT OF AN INTERNAL COMBUSTION ENGINE AND A SYSTEM - A method for operating a system for a thermodynamic cycle with a multi-flow evaporator having at least two evaporator flow channels, wherein the evaporator flow channels are made to approximate each other with respect to at least one operating parameter of the individual evaporator flow channels, and/or wherein a pressure drop across the evaporator is automatically controlled. | 10-01-2015 |
20150276284 | COOLING DEVICE FOR A CONDENSER OF A SYSTEM FOR A THERMODYNAMIC CYCLE, SYSTEM FOR A THERMODYNAMIC CYCLE, ARRANGEMENT WITH AN INTERNAL COMBUSTION ENGINE AND A SYSTEM, VEHICLE, AND A METHOD FOR CARRYING OUT A THERMODYNAMIC CYCLE - A cooling device for a condenser of a system for a thermodynamic cycle, with a coolant circuit, wherein a conveying device for conveying a coolant through the coolant circuit is provided, and wherein the coolant circuit includes a cold branch downstream from a cooling point for the coolant and a hot branch upstream of the cooling point. The conveying device has a variable output, and/or the coolant circuit has a connecting line between the hot branch and the cold branch. A mixing device is provided, by way of which a variable portion of coolant can be supplied from the hot branch to the cold branch via the connecting line, bypassing the cooling point. | 10-01-2015 |
Patent application number | Description | Published |
20120047259 | WEB HOSTED SECURITY SYSTEM COMMUNICATION - A distributed proxy server system is operable to receive a request for Internet data from a user, obtain the user's identity, store at least one cookie on the user's web browser identifying the user, and filter undesired content before forwarding requested Internet data to the user. A master cookie is associated with the proxy server including user identity information, and an injected domain cookie is associated with the domain of the requested Internet data including user identity information. | 02-23-2012 |
20120239751 | MULTI-DIMENSIONAL REPUTATION SCORING - Methods and systems for assigning reputation to communications entities include collecting communications data from distributed agents, aggregating the communications data, analyzing the communications data and identifying relationships between communications entities based upon the communications data. | 09-20-2012 |
20120240228 | MULTI-DIMENSIONAL REPUTATION SCORING - Methods and systems for assigning reputation to communications entities include collecting communications data from distributed agents, aggregating the communications data, analyzing the communications data and identifying relationships between communications entities based upon the communications data. | 09-20-2012 |
20140058945 | ANONYMOUS PAYMENT BROKERING - A payment brokering request is received from a first entity corresponding to a particular payment requested of an anonymous user, the payment brokering request including banking information of the first entity. A payment partner is identified that is associated with the anonymous user and it is communicated, to the payment partner, that the particular payment from the anonymous user has been requested. Confirmation data is received from the payment partner confirming that the particular payment was authorized by the anonymous user and that the payment partner will transfer funds to the broker banking system. In some instances, the payment request is forwarded by the privacy broker from the first entity, the payment request including a user identifier paired to the anonymous user and the first entity. The user can be identified, for instance, by the payment partner, from the user identifier. | 02-27-2014 |
20140059658 | PRIVACY BROKER - A brokered authentication request is received corresponding to an interaction between a particular user and a particular online entity. An identity provider corresponding to the particular user is identified that stores user data identifying the particular user. Confirmation is received that the identity provider has authenticated the particular user to a user profile maintained by the identity provider and a unique persistent user identifier is generated for the particular user that is unique within a system to a pairing of the first user with the first entity. The user identifier is caused to be communicated to the first entity for authenticating the first user in interactions with the first entity. | 02-27-2014 |
20140059693 | ANONYMOUS SHIPMENT BROKERING - A request is received for a brokered shipment from a particular entity to an anonymous user. A shipping identifier is obtained from a shipping entity, on behalf of the particular entity, for the shipment from the particular entity to the anonymous user. The shipping identifier is communicated to the particular entity and the shipping identifier is associated with a unique user identifier unique, within a system, to a pairing of the anonymous user with the particular entity. Address information of the anonymous user is unknown to the particular entity, and address information is obtained from the shipping entity for the anonymous user. In some aspects, address information of the particular user is received from a second entity and applied to the shipment identifier in connection with delivery of the shipment to the particular user. | 02-27-2014 |
20140181216 | Just-In-Time, Email Embedded URL Reputation Determination - A system allows just-in-time checking of information about an email in which a hyperlink is embedded. Upon receipt of the email containing the hyperlink, the resource locator of the hyperlink is modified to allow checking the reputation of the email upon traversal of the hyperlink. At traversal of the hyperlink, the current reputation of the resource locator and the current reputation of the email are both determined, and one or more actions are performed responsive to the determination. | 06-26-2014 |
20140258730 | DATA PROTECTION USING PROGRAMMATICALLY GENERATED KEY PAIRS FROM A MASTER KEY AND A DESCRIPTOR - Systems and methods are disclosed for allowing an authority to monitor a computer user's information in a most palatable manner for the computer user. The authority is provided access to information with encrypted user identification information and the user is notified if decryption is facilitated. The systems and methods also include a novel key production system whereby large numbers of deterministic key pairs may be created for use in the monitoring system. | 09-11-2014 |
20140366144 | MULTI-DIMENSIONAL REPUTATION SCORING - Methods and systems for assigning reputation to communications entities include collecting communications data from distributed agents, aggregating the communications data, analyzing the communications data and identifying relationships between communications entities based upon the communications data. | 12-11-2014 |
Patent application number | Description | Published |
20090079080 | Semiconductor Device with Multi-Layer Metallization - One or more embodiments are related to a semiconductor device, comprising: a metallization layer comprising a plurality of portions, each of the portions having a different thickness. The metallization layer may be a final metal layer. | 03-26-2009 |
20090085215 | Semiconductor component comprising copper metallizations - A semiconductor component having improved thermomechanical durability has in a semiconductor substrate at least one cell comprising a first main electrode zone, a second main electrode zone and a control electrode zone lying in between. For making contact with the main electrode zone, at least one metallization layer composed of copper or a copper alloy is provided which is connected to at least one bonding electrode which likewise comprises copper or a copper alloy. | 04-02-2009 |
20110095364 | SEMICONDUCTOR DEVICE AND METHOD - A semiconductor device and method is disclosed. One embodiment provides an active region in a semiconductor substrate, including a first terminal region and a second terminal region. wherein the active region is interrupted by an inactive region, wherein an electrical power dissipation in the inactive region is zero or smaller than an electrical power dissipation in the active region; and a metallization layer arranged with respect to the active region on a surface of the semiconductor device and at least partly overlapping the active area, wherein the metallization layer is divided into a first part, in electrical contact to the first terminal region, and a second part, in electrical contact to the second terminal region, wherein the first and the second part are separated by a gap; and wherein the gap and the inactive region are mutually arranged so that an electrical power dissipation below the gap is reduced compared to an electrical power dissipation below the first part and the second part of the metallization layer. | 04-28-2011 |
20110309441 | INTEGRATED SEMICONDUCTOR DEVICE HAVING AN INSULATING STRUCTURE AND A MANUFACTURING METHOD - An integrated semiconductor device is provided. The integrated semiconductor device has a first semiconductor region of a second conductivity type, a second semiconductor region of a first conductivity type forming a pn-junction with the first semiconductor region, a non-monocrystalline semiconductor layer of the first conductivity type arranged on the second semiconductor region, a first well and at least one second well of the first conductivity type arranged on the non-monocrystalline semiconductor layer and an insulating structure insulating the first well from the at least one second well and the non-monocrystalline semiconductor layer. Further, a method for forming a semiconductor device is provided. | 12-22-2011 |
20120175635 | Semiconductor Device Arrangement with a First Semiconductor Device and with a Plurality of Second Semiconductor Devices - A semiconductor device arrangement includes a first semiconductor device having a load path, and a number of second transistors, each having a load path between a first and a second load terminal and a control terminal. The second transistors have their load paths connected in series and connected in series to the load path of the first transistor. Each of the second transistors has its control terminal connected to the load terminal of one of the other second transistors. One of the second transistors has its control terminal connected to one of the load terminals of the first semiconductor device. | 07-12-2012 |
20130278372 | Semiconductor Component with Coreless Transformer - A semiconductor component has integrated a coreless transformer with a first connection contact, a second connection contact, an electrically conductive spiral first coil, an electrically conductive first ring, and an electrically conductive second ring. The electrically conductive spiral first coil is electrically connected between the first connection contact and the second connection contact. The electrically conductive first ring surrounds the first coil and one or both of the first connection contact and the second connection contact. The electrically conductive second ring is arranged between the first coil and the first ring, electrically connected to the first coil, and surrounds the first coil and one or both of the first connection contact and the second connection contact. | 10-24-2013 |
20130280879 | Method for Producing a Conductor Line - A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is provided. The partially completed semiconductor component has a bottom side and a top side spaced distant from the bottom side in a vertical direction. Also provided is an etchant. On the top side, a dielectric layer is arranged. The dielectric layer has at least two different regions that show different etch rates when they are etched with the etchant. Subsequently, a trench is formed in the dielectric layer such that the trench intersects each of the different regions. Then, the trench is widened by etching the trench with the etchant at different etch rates. By filling the widened trench with an electrically conductive material, a conductor line is formed. | 10-24-2013 |
20140042631 | SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS - A semiconductor component having improved thermomechanical durability has in a semiconductor substrate at least one cell comprising a first main electrode zone, a second main electrode zone and a control electrode zone lying in between. For making contact with the main electrode zone, at least one metallization layer composed of copper or a copper alloy is provided which is connected to at least one bonding electrode which likewise comprises copper or a copper alloy. | 02-13-2014 |
20140252627 | SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS - A semiconductor component having improved thermomechanical durability has in a semiconductor substrate at least one cell comprising a first main electrode zone, a second main electrode zone and a control electrode zone lying in between. For making contact with the main electrode zone, at least one metallization layer composed of copper or a copper alloy is provided which is connected to at least one bonding electrode which likewise comprises copper or a copper alloy. | 09-11-2014 |
20140287560 | INTEGRATED SEMICONDUCTOR DEVICE HAVING AN INSULATING STRUCTURE AND A MANUFACTURING METHOD - An integrated semiconductor device is provided. The integrated semiconductor device has a first semiconductor region of a second conductivity type, a second semiconductor region of a first conductivity type forming a pn-junction with the first semiconductor region, a non-monocrystalline semiconductor layer of the first conductivity type arranged on the second semiconductor region, a first well and at least one second well of the first conductivity type arranged on the non-monocrystalline semiconductor layer and an insulating structure insulating the first well from the at least one second well and the non-monocrystalline semiconductor layer. Further, a method for forming a semiconductor device is provided. | 09-25-2014 |
20150069424 | Semiconductor Component and Method of Triggering Avalanche Breakdown - A semiconductor component includes an auxiliary semiconductor device configured to emit radiation. The semiconductor component further includes a semiconductor device. An electrical coupling and an optical coupling between the auxiliary semiconductor device and the semiconductor device are configured to trigger emission of radiation by the auxiliary semiconductor device and to trigger avalanche breakdown in the semiconductor device by absorption of the radiation in the semiconductor device. The semiconductor device includes a pn junction between a first layer of a first conductivity type buried below a surface of a semiconductor body and a doped semiconductor region of a second conductivity type disposed between the surface and the first layer. | 03-12-2015 |
20150255551 | SEMICONDUCTOR STRUCTURE INCLUDING GUARD RING - One or more embodiments relate to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature. | 09-10-2015 |