Patent application number | Description | Published |
20090098731 | Methods for Forming a Through Via - A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the remaining portion of the void is filled. | 04-16-2009 |
20090127695 | SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT - A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used. | 05-21-2009 |
20090267220 | 3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES - Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices. | 10-29-2009 |
20110084368 | OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 04-14-2011 |
20120137514 | METHODS FOR FABRICATING AN OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 06-07-2012 |
20120146178 | OVERMOLDED SEMICONDUCTOR PACKAGE WITH WIREBONDS FOR ELECTROMAGNETIC SHIELDING - According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component. | 06-14-2012 |
Patent application number | Description | Published |
20130021219 | RADIO-FREQUENCY MODULES HAVING TUNED SHIELDING-WIREBONDS - Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement. | 01-24-2013 |
20130324069 | VIA DENSITY AND PLACEMENT IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data. | 12-05-2013 |
20130335288 | SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER - Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s). | 12-19-2013 |
20140002188 | POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS | 01-02-2014 |
20140016277 | RACETRACK DESIGN IN RADIO FREQUENCY SHIELDING APPLICATIONS - Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area. | 01-16-2014 |
20140167232 | SEGMENTED CONDUCTIVE GROUND PLANE FOR RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises an electrical reference, or ground, plane to which one or more RF devices disposed on the module are electrically coupled, and may be disposed beneath the RF devices. The reference plane may be segmented as to form one or more segments of the reference plane that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated reference planes, correspond to different devices of the module. The reference plane may be etched or cut to achieve such segmentation. | 06-19-2014 |
20140175621 | SYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices. | 06-26-2014 |
20140175622 | SEGMENTED CONDUCTIVE TOP LAYER FOR RADIO FREQUENCY ISOLATION - A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation. | 06-26-2014 |
20140307394 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection. | 10-16-2014 |
Patent application number | Description | Published |
20090255362 | Clean transfer robot - A robot with improved cleanliness for use in a clean environment is disclosed, having a uniform flow through the open interface between the clean environment and the interior of the robot housing, passing the particle generation area to an exhaust port, keeping the particles from the clean environment. The uniform flow reduces or eliminates the back flow, and further allows the scalability of the open interface to prevent particles generated from moving mechanisms within the robot housing to contaminate the clean environment. The uniform flow can be established by designing the flow dynamic, centering the exhaust port, or by restricting the flow along the elongated slot, for example, by uniformly restricting the flow along the elongated slot, or by implementing a restrictor along the elongated slot. | 10-15-2009 |
20140298946 | Clean Transfer Robot - A robot with improved cleanliness for use in a clean environment is disclosed, having a uniform flow through the open interface between the clean environment and the interior of the robot housing, passing the particle generation area to an exhaust port, keeping the particles from the clean environment. The uniform flow reduces or eliminates the back flow, and further allows the scalability of the open interface to prevent particles generated from moving mechanisms within the robot housing to contaminate the clean environment. The uniform flow can be established by designing the flow dynamic, centering the exhaust port, or by restricting the flow along the elongated slot, for example, by uniformly restricting the flow along the elongated slot, or by implementing a restrictor along the elongated slot. | 10-09-2014 |
20140308186 | Extended or Multiple Reaction Zones in Scrubbing Apparatus - Some industrial or fabrication processes generate effluent gas streams that require scrubbing. Scrubbing may include the use of one or more gases to abate the effluents for safer release into the environment. Systems and methods described herein provide a liquid-enclosed reaction chamber where an extended reaction zone or more than one reaction zone is formed. By having an extended reaction zone or more than one reaction zone, the effluent gas stream and the products of upstream reaction zones can be more completely abated. The reaction zones are formed by adding one or more gas ports into the reaction chamber downstream of a main burner nozzle. | 10-16-2014 |
20140308187 | SYSTEMS AND METHODS TO PREVENT BACK-FLASH IN AN ABATEMENT SYSTEM - Abatement systems are used to remove harmful pollutants resulting from manufacturing processes. Prior art abatement systems can dangerously back-flash due to, for example, changes in gas velocity and if the inlets become constricted due to clogs. To prevent back-flash a sprayer is introduced to an inlet of the abatement system. The sprayer sprays a volume of a cooling liquid, such as water, into the inlet. In the event of a back-flash, the liquid can extinguish the flame, preventing further damage to the abatement system. The sprayed liquid can provide further benefits, such as cooling the incoming, mitigating effects of reactions within the cooling gases,, and flushing away solid particles that would otherwise clog the inlet. These further benefits can allow the abatement system to safely handle additional gases and larger volumes of incoming gas. | 10-16-2014 |
Patent application number | Description | Published |
20090075431 | Wafer level package with cavities for active devices - According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer and the polymer walls to house the active device in a substantially enclosed cavity formed by the polymer walls and the blanket film. By way of examples and without limitation, the active device can be a microelectromechanical systems (“MEMS”) device, a bulk acoustic wave (“BAW”) filter, or a surface acoustic wave (“SAW”) filter. According to one embodiment, solder bumps can be applied to interconnect traces of the active device, and the semiconductor wafer can then be diced to form an individual die. According to another embodiment, the semiconductor wafer can be diced to form an individual die, then the individual die is wire bonded to a circuit board. | 03-19-2009 |
20090221129 | SEMICONDUCTOR SEAL RING AND METHOD OF MANUFACTURE THEREOF - An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used. | 09-03-2009 |