Lazarov
David Lazarov, Petah Tikva IL
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20110035805 | SYSTEMS AND METHODS FOR EFFICIENT DETECTION OF FINGERPRINTED DATA AND INFORMATION - The disclosed embodiments provide systems, methods, and apparatus for efficient detection of fingerprinted content and relate generally to the field of information (or data) leak prevention. Particularly, a compact and efficient repository of fingerprint ingredients is used to analyze content and determine the content's similarity to previously fingerprinted content. Some embodiments employ probabilistic indications regarding the existence of fingerprint ingredients in the repository. | 02-10-2011 |
Guenadiy Lazarov, Landing, NJ US
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20100012855 | Wafer Scanning - A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments. | 01-21-2010 |
Hristo Lazarov, Sofia BG
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20090215521 | Gaming machine with multiple games having individual and combined paylines - A gaming machine is configured to present multiple individual games to a player. The individual games each have a plurality of symbol locations which display symbols to a user. The symbols displayed in the symbol locations corresponding to one or more primary paylines are compared to predetermined winning symbol combinations to declare a winning outcome. One or more secondary paylines corresponding to symbol locations in more than one of the individual games may be compared to the winning symbol combinations to declare a winning outcome as well. The winning symbol combinations may be defined and presented to players by a paytable. The primary and secondary paylines may be fixed or selected by the player and may constitute a bonus win having a higher payout. | 08-27-2009 |
20120225709 | GAMING MACHINE WITH MULTIPLE GAMES HAVING INDIVIDUAL AND COMBINED PAYLINES - A gaming machine is configured to present multiple individual games to a player. The individual games each have a plurality of symbol locations which display symbols to a user. The symbols displayed in the symbol locations corresponding to one or more primary paylines are compared to predetermined winning symbol combinations to declare a winning outcome. One or more secondary paylines corresponding to symbol locations in more than one of the individual games may be compared to the winning symbol combinations to declare a winning outcome as well. The winning symbol combinations may be defined and presented to players by a paytable. The primary and secondary paylines may be fixed or selected by the player and may constitute a bonus win having a higher payout. | 09-06-2012 |
Kalin Lazarov, Colorado Springs, CO US
Patent application number | Description | Published |
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20130175072 | REDUCING THERMAL GRADIENTS TO IMPROVE THERMOPILE PERFORMANCE - With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB. | 07-11-2013 |
20130214159 | INFRARED LIGHT TRANSMISSIVITY FOR A MEMBRANE SENSOR - In conventional membrane infrared (IR) sensors, little to no attention has been paid toward transmissivity of IR near metal traces. Here, because the substrate of an integrated circuit carrying the sensor is used as a visible light filter, reflection of IR radiation back into the substrate can affect the operation and reliability of the IR sensor. As a result, an arrangement is provided that reduces the area occupied by metal lines by reducing the pitch and compacting the routing so as to reduce the effects from the reflection of IR radiation by metal traces. | 08-22-2013 |
20140151559 | ON-CHIP CALIBRATION SYSTEM AND METHOD FOR INFRARED SENSOR - A radiation sensor includes an integrated circuit radiation sensor chip ( | 06-05-2014 |
Kalin V. Lazarov, Tucson, AZ US
Patent application number | Description | Published |
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20100213373 | Infrared sensor structure and method - A radiation sensor ( | 08-26-2010 |
20100213374 | On-chip calibration system and method for infrared sensor - A radiation sensor includes an integrated circuit radiation sensor chip ( | 08-26-2010 |
20100289108 | Silicon dioxide cantilever support and method for silicon etched structures - A semiconductor device includes a semiconductor layer ( | 11-18-2010 |
20100327393 | Method and structures for etching cavity in silicon under dielectric membrane - A semiconductor device includes a semiconductor layer ( | 12-30-2010 |
20110147869 | INTEGRATED INFRARED SENSORS WITH OPTICAL ELEMENTS, AND METHODS - An infrared (IR) radiation sensor device ( | 06-23-2011 |
20110291222 | SILICON DIOXIDE CANTILEVER SUPPORT AND METHOD FOR SILICON ETCHED STRUCTURES - An apparatus includes a semiconductor layer ( | 12-01-2011 |
20110294246 | SILICON DIOXIDE CANTILEVER SUPPORT AND METHOD FOR SILICON ETCHED STRUCTURES - An apparatus includes a semiconductor layer ( | 12-01-2011 |
20120061570 | INFRARED LIGHT TRANSMISSIVITY FOR A MEMBRANE SENSOR - In conventional membrane infrared (IR) sensors, little to no attention has been paid toward transmissivity of IR near metal traces. Here, because the substrate of an integrated circuit carrying the sensor is used as a visible light filter, reflection of IR radiation back into the substrate can affect the operation and reliability of the IR sensor. As a result, an arrangement is provided that reduces the area occupied by metal lines by reducing the pitch and compacting the routing so as to reduce the effects from the reflection of IR radiation by metal traces. | 03-15-2012 |
20120063093 | REDUCING THERMAL GRADIENTS TO IMPROVE THERMOPILE PERFORMANCE - With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB. | 03-15-2012 |
20120086098 | IONIC ISOLATION RING - There has been very little (if any) attention to address contamination diffusion within an integrated circuit (IC) because there are very few applications where a protective overcoat will be penetrated as part of the manufacturing process. Here, a sealing ring is provided that address this problem. Preferably, the sealing ring uses the combination of electrically conductive barrier rings and the tortuous migration path to allow an electronic device (i.e., thermopile), where a protective overcoat is penetrated during manufacture, to communicate with external devices while being isolated to prevent contamination. | 04-12-2012 |
20120138800 | ON-CHIP CALIBRATION SYSTEM AND METHOD FOR INFRARED SENSOR - A radiation sensor includes an integrated circuit radiation sensor chip ( | 06-07-2012 |
20130043552 | INTEGRATED INFRARED SENSORS WITH OPTICAL ELEMENTS AND METHODS - An infrared (IR) radiation sensor device ( | 02-21-2013 |
Kalin V. Lazarov, Colorado Springs, CO US
Patent application number | Description | Published |
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20120139077 | METHOD AND APPARATUS FOR REDUCING THERMOPILE VARIATIONS - Here, an apparatus is provided. The apparatus generally comprises a substrate and a thermopile. The thermopile includes a cavity that is etched into the substrate, a functional area that is formed over the substrate (where the cavity is generally coextensive with the functional area), and a metal ring formed over the substrate along the periphery of the functional area (where the metal ring is thermally coupled to the substrate). | 06-07-2012 |
20120200486 | Infrared gesture recognition device and method - A system for generating tracking coordinate information in response to movement of an information-indicating element includes an array ( | 08-09-2012 |
20120218022 | Accurate Current Sensing with Heat Transfer Correction - In one embodiment, a current sensing circuit corrects for the transient and steady state temperature measurement errors due to physical separation between a resistive sense element and a temperature sensor. The sense element has a temperature coefficient of resistance. The voltage across the sense element and a temperature signal from the temperature sensor are received by processing circuitry. The processing circuitry determines a power dissipated by the sense element, which may be instantaneous or average power, and determines an increased temperature of the sense element. The resistance of the sense element is changed by the increased temperature, and this derived resistance Rs is used to calculate the current through the sense element using the equation I=V/R or other related equation. The process is iterative to continuously improve accuracy and update the current. | 08-30-2012 |
20120266672 | Heated air mass WCSP package and method for accelerometer - An inertial sensor ( | 10-25-2012 |
20140131577 | INFRARED SENSOR STRUCTURE AND METHOD - A radiation sensor ( | 05-15-2014 |
Kalin Valeriev Lazarov, Colorado Springs, CO US
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20150021987 | POWER SUPPLY SYSTEM AND METHOD - A power control system includes an event data bus configured to carry event information. Several power supply managers are coupled to the same event bus. Each power supply manager has one or more point of load (POL) regulators assigned to it. Each power supply manager communicates event information with other POL power supply managers over the event data bus. | 01-22-2015 |
Kalin Valeriev Lazarov, Tucson, AZ US
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20120223400 | INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER - A MEMS IR sensor, with a cavity in a substrate underlapping an overlying layer and a temperature sensing component disposed in the overlying layer over the cavity, may be formed by forming an IR-absorbing sealing layer on the overlying layer so as to cover access holes to the cavity. The sealing layer is may include a photosensitive material, and the sealing layer may be patterned using a photolithographic process to form an IR-absorbing seal. Alternately, the sealing layer may be patterned using a mask and etch process to form the IR-absorbing seal. | 09-06-2012 |
20130062720 | EXTENDED AREA COVER PLATE FOR INTEGRATED INFRARED SENSOR - An integrated circuit chip includes a window cover over etchant holes in a dielectric layer and over a cavity in the substrate of said integrated circuit chip. The window cover extends at least 400 microns beyond the edge of the cavity. An integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edges of a cavity. A method of forming an integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edge of a cavity. | 03-14-2013 |
Marian Lazarov, Linz AT
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20140194230 | DEVICE FOR A GRIP OF A TENNIS RACQUET - The invention relates to a device ( | 07-10-2014 |
Mirella Lazarov, Hayward, CA US
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20090074876 | PEPTIDE COMPOSITION AND A METHOD OF PROMOTING CARTILAGE FORMATION - The present invention is a peptide compound which stimulates the formation of hard tissues such as bone and cartilage. The invention is also related to a method to treat a defect in hard tissues such as bone and cartilage using the peptide. The method of the present invention may be used to treat or prevent the defects in bones and cartilages which are caused by rheumatoid arthritis or osteoarthritis which involves the regeneration of new bone or cartilage in or around the defects. | 03-19-2009 |
20110105401 | PEPTIDE COMPOSITION AND A METHOD OF PROMOTING CARTILAGE FORMATION - The present invention is a peptide compound which stimulates the formation of hard tissues such as bone and cartilage. The invention is also related to a method to treat a defect in hard tissues such as bone and cartilage using the peptide. The method of the present invention may be used to treat or prevent the defects in bones and cartilages which are caused by rheumatoid arthritis or osteoarthritis which involves the regeneration of new bone or cartilage in or around the defects. | 05-05-2011 |
Orly Lazarov, Oak Park, IL US
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20110129450 | METHOD OF PROMOTING NEUROGENESIS BY MODULATING SECRETASE ACTIVITIES - This invention provides methods and reagents for promoting neurogenesis, by modulating neural stem cell proliferation and differentiation. Particularly, this invention provides methods and reagents for promoting neurogenesis in a patient's central nervous system where the patient suffers from an aging-related neurodegenerative disease. Specifically, the invention provides methods for promoting neurogenesis comprising modulating the α and/or γ-secretase activities. | 06-02-2011 |