Patent application number | Description | Published |
20090073212 | APPARATUS AND METHOD OF CONTROLLING TEMPERATURES IN EJECTION MECHANISMS - An apparatus and method for controlling temperature profiles in ejection mechanisms is provided. A heater includes a first resistor segment having an electrical resistivity, a second resistor segment; and a coupling segment positioned between the first resistor segment and the second resistor segment. The coupling segment has an electrical resistivity, wherein the ratio of the resistivity of the coupling segment to the resistivity of the first resistor segment is substantially zero. Alternatively, the first resistor segment has an electrical conductivity and the coupling segment has an electrical conductivity, wherein the electrical conductivity of the coupling segment is greater than the electrical conductivity of the first resistor segment. | 03-19-2009 |
20090295861 | CONTINUOUS FLUID JET EJECTOR WITH ANISOTROPICALLY ETCHED FLUID CHAMBERS - A fluid ejection device, a method of cleaning the device, and a method of operating the device are provided. The device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate and has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall. The first wall and the second wall are positioned at an angle other than 90° relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber. | 12-03-2009 |
20110128316 | LIQUID DROP EJECTION USING DUAL FEED EJECTOR - A liquid ejector is provided that includes a structure defining a plurality of chambers with one of the plurality of chambers including a first surface and a second surface. The first surface includes a nozzle orifice. A drop forming mechanism is located on the second surface of the chamber opposite the nozzle orifice. A first liquid feed channel and a second liquid feed channel are in fluid communication with the chamber. A first segment of a segmented liquid inlet is in fluid communication with the first liquid feed channel and a second segment of the segmented liquid inlet is in fluid communication with the second liquid feed channel. The first segment of the segmented liquid inlet is also in fluid communication with another one of the plurality of chambers and the second segment of the liquid inlet is also in fluid communication with another one of the plurality of chambers. A liquid is provided to the chamber through the first liquid feed channel and the second liquid feed channel from the segmented liquid inlet. A drop of the liquid is ejected through the nozzle orifice of the chamber by operating the associated drop forming mechanism. | 06-02-2011 |
20120062654 | LIQUID DROP EJECTION USING DUAL FEED EJECTOR - A printer includes a printhead die including liquid ejectors separated by walls. Each liquid ejector includes a nozzle orifice and an associated drop forming mechanism. First and second liquid feed channels, extending in opposite directions, are in fluid communication with each liquid ejector. A liquid inlet includes a plurality of first and second segments in fluid communication with the first liquid feed channels and the second liquid feed channels, respectively. The first and second segments are located on opposite sides of the nozzle orifice. For a given liquid ejector, both of the first and second segments are directly in line with the liquid ejector. An electrical lead extends from each drop forming mechanism toward an edge of the printhead die. At least one of the electrical leads is positioned between neighboring segments of at least one of the first and second segments of the liquid inlet. | 03-15-2012 |
20120268513 | FLUID EJECTION USING MEMS COMPOSITE TRANSDUCER - A method of ejecting a drop of fluid includes providing a fluid ejector. The fluid ejector includes a substrate, a MEMS transducing member, a compliant membrane, walls, and a nozzle. The substrate includes a cavity and a fluidic feed. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. The compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member, A second portion of the compliant membrane being anchored to the substrate. Walls define a chamber that is fluidically connected to the fluidic feed. At least the second portion of the MEMS transducing member is enclosed within the chamber. A quantity of fluid is supplied to the chamber through the fluidic feed. An electrical pulse is applied to the MEMS transducing member to eject a drop of fluid through the nozzle. | 10-25-2012 |
20120268525 | CONTINUOUS EJECTION SYSTEM INCLUDING COMPLIANT MEMBRANE TRANSDUCER - A continuous liquid ejection system includes a substrate and an orifice plate affixed to the substrate. Portions of the substrate define a liquid chamber. The orifice plate includes a MEMS transducing member. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the liquid chamber and is free to move relative to the liquid chamber. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member and a second portion of the compliant membrane is anchored to the substrate. The compliant membrane includes an orifice. A liquid supply provides a liquid to the liquid chamber under a pressure sufficient to eject a continuous jet of the liquid through the orifice located in the compliant membrane of the orifice plate. The MEMS transducing member is selectively actuated to cause a portion of the compliant membrane to be displaced relative to the liquid chamber to cause a drop of liquid to break off from the liquid jet. | 10-25-2012 |
20120268529 | CONTINUOUS LIQUID EJECTION USING COMPLIANT MEMBRANE TRANSDUCER - A method of continuously ejecting liquid includes providing a liquid ejection system that includes a substrate and an orifice plate affixed to the substrate. Portions of the substrate define a liquid chamber. The orifice plate includes a MEMS transducing member. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the liquid chamber. The second portion of the MEMS transducing member is free to move relative to the liquid chamber. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member and a second portion of the compliant membrane is anchored to the substrate. The compliant membrane includes an orifice. Liquid is provided under a pressure sufficient to eject a continuous jet of the liquid through the orifice located in the compliant membrane of the orifice plate by a liquid supply. A drop of liquid is caused to break off from the liquid jet by selectively actuating the MEMS transducing member which causes a portion of the compliant membrane to be displaced relative to the liquid chamber. | 10-25-2012 |
20130027449 | INKJET PRINTHEAD WITH TEST RESISTORS - An inkjet printhead includes an array of drop ejectors, a first drop ejector of the array including a first resistive heater having a first nominal length and a first nominal width; and a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length. | 01-31-2013 |
20130027461 | METHOD OF CHARACTERIZING ARRAY OF RESISTIVE HEATERS - A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor. | 01-31-2013 |
20140216783 | MICRO-WIRE PATTERN WITH OFFSET INTERSECTIONS - A pattern of electrically connected micro-wires comprises a plurality of micro-wires arranged in an intersecting pattern forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires or has at least one rounded intersection corner. | 08-07-2014 |
20140216790 | CONDUCTIVE MICRO-WIRE STRUCTURE WITH OFFSET INTERSECTIONS - A conductive micro-wire structure includes a substrate and a plurality of micro-wires formed on or in the substrate in an intersecting pattern and forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires or has one or more rounded intersection corners. | 08-07-2014 |
Patent application number | Description | Published |
20140035976 | EJECTOR WITH IMPROVED JETTING LATENCY FOR HIGH SOLIDS CONTENT - A liquid ejection system includes a liquid ejector having a structure defining a chamber, the chamber including a first surface and a second surface, the first surface including a nozzle orifice; a resistive heater located on the second surface of the chamber opposite the nozzle orifice; a first liquid feed channel and a second liquid feed channel being in fluid communication with the chamber; and a segmented liquid inlet, a first segment of the liquid inlet being in fluid communication with the first liquid feed channel, and a second segment of the liquid inlet being in fluid communication with the second liquid feed channel; and a liquid supply comprising a liquid including a carrier fluid and a solids content that is greater than 5 percent by weight, wherein the liquid supply is fluidically connected to the segmented liquid inlet. | 02-06-2014 |
20140036002 | METHOD OF PRINTING WITH HIGH SOLIDS CONTENT INK - A printing method includes supplying pigmented ink to inkjet printhead having array of dual feed thermal inkjet ejectors, wherein pigmented ink includes an aqueous carrier with pigment particle loading of at least 4 percent by weight and polymer loading of at least 1 percent by weight; ejecting a plurality of maintenance drops of pigmented ink from array of dual feed thermal inkjet ejectors prior to start of printing the image on recording medium; printing the image swath by swath by ejecting printing drops of pigmented ink on recording medium, wherein a plurality of printing swaths are required in order to complete printing of the image; and ejecting a plurality of maintenance drops of pigmented ink from array of dual feed thermal inkjet ejectors after a completion of printing the image on recording medium, wherein no maintenance drops are ejected between the start and the completion of printing of the image. | 02-06-2014 |
20140036003 | EJECTOR WITH IMPROVED JETTING LATENCY FOR MOLECULAR WEIGHT POLYMERS - A liquid ejection system includes a liquid ejector having a structure defining a chamber, the chamber including a first surface and a second surface, the first surface including a nozzle orifice; a resistive heater located on the second surface of the chamber opposite the nozzle orifice; a first liquid feed channel and a second liquid feed channel being in fluid communication with the chamber; and a segmented liquid inlet, a first segment of the liquid inlet being in fluid communication with the first liquid feed channel, and a second segment of the liquid inlet being in fluid communication with the second liquid feed channel; and a liquid supply comprising a liquid including a polymer at a loading of at least 2 percent by weight, wherein the polymer has a molecular weight of at least 20,000, and wherein the liquid supply is fluidically connected to the segmented liquid inlet. | 02-06-2014 |
20140205810 | METHOD OF MAKING MICRO-CHANNEL STRUCTURE FOR MICRO-WIRES - A method of making a micro-channel structure and applying a curable ink to the micro-channel structure includes providing a substrate and depositing a single layer of a curable polymer on the substrate, the single curable layer having a layer thickness. One or more micro-channels adapted to receive curable ink are embossed into the single curable layer, the micro-channels having a micro-channel thickness that is in a range of two microns to ten microns less than the layer thickness. The single curable layer is cured to form a single cured layer so that deformations of the micro-channels or the surface of the single cured layer are reduced. Curable ink is coated over the surface and micro-channels of the single cured layer. The curable ink is removed from the surface of the single cured layer and the curable ink is cured. | 07-24-2014 |
20140205811 | MICRO-CHANNEL STRUCTURE FOR MICRO-WIRES - The purpose of this invention is to retain an abhor nut to a power tool while the nut is not in use. More specifically it is intended to keep the abhor nut of an angle grinder attached to the grinder. Grinding abrasives for an angle grinder can be purchased with or without a center hub. The abrasives that do not have a center hub make use of the abhor nut to secure them to the grinder. When an abrasive with a center hub is used on the grinder the abhor nut is not needed. The nut is removed from the abhor and frequently becomes misplaced. This invention keeps the grinder and nut together while the nut is not being used. This is designed for angle grinders, but could be used for other power tools and machinery. | 07-24-2014 |
20140209355 | LARGE-CURRENT MICRO-WIRE PATTERN - A pattern of micro-wires forming an electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one second micro-wire has a width less than at least one of the widths of the first micro-wires. | 07-31-2014 |
20140209357 | MICRO-WIRE PATTERN FOR ELECTRODE CONNECTION - Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires. | 07-31-2014 |
20140209358 | MICRO-WIRE ELECTRODE BUSS - An electrical conductor includes a substrate having micro-channels formed in the substrate. A plurality of spaced-apart first micro-wires is located on or in the micro-channels, the first micro-wires extending across the substrate in a first direction. A plurality of spaced-apart second micro-wires is located on or in the micro-channels, the second micro-wires extending across the substrate in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one of the second micro-wires has a width less than the width of at least one of the first micro-wires. | 07-31-2014 |
20140209359 | CONDUCTIVE MICRO-WIRE STRUCTURE - A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%. | 07-31-2014 |
20140216784 | MAKING A CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS - A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires. | 08-07-2014 |
20140216797 | CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS - A conductive article includes a substrate having a micro-channel. A metal nanoparticle composition is formed in the micro-channel. The metal nanoparticle composition includes silver nanoparticles and a polymer having both carboxylic acid and sulfonic acid groups. | 08-07-2014 |
20140217333 | METAL NANOPARTICLE COMOSITION WITH WATER SOLUBLE POLYMER - A metal nanoparticle composition includes water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. Silver nanoparticles are dispersed in the water and the weight ratio of the polymer to silver is from 0.008 to 0.1. | 08-07-2014 |
20140220259 | MAKING A CONDUCTIVE ARTICLE - A method of making a conductive article includes depositing on a substrate a metal nanoparticle composition having water, silver nanoparticles dispersed in the water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. The weight percentage of silver in the composition is greater than 10%. The metal nanoparticle composition is dried. The dried metal nanoparticle composition is converted to improve the electrical conductivity of the dried metal nanoparticle composition. | 08-07-2014 |
20140220366 | CONDUCTIVE ARTICLE HAVING SILVER NANOPARTICLES - A conductive article includes a metal nanoparticle composition formed on a substrate. The metal nanoparticle composition includes silver nanoparticles and a polymer having both carboxylic acid and sulfonic acid groups. The weight ratio of the polymer to silver is 0.0005 to 0.04. | 08-07-2014 |
20140221543 | SILVER METAL NANOPARTICLE COMPOSITION - A metal nanoparticle composition includes water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. Silver nanoparticles are dispersed in the water such that the weight percentage of silver in the composition is greater than 10%. | 08-07-2014 |
20140239504 | MULTI-LAYER MICRO-WIRE STRUCTURE - A multi-layer micro-wire structure includes a substrate having a surface. A plurality of micro-channels is formed in the substrate. A first material composition is located in a first layer only in each micro-channel and not on the substrate surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the substrate surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel. | 08-28-2014 |
20140251671 | MICRO-CHANNEL WITH CONDUCTIVE PARTICLE - A micro-channel structure includes a substrate and a cured layer formed on the substrate. One or more micro-channels are embossed in the cured layer on a cured-layer surface opposite the substrate and define a bottom surface. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate. A cured electrical conductor forms a micro-wire in the micro-channels in contact with the bottom surface. A conductive particle is located in at least one micro-channel in electrical contact with the cured electrical conductor. | 09-11-2014 |
20140251672 | MICRO-CHANNEL CONNECTION PAD - A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An electrically continuous cured electrical conductor forms an electrically continuous micro-wire in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor. | 09-11-2014 |
20140251673 | MICRO-CHANNEL CONNECTION METHOD - A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer is cured to form a cured layer having embossed intersecting micro-channels in the cured layer; the group of intersecting micro-channels forms a connection pad. A curable electrical conductor is located in the intersecting micro-channels. The curable electrical conductor is cured to form an electrically continuous cured electrical conductor formed in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor. | 09-11-2014 |
20150181702 | MICRO-WIRE CONNECTION PAD - A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor. | 06-25-2015 |