Wachter, DE
Alexander Wachter, Bad Schoenborn DE
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20140180737 | ABAP Unified Connectivity - A method, a system, and a computer-program product for providing a unified connectivity to a plurality of business processes are disclosed. A plurality of business processes for connection to a server are provided. A uniform configuration connection assembly for connecting the plurality of business processes to the server is generated. The uniform configuration connection assembly is configured based on at least one profile corresponding to at least one business process in the plurality of business processes and contains at least one connectivity artifact for performing at least one connectivity task for at least one business process in the plurality of business processes. At least a portion of the plurality of business processes to the server is connected based on the generated uniform configuration connection assembly. | 06-26-2014 |
Andreas Wachter, Mannheim DE
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20100221821 | METHODS AND COMPOSITIONS RELATED TO RIBOSWITCHES THAT CONTROL ALTERNATIVE SPLICING AND RNA PROCESSING - Disclosed are methods and compositions related to riboswitches that control alternative splicing. | 09-02-2010 |
Andreas Wachter, Mossingen DE
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20100184810 | METHODS AND COMPOSITIONS RELATED TO RIBOSWITCHES THAT CONTROL ALTERNATIVE SPLICING - Disclosed are methods and compositions related to riboswitches that control alternative splicing. | 07-22-2010 |
Andreas K. Wachter, Herrsching Am Ammersee DE
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20110086646 | Method And Apparatus For Transmitting Indoor Context Information - The subject matter disclosed herein relates to a system and method for determining indoor context information relating to a location of a mobile device. Indoor context information may be utilized by a mobile device or a network element to obtain an estimate of a location of the mobile device within an indoor environment. | 04-14-2011 |
Christian Wachter, Darmstadt DE
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20130069606 | DC Converter with Adjustable Output Voltage - The present invention relates to a dc converter whose output voltage is adjustable. The dc converter has | 03-21-2013 |
Erwin Wachter, Ellingen-Stopfenheim DE
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20090261619 | AIR-DIRECTING COMPONENT AND BODY FRONT END OF A MOTOR VEHICLE - An air-directing component ( | 10-22-2009 |
20100171330 | REAR CRASH ELEMENT - The invention relates to a rear crash element for the rear bumper of a motor vehicle in the area of the number plate recess ( | 07-08-2010 |
Ewe Wachter, Oberteuringen DE
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20130167389 | COORDINATE MEASURING DEVICE AND METHOD FOR MEASURING WITH A COORDINATE MEASURING DEVICE - The invention relates to a method for the measurement of workpiece geometries with a coordinate measuring device ( | 07-04-2013 |
Gerhard Wachter, Buedingen DE
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20100072743 | PUSH FIT COUPLING - Push fit coupling and method for connecting two elements with a push fit coupling. The push fit coupling includes a first element having a plug-in opening, a second element insertable into the plug-in opening, a retaining device surrounding at least one of the first and second elements; and at least one seal located on an inside of the retaining device. The first and second elements have front face sections facing towards one another, and the at least one seal is arranged between the front face sections. | 03-25-2010 |
20130111708 | PROFILED CLAMP - Profiled clamp that includes two half shells, each having a clamping head on a respective first end and a connection geometry on a respective second end. The profiled clamp also includes a clamping element to which the clamping heads are connected and a spring element preloaded to bear against an inside of the half shells. At least one of the two half shells is tiltable with respect to the clamping element. | 05-09-2013 |
20140028014 | PIPE CLAMP, IN PARTICULAR PROFILE CLAMP - Pipe clamp and method for retaining a tensioning element in a tensioning head of the pipe clamp. The pipe clamp includes a clamp band having a first end with a first tensioning head and a second end with a second tensioning head, a tensioning element guidable guided through the first tensioning head and engageable with the second tensioning head, and a securing element structured and arranged in the first tensioning head to secure the tensioning element against loss and including a spring element structured and arranged to act between the tensioning element and the first tensioning head. | 01-30-2014 |
Gerhard Wachter, Buedlingen DE
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20090072531 | PLUG PART OF A PLUG-TYPE CONNECTION ARRANGEMENT AND PLUG-TYPE CONNECTION ARRANGEMENT - Plug part of a plug-type connection arrangement for connecting two fluid lines and plug-type connection arrangement including the plug part. The plug part includes at least one two-layer area, the two layers of the two-layer area including a metallic material. At least a portion of the plug part is structured and arranged to be fed into a coupling part of the plug-type connection arrangement. | 03-19-2009 |
Hans-Juergen Wachter, Roedermark DE
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20090133899 | DRAWN STRAND FILLED TUBING WIRE - A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of metallic strands and positioning the bundle within an outer tube. The tube and strands are then drawn down to a predetermined diameter to form a wire for use in medical devices. The wire may be covered with an insulating material. | 05-28-2009 |
Hans-Jurgen Wachter, Rodermark DE
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20080317948 | Method for Producing a Stimulation Electrode - A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant. | 12-25-2008 |
20130166019 | METAL ALLOY FOR MEDICAL DEVICES AND IMPLANTS - The present invention relates to a medical device or implant made at least in part of a high strength, low modulus metal alloy comprising Niobium, Tantalum, and at least one element selected from the group consisting of Zirconium, Tungsten, and Molybdenum. The medical devices according to the present invention provide superior characteristics with regard to bio-compatibility, radio-opacity and MRI compatibility. | 06-27-2013 |
20150053313 | ZIRCONIUM-BASED ALLOY METALLIC GLASS AND METHOD FOR FORMING A ZIRCONIUM-BASED ALLOY METALLIC GLASS - A class of alloys is provided that form metallic glass upon cooling below the glass transition temperature Tg at a rate below 100° K/sec. The alloys have a high value of temperature difference (DT) between the crystallization temperature (Tx) and the glass transition temperature (Tg) of the intermetallic alloy. Such alloys comprise zirconium in the range of 70 to 80 weight percent, beryllium in the range of 0.8 to 5 weight percent, copper in the range of 1 to 15 weight percent, nickel in the range of 1 to 15 weight percent, aluminum in the range of 1 to 5 weight percent and niobium in the range of 0.5 to 3 weight percent, or narrower ranges depending on other alloying elements and the critical cooling rate and value of DT desired. Furthermore, methods are provided for making such metallic glasses. | 02-26-2015 |
Hans-Jürgen Wachter, Ober-Roden DE
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20150038034 | FLAT STRUCTURE, PARTICULARLY TEXTILE, CONTAINING PRECIOUS METAL WIRE - Known textile flat structures contain precious metal wire or they are composed completely thereof. In order to achieve high flexural and tensile strength, at the same time with high flexibility of the flat structure, the precious metal wire is configured as a precious metal cord having a plurality of cords or a plurality of individual precious metal wires or a combination of cords and individual precious metal wires, which are in each case laid around one another and/or twisted around one another. | 02-05-2015 |
Hans-Jürgen Wachter, Roedermark DE
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20110014399 | METHOD FOR PRODUCING A STIMULATION ELECTRODE - A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant. | 01-20-2011 |
Hans-Jürgen Wachter, Ober-Roden DE
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20120270019 | METHOD FOR MANUFACTURING A PARTIALLY COATED CARRIER STRUCTURE - A method is provided for manufacturing a partially coated carrier structure including a carrier tape coated by a coating. A protective film is applied to at least a portion of the coating, the coating is partially removed from the carrier tape, and the protective film is removed from the coating. A device for manufacturing a partially coated carrier structure by a method of this type includes a first conveying facility for conveying a carrier tape coated by a coating, an application facility for application of a protective film to at least a portion of the coating, and at least one tool that can be used to partially remove the coating from the carrier tape. | 10-25-2012 |
Hans-Jürgen Wachter, Roedermark DE
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20110014399 | METHOD FOR PRODUCING A STIMULATION ELECTRODE - A stimulation electrode is provided having an electrically conducting electrode base member which is partially covered with an electrically insulating ceramic layer. The ceramic layer is formed of an oxide and/or an oxynitride of at least one metal of the group of titanium, niobium. tantalum, zirconium, aluminum and silicon. Various methods are provided for production of the stimulation electrode, including methods in which the ceramic layer is formed in situ by a thermal, chemical or electrochemical oxidation or oxynitridation process. The stimulation electrode may be used as a cardiac pacemaker electrode, a neuro-stimulation electrode, or another human implant. | 01-20-2011 |
Jonas Wachter, Hallbeergmoos DE
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20100018594 | Arrangement for Feeding a Liquid Additive for an Internal-Combustion Engine - An arrangement is provided for feeding a liquid additive from a receptacle into a fuel line or into an exhaust line of an internal-combustion engine of a motor vehicle by way of a blockable feed line leading into at least one of the above-mentioned line and by way of a pump which at least temporarily generates a feed pressure in the feed line. The receptacle can be filled with additive from a larger storage tank also accommodated in the motor vehicle by way of a connection line that can be blocked. The feed line branches off the connection line between the receptacle and the storage tank. The pump is installed in the receptacle or between the receptacle and the branching-off of the feed line into the connection line. The connection line can be shut-off in the storage tank or between the storage tank and the branching-off of the feed line. | 01-28-2010 |
20100024402 | Feeding Arrangement for a Liquid Additive for an Internal-Combustion-Engine - An arrangement is provided for feeding a liquid additive from a receptacle into a fuel pipe or into an exhaust line of an internal-combustion engine of a motor vehicle. The receptacle is fillable with additive from a larger storage tank that is also accommodated in the motor vehicle by way of a connection line that can be blocked by a shut-off element. A pump is installed in the receptacle or in the connection line. A heating device for heating at least a partial volume of the additive is present in the receptacle. A blockable return line branches off into the receptacle from the connection line between the pump and the shut-off element. | 02-04-2010 |
Jurgen Wachter, Rodermark DE
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20080312740 | Metal alloy for medical devices and implants - The present invention relates to a medical device or implant made at least in part of a high strength, low modulus metal alloy comprising Niobium, Tantalum, and at least one element selected from the group consisting of Zirconium, Tungsten and Molybdenum. The medical devices according to the present invention provide superior characteristics with regard to biocompatibility, radio-opacity and MRI compatibility. | 12-18-2008 |
20100222866 | METAL ALLOY FOR MEDICAL DEVICES AND IMPLANTS - The present invention relates to a medical device or implant made at least in part of a high strength, low modulus metal alloy comprising Niobium, Tantalum, and at least one element selected from the group consisting of Zirconium, Tungsten, and Molybdenum. The medical devices according to the present invention provide superior characteristics with regard to bio-compatibility, radio-opacity and MRI compatibility. | 09-02-2010 |
20120330390 | Medical devices and implants from Ta-Nb-W alloys - The present invention relates to a medical device or implant made at least in part of a high-strength, low-modulus metal alloy comprising niobium, tantalum, and at least one element selected from the group consisting of zirconium, tungsten, and molybdenum. The medical devices according to the present invention provide superior characteristics with regard to biocompatibility, radio-opacity and MRI compatibility. | 12-27-2012 |
Jürgen Wachter, Rodermark DE
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20120231048 | Medical Devices and Implants from Nb-Ta-W-Zr Alloys - The present invention relates to a medical device or implant made at least in part of a high-strength, low-modulus metal alloy comprising niobium, tantalum, and at least one element selected from the group consisting of zirconium, tungsten, and molybdenum. The medical devices according to the present invention provide superior characteristics with regard to biocompatibility, radio-opacity and MRI compatibility. | 09-13-2012 |
20120330390 | Medical devices and implants from Ta-Nb-W alloys - The present invention relates to a medical device or implant made at least in part of a high-strength, low-modulus metal alloy comprising niobium, tantalum, and at least one element selected from the group consisting of zirconium, tungsten, and molybdenum. The medical devices according to the present invention provide superior characteristics with regard to biocompatibility, radio-opacity and MRI compatibility. | 12-27-2012 |
Markus Wachter, Bemkastel-Kues DE
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20090171494 | CONCEPT FOR MONITORING THE MANUFACTURE OF OBJECTS CONSISTING OF MULTIPLE MATERIAL LAYERS - The manufacture of an object consisting of multiple material layers successively built up one upon the other can be monitored in an advantageous manner in that after the application of a material layer, a height profile of a circumference of the object is established, such that after the application of each material layer, a comparison with a reference information can be used for evaluating whether the preceding production step delivered a result which enables to draw the conclusion of a faultless application of the material layer. | 07-02-2009 |
Michael Wachter, Hockenheim DE
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20100082497 | Providing Foundation Application as Enterprise Services - Methods and apparatus, including systems and computer program products, for a services architecture design that provides enterprise services having foundation layer functionality at the level of an enterprise application. The design includes a set of service operations, process components, and optionally deployment units. Suitable business objects are also described. | 04-01-2010 |
20110307289 | MANAGING CONSISTENT INTERFACES FOR CUSTOMER PROJECT INVOICING AGREEMENT, ENGINEERING CHANGE CASE, PRODUCT DESIGN, PRODUCT DESIGN VERSION HIERARCHY, AND PROJECT EXPENSE VIEW BUSINESS OBJECTS ACROSS HETEROGENEOUS SYSTEMS - A business object model, which reflects data that is used during a given business transaction, is utilized to generate interfaces. This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction. In some operations, software creates, updates, or otherwise processes information related to a customer project invoicing agreement, an engineering change case, a product design, a product design version hierarchy, and/or a project expense view business object. | 12-15-2011 |
20120047079 | PROVIDING FOUNDATION APPLICATION AS ENTERPRISE SERVICES - Methods and apparatus, including systems and computer program products, for a services architecture design that provides enterprise services having foundation layer functionality at the level of an enterprise application. The design includes a set of service operations, process components, and optionally deployment units. Suitable business objects are also described. | 02-23-2012 |
20130031565 | MANAGING CONSISTENT INTERFACES FOR A PRODUCT DESIGN VERSION HIERARCHY BUSINESS OBJECT ACROSS HETEROGENEOUS SYSTEMS - A business object model, which reflects data that is used during a given business transaction, is utilized to generate interfaces. This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction. In some operations, software creates, updates, or otherwise processes information related to a product design version hierarchy business object. | 01-31-2013 |
Philipp Wachter, Berlin DE
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20140042033 | ELECTROPLATING BATH AND METHOD FOR PRODUCING DARK CHROMIUM LAYERS - The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes. | 02-13-2014 |
Philipp Wachter, Bad Cannstatt DE
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20110037350 | PIEZOELECTRIC ACTUATOR MODULE HAVING CABLE BUSHINGS, AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to a piezoelectric actuator module having cable bushings for a piezoelectric actuator, and a piezoelectric actuator module produced in such a manner. Piezoelectric elements are disposed between an actuator head and an actuator base. Insulated extending conductors and feed cables are present in the ceramic actuator base for the electric contacting of the piezoelectric elements via exterior electrodes. During a sintering process for the ceramic actuator base, the electrically conductive inserts are sintered into the actuator base as conductors in an electrically insulating manner. The conductors are electrically connected to contact points on the piezoelectric elements having the exterior electrodes, and via further contact points to feed cables for the piezoelectric actuator module. | 02-17-2011 |
Roland Wachter, Oberroth DE
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20090071139 | Excavator and a machine for material transfer - The invention relates to an excavator or to a machine for material transfer comprising an element movable via at least one hydraulic cylinder. In accordance with the invention, one or more hydraulic cylinders are additionally hinged to the element, with the additional hydraulic cylinder(s) being connected to one or more hydraulic accumulators. | 03-19-2009 |
20100096211 | Traveling Working Machine - The present invention relates to a traveling working machine, in particular an excavator, with an undercarriage on which the traveling gear is arranged, and an uppercarriage rotatably arranged on the undercarriage about a vertical axis of rotation. In accordance with the invention, the load-bearing steel construction of the uppercarriage is composed of at least one first and one second element, which are connected with each other via bolts and/or screws. | 04-22-2010 |
20110150617 | WORK MACHINE, IN PARTICULAR EXCAVATOR - The present invention relates to a work machine, in particular to an excavator, having a boom, an extension element and a piece of working equipment, wherein the extension element is attached to a pivotal connection axle of the boom via a first gimbal mounting and bears the piece of working equipment, wherein the piece of working equipment is attached to a pivotal connection axle of the extension element via a second gimbal mounting. | 06-23-2011 |
Rolf Wachter, Duesseldorf DE
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20080230736 | PROCESS FOR IMPROVING THE SENSORY PROPERTIES OF FABRICS - The invention describes a process for improving the sensory properties of fabrics. The fabrics are treated with a water-based preparation which contains alkyl oligoglycosides in combination with mixtures of mono- and diesters of saturated and unsaturated C | 09-25-2008 |
20100035788 | Skin-friendly detergent mixtures - The invention relates to the use of film-forming cationic biopolymers for improving the dermatological compatibility of manual dishwashing detergents. Chitosan or chitosan derivatives are preferably used for this purpose, preferably in the absence of anionic surfactants. | 02-11-2010 |
20100151008 | Preparations and Methods for Textile and or Fiber Surface Finishing, Surface Finished Articles Prepared Thereby, and Uses Therefor - The invention relates to the use of liposomes, particularly liposomes based on soybean oil lecithins, for finishing textiles and fibers, a key aspect of the invention being that, besides a fiber-care effect, skin-friendly substances are transferred by liposome-finished fibers or textiles to the skin from those fibers or textiles. | 06-17-2010 |
Rolf Wachter, Dusseldorf DE
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20100173818 | CATIONIC POLYMER-CONTAINING SOLID COMPOSITION AND METHOD - A solid composition including 0.1 to 99% by weight of a cationic polymer having dye-transfer-inhibiting and/or dye-fixing properties and 99.9 to 1% by weight of an anionic surfactant is provided. A composition including (a) 0.1 to 99% by weight polydiallyl dialkyl ammonium compounds; (b) 1 to 90% by weight anionic surfactants; (c) 0 to 20% by weight soap; and (d) 0 to 35% by weight nonionic surfactants is also provided. A method for the preparation of solid detergents includes combining 0.1 to 99% by weight of a cationic polymer having dye-transfer-inhibiting and/or dye-fixing properties and 99.9 to 1% by weight of an anionic surfactant, and adding to a detergent. | 07-08-2010 |
Sebastian Wachter, Pressig DE
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20150137631 | DRIVE MODULE FOR A VEHICLE - A drive module for a vehicle has a transmission ( | 05-21-2015 |
Sebastian Wachter, Muenchen DE
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20120113190 | DEVICE FOR POSITIONING AT LEAST ONE PRINT BAR IN A PRINTING POSITION IN AN INKJET PRINTING APPARATUS - In a print bar system or method in which at least one print bar is positioned in a printing position, first and second drive and guidance units are provided for the print bar and which each have an adjustable guidance unit and a first coupling unit. The print bar has print bar receptacles with adjustable positioning pins. The guidance units and the print bar receptacles are designed such that upon insertion of the print bar into the drive and guidance units the print bar receptacles rest in a floating bearing on the guidance units and are centered and arrested after displacement of the guidance units in the drive and guidance units such that the print bar is positioned into the printing position in the drive and guidance units and wherein the positioning pins engage in the first coupling units. | 05-10-2012 |
20120147092 | PRINT GROUP FOR AN INKJET PRINTING APPARATUS - In a print group for an inkjet printing apparatus a printing unit is provided comprising a housing with print bars having print heads. A transport unit is provided for a printing substrate. Drive and guidance units are arranged per print bar which move the print bars independently of one another in a perpendicular direction from a printing position into a transport position and back. In a park unit racks are provided for protective cap bars. A protective cap bar is provided per print bar which when coupled to said print bar seals it. Print bars in an operating position not provided for printing are in the transport position and are coupled with associated protective cap bars. Print bars in said operating position for printing are in the printing position and their associated protective cap bars are arranged in the park unit racks. | 06-14-2012 |
20140340445 | PRINT GROUP FOR AN INK PRINTING APPARATUS - In a print group for an ink printing apparatus, a housing is provided with print bars comprising print heads. The print bars are moveable independently of one another in a vertical direction from a printing position adjacent to a printing substrate into a park position and back. A protective flap bar for each print bar is provided which is pivotable and which is open to one side. The protective flap bar is arranged in a vertical position next to the print bar in the printing position such that the open side is facing away from the print bar. The protective flap bar is arranged in a horizontal position with the open side upward in the park position such that the print bar is engaged with its print head side in the protective flap bar. | 11-20-2014 |
Ulrich Wachter, Riedenburg DE
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20100233831 | RECONFIGURED WAFER ALIGNMENT - A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face. | 09-16-2010 |
Ulrich Wachter, Regenburg DE
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20150028435 | Method of Packaging Integrated Circuits and a Molded Package - A method of packaging integrated circuits includes providing a molded substrate that has a plurality of first semiconductor dies and a plurality of second semiconductor dies laterally spaced apart from one another and covered by a molding compound. The molding compound is thinned to expose at least some of the second semiconductor dies. The exposed second semiconductor dies are removed to form cavities in the molded substrate. A plurality of third semiconductor dies are inserted in the cavities formed in the molded substrate, and electrical connections are formed to the first semiconductor dies and to the third semiconductor dies. | 01-29-2015 |
20150041967 | Molded Semiconductor Package with Backside Die Metallization - A semiconductor package is manufactured by providing a semiconductor die with a terminal at a first side of the die, providing a material coupled to the die at an opposing second side of the die and embedding the die in a molding compound so that the die is covered by the molding compound on all sides except the first side. The molding compound is thinned at a side of the molding compound adjacent the second side of the die, to expose the material at the second side of the die without exposing the second side of the die. An electrical connection is formed to the terminal at the first side of the die. In the case of a transistor die, the terminal can be a source terminal and the transistor die can be attached source-down to a metal block such as a die paddle of a lead frame. | 02-12-2015 |
Ulrich Wachter, Regensburg DE
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20130256922 | Method for Fabricating a Semiconductor Device - In a method for fabricating a semiconductor device, a carrier and at least one semiconductor chip are provided. | 10-03-2013 |
20140035127 | CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE - A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure. | 02-06-2014 |
20140035154 | CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE - A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side. | 02-06-2014 |
20140239438 | SEMICONDUCTOR DEVICE - A number of semiconductor chips each include a first main face and a second main face opposite to the first main face. A first encapsulation layer is applied over the second main faces of the semiconductor chips. An electrical wiring layer is applied over the first main faces of the first semiconductor chips. A second encapsulation layer is applied over the electrical wiring layer. The thickness of the first encapsulation layer and the thicknesses of the first semiconductor chips is reduced. The structure can be singulated to obtain a plurality of semiconductor devices. | 08-28-2014 |
20140332936 | PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME - In various embodiments, a package arrangement may be provided. The package arrangement may include at least one chip. The package arrangement may further include encapsulation material at least partially encapsulating the chip. The package arrangement may also include a redistribution structure over a first side of the chip. The package arrangement may further include a metal structure over a second side of the chip. The second side may be opposite the first side. The package arrangement may additionally include at least one of a semiconductor structure and an electrically conductive plastic material structure electrically coupled to the redistribution structure and the metal structure to form a current path between the redistribution structure and the metal structure. | 11-13-2014 |
20150064846 | Semiconductor Device - A number of semiconductor chips each include a first main face and a second main face opposite to the first main face. A first encapsulation layer is applied over the second main faces of the semiconductor chips. An electrical wiring layer is applied over the first main faces of the first semiconductor chips. A second encapsulation layer is applied over the electrical wiring layer. The thickness of the first encapsulation layer and the thicknesses of the first semiconductor chips is reduced. The structure can be singulated to obtain a plurality of semiconductor devices. | 03-05-2015 |
20150091171 | Metal Redistribution Layer for Molded Substrates - Integrated circuits are packaged by placing a plurality of semiconductor dies on a support substrate, each one of the semiconductor dies having a plurality of terminals at a side facing the support substrate and covering the semiconductor dies with a molding compound to form a molded structure. The support substrate is then removed from the molded structure to expose the side of the semiconductor dies with the terminals, and a metal redistribution layer is formed on the molded structure and in direct contact with the terminals of the semiconductor dies and the molding compound. The redistribution layer is formed without first forming a dielectric layer on a side of the molded structure with the terminals of the semiconductor dies. A corresponding molded substrate and individual molded semiconductor packages are also disclosed. | 04-02-2015 |
Uwe Wachter, Oberteuringen DE
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20100014099 | COORDINATE MEASURING DEVICE AND METHOD FOR MEASURING WITH A COORDINATE MEASURING DEVICE - A method and device for the measurement of workpiece geometries with a coordinate measuring device. According to the invention, measuring tasks may be optimally carried out without a requirement for devices of differing types, by use of one or more sensors which are of optimal application for the relevant measuring task. | 01-21-2010 |
Wolfgang Wachter, Muenchen DE
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20090297876 | THERMAL BARRIER LAYER - A thermal barrier layer for metallic components, in particular for gas turbine components which are subject to high temperatures or hot gas, is disclosed. The thermal barrier layer includes an inner contact layer and an outer top layer, where the inner contact layer is applied to a surface of the component via an adhesion-promoting layer that is disposed therebetween, and between the outer top layer and the inner contact layer an intermediate layer is formed. | 12-03-2009 |
Wolfgang Wachter, Munich DE
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20100173092 | ADHESIVE MASKING TAPES AND METHOD FOR COATING AND/OR REPAIRING COMPONENTS - A masking tape, particularly for use with thermal spraying methods, comprises a tape- and/or strip-like base layer, the base layer including silicone and a glass fiber and/or glass fabric insert, an adhesive layer disposed on the base layer, and at least two scale-like or lamellar elements made of metal or a metal alloy that are attached to the base layer on the surface located opposite the adhesive layer. Another masking tape, particularly for use with thermal spraying methods, comprises a tape- and/or strip-like base and adhesive layer, the base and adhesive layer comprising a glass fiber and/or glass fabric tape and a silicone adhesive, and at least two scale-like or lamellar elements made of metal or a metal alloy that are attached to a surface of the base and adhesive layer. Further, a method of coating and/or repairing components, in particular, turbine or power unit components, uses the aforesaid masking tape and a thermal spraying method. | 07-08-2010 |
Wolfgang Wachter, Kueps DE
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20110207875 | COMPOSITION FOR PRODUCING AN ADJUSTING DEVICE OF A MOTOR VEHICLE - The invention relates to a use of a composition containing a partly crystalline, partly aromatic polyamide for producing at least a part of an adjusting device of a motor vehicle. The composition is impact-modified by addition of at least one elastomer with a proportion of 1% to 10% in the composition. | 08-25-2011 |
Wolf Ulrich Wachter, Elmshorn DE
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20130022767 | SHELL ELEMENT FOR THE BUCKLE COVER OF A SEAT BELT BUCKLE, SEAT BELT BUCKLE AND METHOD FOR PRODUCING A SHELL ELEMENT - A shell element for the buckle cover of a seat belt buckle is disclosed. The shell element comprises a base body made of a hard elastomer and an outer and an inner surface. So that when the buckle cover bears against a further vehicle element with a hard surface, no wear and no undesirable noise is generated and so that the seat belt buckle permanently has attractive visual and haptic properties, a further element made of a soft elastomer is directly connected to the base body and is connected thereto by a material and/or positive connection, said further element forming at least one part of the outer surface of the shell element. | 01-24-2013 |
20140109349 | Buckle Cap for a Seat Belt Buckle and Method of Mounting Same - What is described is a buckle cap for a belt buckle having two interconnected half-shells ( | 04-24-2014 |