Patent application number | Description | Published |
20100035435 | Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces - The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board. | 02-11-2010 |
20100323099 | Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece - To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N | 12-23-2010 |
20120118753 | Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier - In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on the exposed electrically conductive surface; e) embedding each electrically conductive pattern into a dielectric material by forming a respective dielectric material layer on the respective side of the auxiliary substrate; and f) separating each dielectric material layer comprising the respective embedded electrically conductive pattern and the auxiliary substrate from each other. | 05-17-2012 |
20130056438 | COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS - Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ≦100 μm. | 03-07-2013 |
20140000650 | PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN ALLOY | 01-02-2014 |
20140141169 | METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE - The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers. | 05-22-2014 |
20150050422 | METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS - The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact. | 02-19-2015 |
20150307999 | AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS - The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe | 10-29-2015 |
Patent application number | Description | Published |
20110278680 | Strained Semiconductor Device and Method of Making the Same - In a method for forming a semiconductor device, a gate electrode is formed over a semiconductor body (e.g., bulk silicon substrate or SOI layer). The gate electrode is electrically insulated from the semiconductor body. A first sidewall spacer is formed along a sidewall of the gate electrode. A sacrificial sidewall spacer is formed adjacent the first sidewall spacer. The sacrificial sidewall spacer and the first sidewall spacer overlying the semiconductor body. A planarization layer is formed over the semiconductor body such that a portion of the planarization layer is adjacent the sacrificial sidewall spacer. The sacrificial sidewall spacer can then be removed and a recess etched in the semiconductor body. The recess is substantially aligned between the first sidewall spacer and the portion of the planarization layer. A semiconductor material (e.g., SiGe or SiC) can then be formed in the recess. | 11-17-2011 |
20120099243 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via. | 04-26-2012 |
20150200244 | Moisture Barrier Capacitors in Semiconductor Components - Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a semiconductor chip and includes an inner plate electrically connected to a voltage node, an outer plate with fins for electrically connecting to a different voltage node. | 07-16-2015 |
Patent application number | Description | Published |
20090050849 | NON STOICHIOMETRIC TETRAGONAL COPPER ALKALINE EARTH SILICATE PHOSPHORS AND METHOD OF PREPARING THE SAME - Disclosed are non stoichiometric Copper Alkaline Earth Silicate phosphors activated by divalent europium for using them as high temperature stable luminescent materials for ultraviolet or daylight excitation. The phosphors are represented as the formula (Ba | 02-26-2009 |
20100194263 | Method for Producing Illuminants Based on Orthosilicates for pcLEDs - The invention relates to a process for the preparation of phosphors of the formula I | 08-05-2010 |
20100201250 | METHOD OF PRODUCING ILLUMINANTS CONSISTING OF ORTHOSILICATES FOR pcLEDs - The invention relates to a process for the preparation of phosphors of the formula I | 08-12-2010 |
20100207132 | LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba | 08-19-2010 |
20100230691 | Ferrous-Metal-Alkaline-Earth-Metal Silicate Mixed Crystal Phosphor and Light Emitting Device using The Same - A ferrous-metal-alkaline-earth-metal mixed silicate based phosphor is used in form of a single component or a mixture as a light converter for a primarily visible and/or ultraviolet light emitting device. The phosphor has a rare earth element as an activator. The rare earth element is europium (Eu). Alternatively, the phosphor may have a coactivator formed of a rare earth element and at least one of Mn, Bi, Sn, and Sb. | 09-16-2010 |
20120132939 | LIGHT EMITTING DEVICE EMPLOYING NON-STOICHIOMETRIC TETRAGONAL ALKALINE EARTH SILICATE PHOSPHORS - Disclosed is a light emitting device employing non-stoichiometric tetragonal Alkaline Earth Silicate phosphors. The light emitting device comprises a light emitting diode emitting light of ultraviolet or visible light, and non-stoichiometric luminescent material disposed around the light emitting diode. The luminescent material adsorbs at least a portion of the light emitted from the light emitting diode and emits light having a different wavelength from the absorbed light. The non-stoichiometric luminescent material has tetragonal crystal structure, and contains more silicon in the crystal lattice than that in the crystal lattice of silicate phosphors having stoichiometric crystal structure. The luminescent material is represented as the formula (Ba | 05-31-2012 |
Patent application number | Description | Published |
20080213563 | Polypropylene Film for Electron-Beam Hardening Applications - The invention relates to a Co-extruded, multilayer and biaxially-oriented polypropylene film, which comprises of at least one first sealable covering layer and at least one vacuolate layer, having a thickness of at least 5 μm, is further treated by laminating, pasting, printing, varnishing and/or coating; the result registered as follows: after drying or hardening during further treatments using electron-beam irradiation, the vacuolate layer has a thickness of at least 5 μm. Hot tack is not damaged by electron-beam processing. | 09-04-2008 |
20090011183 | Biaxially Oriented Polypropylene Film for Labels - The invention relates to a multi-layered biaxially oriented polypropylene film consisting of a base layer, a covering layer (I) which is applied to a first side of the film and contains at least between 80 and 100 wt. % of a propylene-ethylene copolymer, and another layer (II) which is applied to the opposing second side and contains between 40 and 100 wt. % of a propylene-ethylene copolymer. The propylene-ethylene copolymer of the two layers contains a maximum of 2.5 wt. % of ethylene and has a melting point between 145 and 160° C. The curl of the film can be controlled very well. | 01-08-2009 |
20090041965 | Label Film for a Blow Moulding Method - The invention relates to a biaxial oriented film with a microporous layer, comprising a propylene polymer and at least one β-nucleating agent the microporosity of which is generated by conversion of β-crystalline polypropylene on drawing the film and the use thereof for the labelling of containers in blow moulding. The Gurley value for the film is 10,000 to 300,000 Gurley. | 02-12-2009 |
20100255287 | LABEL FILM FOR DEEP DRAWING METHODS - The invention relates to the use of a bixailly oriented film having a porous layer, which contains propylene polymer and at least one β-nucleating agent and whose microporosity is generated by converting β-crystalline polypropylene during stretching of the film, for labeling containers during a drawing process. | 10-07-2010 |
20100326590 | LABEL FILM FOR DEEP-DRAW PROCESSES - The invention relates to the use of a multilayered, opaque, biaxially oriented polyolefin film of a vacuole-containing base layer and at least one inner cover layer comprising at least 30-95% by weight of a copolymer and/or terpolymer I having a seal initiation temperature I of 70-105° C. and 5 to 70% by weight of an incompatible polyethylene, each of the specifications in percent by weight being based on the weight of the inner cover layer and the inner cover layer having a seal initiation temperature II of 80 to 110° C. | 12-30-2010 |
20110268934 | LABEL FILM FOR DEEP-DRAWING PROCESSES - The invention relates to the use of a multilayer, biaxially oriented polyolefin film comprising at least five layers as the label in deep drawing, which film is constructed from the following layers
| 11-03-2011 |
20130037983 | LABEL FILM FOR BLOW-MOULDING METHOD - The invention relates to a biaxial oriented film with a microporous layer, comprising a propylene polymer and at least one β-nucleating agent the microporosity of which is generated by conversion of β-crystalline polypropylene on drawing the film and the use thereof for the labelling of containers in blow moulding. The Gurley value for the film is 10,000 to 300,000 Gurley. | 02-14-2013 |
20130134625 | LABEL FILM FOR DEEP DRAWING METHODS - The invention relates to a method for producing a labeled container which uses deep drawing, in which a label which is cut to size is laid in a mold and a deep-drawable thick film is heated using heating elements to a temperature at which the polymer is thermoplastically deformable and subsequently the film is drawn into a mold using a molding tool or pneumatically, so that the film is tailored to the mold and a container is molded and simultaneously the inserted label is applied, wherein the label comprises a biaxially oriented film having a microporous layer, which has an open-pored, net-like structure, which was generated during the production of the film by converting β-crystalline polypropylene into alpha-crystalline polypropylene during the stretching, the microporous layer facing toward the container. | 05-30-2013 |