Wang, DK
Alex Yundong Wang, Herning DK
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20130015665 | WIND TURBINE COOLING ARRANGEMENTAANM WANG; ALEX YUNDONGAACI HerningAACO DKAAGP WANG; ALEX YUNDONG Herning DK - The disclosure describes a wind turbine cooling arrangement including a passive heat exchanger arranged to absorb heat from a cooling circuit of a wind turbine, the passive heat exchanger is arranged on the exterior of the canopy to extend above a canopy of the wind turbine. The wind turbine cooling arrangement includes a ventilation arrangement which includes at least one air channel for channelling air onto a surface of the passive heat exchanger. Further described is a wind turbine including such a wind turbine cooling arrangement. | 01-17-2013 |
20130058070 | Transformer chamber for a wind turbine, wind turbine structure component, wind turbine, and method for assembling a wind turbine - A transformer chamber for a wind turbine is described. The transformer chamber includes a liquid-tight tank for receiving a liquid-filled, in particular oil-filled, transformer, a wind turbine structure component includes a component bedframe adapted for receiving such a transformer chamber and a wind turbine includes such a transformer chamber and such a wind turbine structure component. Furthermore, a method for assembling a wind turbine is described. | 03-07-2013 |
20150061803 | TRANSFORMER CHAMBER FOR A WIND TURBINE - A transformer chamber for a wind turbine is described. The transformer chamber includes a liquid-tight tank for receiving a liquid-filled, in particular oil-filled, transformer, a wind turbine structure component includes a component bedframe adapted for receiving such a transformer chamber and a wind turbine includes such a transformer chamber and such a wind turbine structure component. Furthermore, a method for assembling a wind turbine is described. | 03-05-2015 |
Christian Wang, Copenhagen DK
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20090067659 | Miniature microphone assembly with hydrophobic surface coating - A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating. | 03-12-2009 |
20090316946 | Microphone Assembly with Underfill Agent Having a Low Coefficient of Thermal Expansion - A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/° C. | 12-24-2009 |
Christian Wang, Solrod Strand DK
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20110135134 | HEADSET WITH SIDE SUPPORT - A headset with side support is provided, where a speaker module is coupled to a side support by means of an elongate resilient spring such that the speaker module and the side support are placeable at each their side of a users head and where the spring provides a holding force which presses the speaker module and the side support in a direction towards each other wherein the spring comprises a metal core and this core comprises a re-enforcement at the side support which extends transversely to the length direction of the elongate spring. | 06-09-2011 |
Christian Wang, Ballerup DK
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20140161296 | MICROPHONE BOOM - A microphone boom is provided with extendable microphone arrays, and a headset having such a microphone boom. The headset comprise a casing accommodating the signal transmission circuitry and further comprises a speaker adapted to serve a sound signal at the proximity of a users ear and the speaker is protruding from the casing at a speaker-end of the casing and one microphone array is fixated relative to the casing distally with respect to the speaker-end. | 06-12-2014 |
Yuanye Wang, Aalborg DK
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20120155408 | Overhead Reduction for Multi-Carrier Transmission Systems - A method, apparatus, and computer program product, wherein a channel quality information received from a user in a multi-carrier transmission system is categorizing on a per-user basis, and one of a plurality of feedback overhead reduction techniques is individually selected for the user in response to a result of the channel categorization. | 06-21-2012 |