Kolbeck
Andreas Kolbeck, Herzogenrath DE
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20110120416 | MULTI-FUEL DIESEL INTERNAL COMBUSTION ENGINE - A diesel internal combustion engine that is operated advantageously at least predominantly according to the diesel principle, with a multi-fuel adaptation unit that reacts to various fuels of different mixtures and adapts an operating mode of the internal combustion engine to these fuels, wherein the multi-fuel adaptation unit comprises at least the following elements: | 05-26-2011 |
Anton Kolbeck, Bayern DE
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20100237479 | Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing - A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package ( | 09-23-2010 |
Anton Kolbeck, Röhrmoos DE
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20090218663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterised in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 09-03-2009 |
20110227229 | SEMICONDUCTOR WAFER PROCESSING - A method of processing a semiconductor wafer is provided which comprises treating a metallisation layer provided on a backside of the wafer to form a plurality of channels therein, such that at least some of the channels along substantially the length thereof extend through the thickness of the metallisation layer to the backside of the wafer, thereby exposing the material of the backside of the wafer. When the semiconductor wafer is separated into dies, each die is provided with a plurality of channels, which extend to an edge of the die. On attaching the die to a die attach flag by solder, the solder does not stick to the exposed material of the backside of the die, and channels are thereby formed in the solder. This allows venting of gases formed in the solder, and decreases void formation in the solder. | 09-22-2011 |
20110266663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterized in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 11-03-2011 |
Anton Kolbeck, Röhrmoos DE
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20090218663 | LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterised in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface. | 09-03-2009 |
Bjoern Kolbeck, Zurich CH
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20150160028 | PRESENTING INFORMATION ON A MAP - Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for receiving user input specifying a location and a threshold time; determining, based on the specified location and the threshold time, a first reachable area, first transport hubs located within the first reachable area, and respective first shortest times for reaching the first transport hubs from the specified location; determining, for each of the first transport hubs, and based on the threshold time and the respective first shortest times, second transport hubs that are reachable from the specified location, and respective second shortest times for reaching the second transport hubs from the specified location; determining, for each of the second transport hubs, and based on the threshold time and the respective second shortest times, respective second reachable areas; determining a combined reachable area; and providing data describing the combined reachable area for display. | 06-11-2015 |
Christian Kolbeck, Kapfenberg AT
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20100258612 | FRICTION STIR WELDING TOOL - The invention relates to a friction stir welding tool ( | 10-14-2010 |
Christopher Kolbeck, Ergoldsbach DE
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20160137074 | Method for Coupling at Least One Secondary Energy Source to an Energy Supply Network, in Particular an on-Board Vehicle Power Supply - A method is provided for coupling at least one secondary energy source to an power supply network, in particular an on-board vehicle power supply, wherein a load is connected with a primary energy source having a first voltage characteristic. The at least one secondary energy source has a second voltage characteristic which has an operating voltage range overlapping with the first voltage characteristic. The primary energy source and the at least one secondary energy source can be connected via a power switching device to a node point of an intermediate circuit of the power supply network, to which the load is also connected. Before connecting a secondary energy source, the current drawn by the load is regulated such that the voltage connected to the node point of the intermediate circuit corresponds to a no-load voltage of the secondary energy source to be connected or is around the no-load voltage in a specified voltage range. In the case that the voltages correspond or if the voltage connected to the node point lies in the specified voltage range, the secondary energy source is electrically conductively connected to the node point via the power switching device. The current required by the load is regulated to the corresponding value, wherein the load is supplied from the primary and the secondary energy source. | 05-19-2016 |
Dietmar Kolbeck, Steinfeld DE
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20140137623 | Method for Producing a Mold Tube - A method for producing a mold tube from copper or a copper alloy for a continuous casting mold, a tube blank being formed on a mandrel, which determines the inner shape of the mold, by the external application of force, and, following the shaping process, the mandrel being removed from the mold tube ( | 05-22-2014 |
Florian Kolbeck, Gundelsheim DE
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20100180397 | Dirt-collecting device for a floor-cleaning machine, and floor-cleaning machine having such a dirt-collecting device - The invention relates to a dirt-collecting device for a floor-cleaning machine, for picking up a liquid from a floor surface which is to be cleaned, having a carrier and at least one wiping member for wiping the floor surface, the carrier and the at least one wiping member bounding a suction channel which opens out into a suction mouth and of which the free cross-sectional area, through which a suction stream can pass, decreases, at least in one channel portion, in a direction away from the suction mouth. In order to produce such a dirt-collecting device in a more cost-effective manner, it is proposed according to the invention that the suction channel has disposed in it at least one channel-narrowing member, which is produced separately from the carrier. The invention also relates to a floor-cleaning machine having such a dirt-collecting device. | 07-22-2010 |
Florian Kolbeck, Erlangen DE
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20140172435 | Direction of Arrival Estimation Using Watermarked Audio Signals and Microphone Arrays - An apparatus for providing direction information based on a reproduced audio signal with an embedded watermark includes a signal processor, which is adapted to process at least two received watermarked audio signals recorded by at least two audio receivers at different spatial positions. The signal processor is adapted to process the received watermarked audio signals to obtain a receiver-specific information for each received watermarked audio signal. The receiver-specific information depends on the embedded watermarks embedded in the received watermarked audio signals. Moreover, the apparatus includes a direction information provider for providing direction information based on the receiver-specific information for each received watermarked audio signal. | 06-19-2014 |
Jeff Kolbeck, Wausau, WI US
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20120241104 | INSULATING GLASS UNIT AND METHOD OF MAKING SAME - An insulating glass unit. The insulating glass unit includes at least two substantially parallel, spaced sheets of glass. The at least two sheets of glass are sealed together at their peripheral edges to define an insulating chamber. A light redirecting device is positioned within the insulating chamber. The light redirecting device includes a base member including a front face and a back face, a plurality of slats extending from the front face, and a plurality of openings formed in and extending through the base member. The openings are positioned relative to the slats such that light received by the slats is reflected therefrom and through the openings. | 09-27-2012 |
Jonathan Kolbeck, Berkeley, CA US
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20140284207 | FILTERS FOR BLOCKING MACROPARTICLES IN PLASMA DEPOSITION APPARATUS - This disclosure provides systems, methods, and apparatus related to blocking macroparticles in deposition processes utilizing plasmas. In one aspect, an apparatus includes a cathode, a substrate holder, a first magnet, a second magnet, and a structure. The cathode is configured to generate a plasma. The substrate holder is configured to hold a substrate. The first magnet is disposed proximate a first side of the cathode. The second magnet is disposed proximate a second side of the substrate holder. A magnetic field exists between the first magnet and the second magnet and a flow of the plasma substantially follows the magnetic field. The structure is disposed between the second side of the cathode and the first side of the substrate holder and is positioned proximate a region where the magnetic field between the first magnet and the second magnet is weak. | 09-25-2014 |
Markus Kolbeck, Steinfeld DE
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20130214075 | TWO-SHAFT SHREDDER HAVING AN INTERCHANGEABLE CUTTING BLADE SET - The invention relates to a twin-shaft shredder for shredding solids or liquid-borne solids, comprising a casing, a first and a second shaft rotatably mounted in the casing, a plurality of first cutting disks on the first shaft, a plurality of second cutting disks on the second shaft, wherein the first and second cutting disks are axially offset relative to each other, at least some of the first cutting disks respectively engage in an interspace between two adjacent second cutting disks and some of the second cutting disks respectively engage in an interspace between two adjacent first cutting disks. According to the invention, the first and second cutting disks are designed as first and second cutting disk blocks, respectively, in that the cutting disks are respectively formed integrally on a first or second hub body comprising an axial bore which can be arranged around a section of the respective shaft and which is fixed torque-resistantly on the shaft, preferably by means of a positively interlocking shaft-hub-connection. | 08-22-2013 |
Thomas Kolbeck, Burgkirchen DE
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20110184214 | PROCESS OF MAKING FLUOROOLEFINS BY THERMAL DECOMPOSITION OF FLUORINATED MATERIALS - Process for producing fluorinated olefins from fluorinated materials, the process comprising thermally decomposing the fluoropolymers into fluoroolefins in a reactor having a feeding zone where the fluorinated materials are fed into the reactor and a decomposition zone where the fluorinated materials are thermally decomposed and wherein the thermal decomposition is carried out in the presence of microwave irradiation. | 07-28-2011 |
Thomas Kolbeck, Kalchreuth DE
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20090066463 | METHOD TO PRODUCE A CURVED COIL, IN PARTICULAR A SUB-COIL OF A GRADIENT COIL FOR A MAGNETIC RESONANCE APPARATUS - In a method to produce a curved coil, in particular a sub-coil of a gradient coil for a magnetic resonance apparatus, at least one conductor is wound corresponding to a predetermined pattern on a winding plate, and a winding plate composed of multiple plate elements that are moveable relative to one another is used that is formed into a curved shape after the winding of the conductor, in which curved shape the conductor is fixed while maintaining the curved shape. | 03-12-2009 |
20100164675 | METHOD FOR PRODUCING A CYLINDRICAL RADIO-FREQUENCY SHIELD OF A CYLINDRICAL GRADIENT COIL FOR A MAGNETIC RESONANCE SYSTEM - In a method for manufacturing a cylindrical high-frequency shield of a cylindrical gradient coil for a magnetic resonance system, a number of planar shield elements are placed adjacent to one another on a cylindrical support, together with a solder band or solder strip on the support. The segments or elements are inductively soldered together by an inductive soldering device that moves along a longitudinal axis of the cylindrical support. | 07-01-2010 |