Patent application number | Description | Published |
20080212641 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device. | 09-04-2008 |
20080215284 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - A method and apparatus for real-time thermal characterization of a fully operating cooling device ( | 09-04-2008 |
20080232069 | APPARATUS FOR FACILITATING COOLING OF AN ELECTRONICS RACK EMPLOYING A HEAT EXCHANGE ASSEMBLY MOUNTED TO AN OUTLET DOOR COVER OF THE ELECTRONICS RACK - An apparatus is provided for facilitating cooling of an electronics rack. The apparatus includes a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections. | 09-25-2008 |
20080239539 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS - An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center. | 10-02-2008 |
20080245506 | COOLING APPARTUSES WITH DISCRETE COLD PLATES COMPLIANTLY COUPLED BETWEEN A COMMON MANIFOLD AND ELECTRONICS COMPONENTS OF AN ASSEMBLY TO BE COOLED - Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface. | 10-09-2008 |
20080259567 | CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM - A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough. | 10-23-2008 |
20080265404 | Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling - Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed. | 10-30-2008 |
20080268764 | METHOD AND APPARATUS FOR A LOW IMPEDANCE ANTI-RECIRCULATION AIR MOVING INLET DEVICE - An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device. | 10-30-2008 |
20080273307 | LIQUID-BASED COOLING SYSTEM FOR COOLING A MULTI-COMPONENT ELECTRONICS SYSTEM - A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components. | 11-06-2008 |
20080278913 | COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED - A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled. | 11-13-2008 |
20080281551 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS - An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center. | 11-13-2008 |
20080285232 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-20-2008 |
20080310104 | LIQUID-BASED COOLING APPARATUS FOR AN ELECTRONICS RACK - A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers. | 12-18-2008 |
20090025223 | HEAT EXCHANGER WITH ANGLED SECONDARY FINS EXTENDING FROM PRIMARY FINS - A heat exchanger, method of fabrication and cooled electronics system employing the heat exchanger are provided. The heat exchanger, which in one embodiment cools air provided to heat generating components of a computer system, is disposed at an angle with respect to a direction of airflow. The heat exchanger includes a plurality of primary fins oriented parallel, and at least one plurality of secondary fins extending from at least one of a leading edge and a trailing edge of the plurality of primary fins. Each secondary fin extends from a respective primary fin at an angle other than 0° to facilitate airflow through the heat exchanger. Additionally, the secondary fins are fixedly positioned relative to and integral with the primary fins, thereby providing an increased heat transfer surface area. | 01-29-2009 |
20090080173 | VAPOR-COMPRESSION HEAT EXCHANGE SYSTEM WITH EVAPORATOR COIL MOUNTED TO OUTLET DOOR COVER OF AN ELECTRONICS RACK - A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough. | 03-26-2009 |
20090122487 | SYSTEM OF FACILITATING COOLING OF ELECTRONICS RACKS OF A DATA CENTER EMPLOYING MULTIPLE COOLING STATIONS - A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center. | 05-14-2009 |
20090122488 | APPARATUS FOR FACILITATING COOLING OF AN ELECTRONICS RACK THROUGH THE USE OF AN AIR-TO-LIQUID HEAT EXCHANGER - An apparatus for facilitating cooling of an electronics rack is provided. The apparatus includes an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to a door of an electronics rack. The inlet and outlet plenums are in fluid communication with the heat exchanger and respectively include a coolant inlet and coolant outlet in the top portions thereof. System coolant supply and return hoses are disposed above the electronics rack and respectively couple in fluid communication the inlet plenum to a system coolant supply header and the outlet plenum to a system coolant return header. The hoses are each flexible, partially looped and of sufficient length to allow for opening and closing of the door. Stress-relief structures are coupled to at least one end of the hoses to relieve stress on the ends of the hoses during opening or closing of the door. | 05-14-2009 |
20090126909 | SYSTEM AND METHOD FOR FACILITATING COOLING OF A LIQUID-COOLED ELECTRONICS RACK - Systems and methods are provided for cooling an electronics rack, which includes a heat-generating electronics subsystem across which air flows from an air inlet to an air outlet side of the rack. First and second modular cooling units (MCUs) are associated with the rack and configured to provide system coolant to the electronics subsystem for cooling thereof. System coolant supply and return manifolds are in fluid communication with the MCUs for facilitating providing of system coolant to the electronics subsystem, and to an air-to-liquid heat exchanger associated with the rack for cooling air passing through the rack. A controller monitors the system coolant and automatically shuts off flow of system coolant through the heat exchanger, using at least one isolation valve, upon detection of failure at one of the MCUs, while allowing the remaining operational MCU to provide system coolant to the electronics subsystem for liquid cooling thereof. | 05-21-2009 |
20090129000 | INTER-RACK AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER - An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed, has a first vertical end, a second vertical end, and a central vertical hinge located intermediate the first and second vertical ends. The airflow arrester further includes an attachment mechanism at the first vertical end and at the second vertical end, and when operatively disposed between a first and second structures, the airflow arrester has a single V-shaped configuration, and is sized and constructed to block airflow from passing therebetween. The single V-shaped configuration provides operational stability to the airflow arrester by translating net twisting forces applied to the airflow arrester to normal forces applied to the first and second structures at the attachment points of the airflow arrester to the first and second structures. | 05-21-2009 |
20090129016 | AIRFLOW ARRESTING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS RACK OF A DATA CENTER - An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism. | 05-21-2009 |
20090150123 | METHOD OF LAYING OUT A DATA CENTER USING A PLURALITY OF THERMAL SIMULATORS - A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack. | 06-11-2009 |
20090150129 | APPARATUS AND METHOD FOR SIMULATING HEATED AIRFLOW EXHAUST OF AN ELECTRONICS SUBSYSTEM, ELECTRONICS RACK OR ROW OF ELECTRONICS RACKS - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator. | 06-11-2009 |
20090150133 | APPARATUS AND METHOD FOR SIMULATING ONE OR MORE OPERATIONAL CHARACTERISTICS OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating simulation of one or more operating characteristics of an electronics rack. The apparatus includes a rack frame, one or more air-moving devices associated with the rack frame, and an adjustable heat source associated with the rack frame. The one or more air-moving devices establish airflow through the rack frame from an air inlet side to an air outlet side thereof, wherein the established airflow through the rack frame is related to airflow through the electronics rack to be simulated. The adjustable heat source heats air passing through the rack frame, with heated air exhausting from the air outlet side of the rack frame simulating heated air exhausting from the electronics rack. | 06-11-2009 |
20090154096 | APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough. | 06-18-2009 |
20090154159 | LIGHT SOURCE FOR ILLUMINATING AN ELECTRONICS RACK TO FACILITATE SERVICING THEREOF - An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes. | 06-18-2009 |
20090156114 | APPARATUS AND METHOD FOR FACILITATING AIR COOLING OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly. | 06-18-2009 |
20090157333 | METHOD AND SYSTEM FOR AUTOMATED ENERGY USAGE MONITORING WITHIN A DATA CENTER - An automated method and system are provided for facilitating monitoring of energy usage within a data center. The method includes automatically determining energy usage of one or more electronics racks of a data center by automatically ascertaining time-based energy usage of the electronics racks. The automatically ascertaining includes obtaining multiple measurements of instantaneous energy usage by each of the electronics racks in the data center over a period of time, and then separately averaging the multiple measurements for each electronics rack to obtain the time-based energy usage of each electronics racks. The method also includes outputting the time-based energy usage of the electronic(s) racks to facilitate monitoring of the data center. | 06-18-2009 |
20090268404 | ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK - Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism. | 10-29-2009 |
20090316360 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled. | 12-24-2009 |
20100002393 | LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem. | 01-07-2010 |
20100029193 | METHOD FOR PREVENTING AIR RECIRCULATION AND OVERSUPPLY IN DATA CENTERS - A method for preventing air recirculation in a data center is provided. The method includes specifying a target temperature of IT equipment and a flow volume of cold air entering an IT equipment rack, detecting an under-floor air temperature using a first temperature sensor provided in an under-floor plenum positioned adjacent to a cooling mechanism, detecting an IT equipment inlet temperature using a second temperature sensor positioned adjacent to a top portion of an IT equipment rack including the IT equipment, the IT equipment rack formed on a floor surface of the data center, the floor surface separating the under-floor plenum from the IT equipment rack, removing warm air exhausted from the IT equipment rack into a CRAC, chilling the warm air removed into the CRAC, the warm air being transformed by the CRAC into the cold air, exhausting the cold air from the CRAC to the under-floor plenum, controlling the cooling mechanism to regulate a cooling mechanism flow volume of the cold air in the under-floor plenum to the IT equipment rack such that the target temperature of IT equipment approximates the IT equipment inlet temperature and the cooling mechanism flow volume of the cold air equals the flow volume of the cold air entering into the IT equipment rack, and drawing the cold air into the IT equipment rack, the cold air being transformed by heat generated by the IT equipment into the warm air. | 02-04-2010 |
20100046574 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device. | 02-25-2010 |
20100071876 | COLD PLATE APPARATUS WITH A CONTROLLED HEAT TRANSFER CHARACTERISTIC BETWEEN A METALLURGICALLY BONDED TUBE AND HEAT SINK FOR FACILITATING COOLING OF AN ELECTRONICS COMPONENT - A cold plate apparatus is provided which includes a tube formed of a first metal, a casted heat sink member formed of a second metal surrounding a heat transfer region of the tube, and an alloy layer disposed between the tube and the heat sink member. The tube has its first and second ends, with the heat transfer region being disposed between its ends. The first and second ends of the tube extend from the heat sink member, and a metallurgical bond exists between the tube and heat sink member in the heat transfer region of the tube. The alloy layer formed during casting of the heat sink member by the first metal and second metal reacting peritectically, and with the thickness of the alloy layer minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond. | 03-25-2010 |
20100142150 | COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled. | 06-10-2010 |
20100195694 | Heat Flow Measurement Tool for a Rack Mounted Assembly of Electronic Equipment - A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values. | 08-05-2010 |
20100296248 | DUAL-CHAMBER FLUID PUMP FOR A MULTI-FLUID ELECTRONICS COOLING SYSTEM AND METHOD - A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber. | 11-25-2010 |
20100306994 | MULTI-FLUID COOLING OF AN ELECTRONIC DEVICE - A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature. | 12-09-2010 |
20110010151 | FLUID DISTRIBUTION APPARATUS AND METHOD FACILITATING COOLING OF ELECTRONICS RACK(S) AND SIMULATING HEATED AIRFLOW EXHAUST OF ELECTRONICS RACK(S) - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator. | 01-13-2011 |
20110051372 | STRESS RELIEVED HOSE ROUTING TO LIQUID-COOLED ELECTRONICS RACK DOOR - A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door. | 03-03-2011 |
20110056675 | APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 03-10-2011 |
20110063792 | Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System - A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser. | 03-17-2011 |
20110192027 | THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF - A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly. | 08-11-2011 |
20110205705 | AIRFLOW RECIRCULATION AND COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK - An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold. | 08-25-2011 |
20110279967 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-17-2011 |
20120103566 | LIQUID COOLED DATA CENTER WITH ALTERNATING COOLANT SUPPLY LINES - Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured to house computer equipment and the coolant supply lines provide coolant for the cabinets. Moreover, the cabinets are arranged in at least one row of adjacent cabinets such that each row of adjacent cabinets receives coolant from alternating coolant supply lines. | 05-03-2012 |
20120201004 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - A method and apparatus for real-time thermal characterization of a fully operating cooling device ( | 08-09-2012 |
20120201005 | ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 08-09-2012 |
20120232879 | DATA CENTER EFFICIENCY ANALYSES AND OPTIMIZATION - Method, system and computer program product for estimating the overall energy efficiency of a data center over a period of time. In one embodiment, a computer processor coupled to computer readable memory is configured to receive time parameters indicating the period of time over which the overall energy efficiency of the data center is to be estimated, receive component parameters indicating the performance characteristics of data center components and the operational interactions between the data center components, simulate the operation and interaction of the data center components based, at least in part, on the component parameters for the period of time over which the energy efficiency is estimated, and output results of the simulation to estimate the overall energy efficiency of the data center. | 09-13-2012 |
20120254400 | SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS - A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts. | 10-04-2012 |
20120279047 | METHOD OF FABRICATING A COOLED ELECTRONIC SYSTEM - A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader. | 11-08-2012 |
20120279233 | THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated. | 11-08-2012 |
20120279686 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 11-08-2012 |
20120281358 | COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS - Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader. | 11-08-2012 |
20120286514 | FLUID-DRIVEN, ELECTRICITY-GENERATING SYSTEM AND METHOD FOR A DATA CENTER - A fluid-driven, electricity-generating system and method are provided for a data center with a fluid transport pipe. The generating system includes a housing coupled in fluid communication with the fluid transport pipe, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the data center. | 11-15-2012 |
20120297807 | COOLING UNIT FOR CONTAINER-TYPE DATA CENTER - A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger. | 11-29-2012 |
20120298335 | AIR-COOLING WALL WITH SLIDABLE HEAT EXCHANGERS - An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s). | 11-29-2012 |
20120298338 | DATA CENTER WITH DUAL RADIATOR CABINETS FOR REDUNDANT OPERATION - Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two main coolant supply lines. The cabinets are configured to house computer equipment and the main coolant supply lines provide coolant to the plurality of cabinets. Moreover, each cabinet includes a cooler and each of these coolers includes at least two radiators which receive coolant from different main coolant supply lines. | 11-29-2012 |
20120300398 | MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks. | 11-29-2012 |
20130000736 | ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES - An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile. | 01-03-2013 |
20130019614 | AIR-SIDE ECONOMIZER FACILITATING LIQUID-BASED COOLING OF AN ELECTRONICS RACK - A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air. | 01-24-2013 |
20130021746 | DATA CENTER COOLING WITH AN AIR-SIDE ECONOMIZER AND LIQUID-COOLED ELECTRONICS RACK(S) - A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air. | 01-24-2013 |
20130068423 | AIR-SIDE ECONOMIZER FACILITATING LIQUID-BASED COOLING OF AN ELECTRONICS RACK - A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air. | 03-21-2013 |
20130068441 | DATA CENTER COOLING WITH AN AIR-SIDE ECONOMIZER AND LIQUID-COOLED ELECTRONICS RACK(S) - A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air. | 03-21-2013 |
20130096721 | DATA CENTER COOLING CONTROL - A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor. | 04-18-2013 |
20130107453 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE | 05-02-2013 |
20130118353 | SERVER RACK FRONT DOOR WITH CONTAMINATION FILTER AND SENSOR - An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air. | 05-16-2013 |
20130118712 | DUAL COIL WITH ADAPTER TO MOVE BETWEEN REDUNDANT AND NON-REDUNDANT HIGH PERFORMANCE HEAT EXCHANGER - An apparatus, rear door heat exchanger, system, and method for controlling the redundancy of a cooling system for a server rack. The system includes a cooling system having at least two liquid cooling circuits. The system also includes a rear door heat exchanger connected to the cooling system. The rear door heat exchanger includes two heat exchange coils. Each heat exchange coil is carried by the server rack and configured to interface with a different liquid cooling circuit. The rear door heat exchanger also includes an adapter configured to couple together the two heat exchange coils into one heat exchange unit. The heat exchange unit is configured to interface with one liquid cooling circuit from the cooling system. | 05-16-2013 |
20130138252 | DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS - Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1. | 05-30-2013 |
20130138253 | DYNAMICALLY LIMITING ENERGY CONSUMED BY COOLING APPARATUS - Cooling methods are provided which include providing: one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is also provided to dynamically adjust operation of the N controllable components, based on Z input parameters and one or more specified constraints, and provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1. | 05-30-2013 |
20130174421 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE - A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure. | 07-11-2013 |
20130186612 | APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 07-25-2013 |
20130191096 | FLUID DISTRIBUTION METHOD FACILITATING COOLING OF ELECTRONICS RACK(S) AND SIMULATING HEATED AIRFLOW EXHAUST OF ELECTRONICS RACK(S) - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator. | 07-25-2013 |
20130192794 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 08-01-2013 |
20130263450 | HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door. | 10-10-2013 |
20130264024 | PROCESS FOR OPTIMIZING A HEAT EXCHANGER CONFIGURATION - A heat exchanger core optimization method is provided for a heat exchanger door which resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger. | 10-10-2013 |
20130264026 | HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door. | 10-10-2013 |
20130264027 | PROCESS FOR OPTIMIZING A HEAT EXCHANGER CONFIGURATION - A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger. | 10-10-2013 |
20130264030 | STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - A heat exchanger door is provided which includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure. | 10-10-2013 |
20130265719 | STRUCTURAL CONFIGURATION OF A HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK - A method is provided which includes providing a heat exchanger door that includes a door assembly spanning at least a portion of the air inlet or outlet side of an electronics rack. The door assembly includes an airflow opening which facilitates air ingress or egress of airflow through the electronics rack. The door assembly further includes an air-to-coolant heat exchanger and a structural support. The heat exchanger is disposed so that airflow through the airflow opening passes across the heat exchanger. The heat exchanger includes a heat exchanger core and a heat exchanger casing coupled to the core. The core includes at least one coolant-carrying channel which loops through the casing. The structural support is attached to the heat exchanger casing to define with the casing a tubular door support structure. The looping of the coolant-carrying channel(s) through the heat exchanger casing resides within the tubular door support structure. | 10-10-2013 |
20130340994 | CONTROLLED COOLING OF AN ELECTRONIC SYSTEM FOR REDUCED ENERGY CONSUMPTION - Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system. | 12-26-2013 |
20130340995 | CONTROLLED COOLING OF AN ELECTRONIC SYSTEM FOR REDUCED ENERGY CONSUMPTION - Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system. | 12-26-2013 |
20130340996 | CONTROLLED COOLING OF AN ELECTRONIC SYSTEM BASED ON PROJECTED CONDITIONS - Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system. | 12-26-2013 |
20130343005 | THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) - Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure. | 12-26-2013 |
20130345893 | CONTROLLED COOLING OF AN ELECTRONIC SYSTEM BASED ON PROJECTED CONDITIONS - Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system. | 12-26-2013 |
20140043759 | MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks. | 02-13-2014 |
20140043760 | MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks. | 02-13-2014 |
20140043761 | MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks. | 02-13-2014 |
20140043762 | MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER - An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks. | 02-13-2014 |
20140063729 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 03-06-2014 |
20140068942 | VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels. | 03-13-2014 |
20140068943 | THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM - Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink. | 03-13-2014 |
20140069111 | THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM - Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink. | 03-13-2014 |
20140071626 | VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels. | 03-13-2014 |
20140071627 | COOLANT DRIP FACILITATING PARTIAL IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component. | 03-13-2014 |
20140078674 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140078675 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140082942 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 03-27-2014 |
20140085817 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140085822 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 03-27-2014 |
20140085823 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140090806 | ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES - An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile. | 04-03-2014 |
20140101933 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 04-17-2014 |
20140104787 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 04-17-2014 |
20140117761 | ENERGY EFFICIENT SOLAR POWERED HIGH VOLTAGE DIRECT CURRENT BASED DATA CENTER - A system and method for providing power is disclosed. A variable direct current (DC) power source provides a variable DC voltage. A configurator dynamically converts the variable DC voltage to a selected DC voltage to provide the power. A set of switches combines the solar voltage with a substantially constant DC voltage. A control unit controls the set of switches and the configurator to provide the combined voltages at a selected voltage level. | 05-01-2014 |
20140117965 | ENERGY EFFICIENT SOLAR POWERED HIGH VOLTAGE DIRECT CURRENT BASED DATA CENTER - A system and method for providing power is disclosed. A variable direct current (DC) power source provides a variable DC voltage. A configurator dynamically converts the variable DC voltage to a selected DC voltage to provide the power. A set of switches combines the solar voltage with a substantially constant DC voltage. A control unit controls the set of switches and the configurator to provide the combined voltages at a selected voltage level. | 05-01-2014 |
20140123492 | PUMP-ENHANCED, SUB-COOLING OF IMMERSION-COOLING FLUID - A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment. | 05-08-2014 |
20140123493 | SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section. | 05-08-2014 |
20140124163 | GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING - Cooling systems and methods are provided which include a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground. | 05-08-2014 |
20140124164 | GROUND-BASED HEAT SINK FACILITATING ELECTRONIC SYSTEM COOLING - Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground. | 05-08-2014 |
20140124167 | SECTIONED MANIFOLDS FACILITATING PUMPED IMMERSION-COOLING OF ELECTRONIC COMPONENTS - Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section. | 05-08-2014 |
20140124174 | PUMP-ENHANCED, SUB-COOLING OF IMMERSION-COOLING FLUID - Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment. | 05-08-2014 |
20140124189 | COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES - A coolant-conditioning unit is provided which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position. | 05-08-2014 |
20140124190 | COOLANT-CONDITIONING UNIT WITH AUTOMATED CONTROL OF COOLANT FLOW VALVES - A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position. | 05-08-2014 |
20140126149 | SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits. | 05-08-2014 |
20140126151 | SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits. | 05-08-2014 |
20140131008 | INLET-AIR-COOLING DOOR ASSEMBLY FOR AN ELECTRONICS RACK - A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack. | 05-15-2014 |
20140133096 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 05-15-2014 |
20140133098 | INLET-AIR-COOLING DOOR ASSEMBLY FOR AN ELECTRONICS RACK - A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack. | 05-15-2014 |
20140133099 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 05-15-2014 |
20140146467 | IMMERSION-COOLED AND CONDUCTION-COOLED ELECTRONIC SYSTEM - A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component. | 05-29-2014 |
20140146468 | IMMERSION-COOLED AND CONDUCTION-COOLED METHOD FOR ELECTRONIC SYSTEM - A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component. | 05-29-2014 |
20140158339 | THERMOSTAT-CONTROLLED COOLANT FLOW WITHIN A HEAT SINK - Cooling apparatuses and methods are presented for facilitating dissipation of heat generated by one or more electronic components. The apparatuses include, for instance, a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s). | 06-12-2014 |
20140158341 | THERMOSTAT-CONTROLLED COOLANT FLOW WITHIN A HEAT SINK - Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s). | 06-12-2014 |
20140163764 | EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS - Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings. | 06-12-2014 |
20140163767 | EFFECTIVENESS-WEIGHTED CONTROL OF COOLING SYSTEM COMPONENTS - Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings. | 06-12-2014 |
20140231061 | APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) - A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies. | 08-21-2014 |