Patent application number | Description | Published |
20080245658 | METHOD OF FORMING HfSiN METAL FOR n-FET APPLICATIONS - A compound metal comprising HfSiN which is a n-type metal having a workfunction of about 4.0 to about 4.5, preferably about 4.3, eV which is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer. Furthermore, after annealing the stack of HfSiN/high k dielectric/ interfacial layer at a high temperature (on the order of about 1000° C.), there is a reduction of the interfacial layer, thus the gate stack produces a very small equivalent oxide thickness (12 Å classical), which cannot be achieved using TaSiN. | 10-09-2008 |
20080293259 | METHOD OF FORMING METAL/HIGH-k GATE STACKS WITH HIGH MOBILITY - The present invention provides a gate stack structure that has high mobilities and low interfacial charges as well as semiconductor devices, i.e., metal oxide semiconductor field effect transistors (MOSFETs) that include the same. In the semiconductor devices, the gate stack structure of the present invention is located between the substrate and an overlaying gate conductor. The present invention also provides a method of fabricating the inventive gate stack structure in which a high temperature annealing process (on the order of about 800° C.) is employed. The high temperature anneal used in the present invention provides a gate stack structure that has an interface state density, as measured by charge pumping, of about 8×10 | 11-27-2008 |
20100015790 | TiC AS A THERMALLY STABLE p-METAL CARBIDE ON HIGH k SiO2 GATE STACKS - A compound metal comprising TiC which is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the TiC compound metal. Furthermore, the TiC metal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (pMOS) device. | 01-21-2010 |
Patent application number | Description | Published |
20080212641 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device. | 09-04-2008 |
20080215284 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - A method and apparatus for real-time thermal characterization of a fully operating cooling device ( | 09-04-2008 |
20080239539 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS - An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center. | 10-02-2008 |
20080281551 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL MEASUREMENTS - An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center. | 11-13-2008 |
20100046574 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device. | 02-25-2010 |
20120193536 | THERMALLY EXCITED NEAR-FIELD SOURCE - A high resolution material observation system includes an object having at least one spatial dimension sufficient to support production of near-field infrared emissions, a holder adapted to receive a sample to be observed, the holder further adapted to position the sample in the near-field infrared emissions, and a thermal excitation unit, adapted to be thermally coupled to at least one of the object and the sample. The thermal excitation unit is further adapted to causing black body radiation in either the object or the sample within the infrared spectrum. | 08-02-2012 |
20120201004 | APPARATUS FOR THERMAL CHARACTERIZATION UNDER NON-UNIFORM HEAT LOAD - A method and apparatus for real-time thermal characterization of a fully operating cooling device ( | 08-09-2012 |
20140063729 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 03-06-2014 |
Patent application number | Description | Published |
20080285232 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-20-2008 |
20090316096 | MULTI-DOMAIN AND IPS LIQUID-CRYSTAL DISPLAY USING DRY ALIGNMENT - The present invention includes a method of preparing a dry deposited liquid-crystal alignment layer using one of a mechanical mask, photo-resist, UV treatment, and ridge and fringe field methods. The present invention further provides a multi-domain, wide viewing angle liquid-crystal display, comprising: a bottom substrate; a first transparent conductive layer; a top substrate; a color filter layer; a second transparent conductive layer; a first dry deposited liquid-crystal alignment layer; a second dry deposited liquid-crystal alignment layer, the second dry deposited liquid-crystal alignment layer being spaced adjacent to and facing the first dry deposited liquid-crystal alignment layer; spacers; and a liquid-crystal material. Each of the first alignment layer and the second alignment layer is divided into a plurality of pixels each having a boundary and at least two domains and the domains of each of the multi-domain, dry deposited liquid-crystal alignment layers is obtained by a method selected from the group consisting of: a mechanical mask, photo-resist, UV treatment, and ridge and fringe field. The multi-domain, wide viewing angle liquid-crystal display of the present invention can be operated in the in-plane switching mode, which results in reduced image sticking. | 12-24-2009 |
20110279967 | Techniques for Data Center Cooling - Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack. | 11-17-2011 |