Kuan-Jui
Kuan-Jui Ho, New Taipei City TW
Patent application number | Description | Published |
---|---|---|
20130103872 | COMPUTER APPARATUS AND METHOD FOR DISTRIBUTING INTERRUPT TASKS THEREOF - A computer apparatus and a method for distributing interrupt tasks thereof are provided. The computer apparatus has a plurality of CPUs and a chipset, and the chipset is electrically coupled to each of the CPUs. The chipset is configured for receiving an interrupt request sent from an external hardware device and judging whether or not a task type corresponding to the interrupt request has ever been performed by any one of the CPUs. If a judging result thereof is yes, the chipset assigns the interrupt request to the CPU that has ever performed the task type, so as to perform a corresponding interrupt task. | 04-25-2013 |
20140108706 | DATA STORAGE DEVICE, STORAGE MEDIA CONTROLLER AND STORAGE MEDIA CONTROL METHOD - A storage media control method, by which a data strobe signal is shifted by different phase shifts at different time intervals during a write-leveling operation to be received by a storage media and compared to a clock signal for returning a data signal. At the storage media side, during the write-leveling operation, a synchronous transmission between the received data strobe signal and the clock signal causes a transition event at the data signal. The number of transition-event occurrences is counted. When the count shows that just one transition event has occurred over a full round of phase shift tests of the data strobe signal, the phase shift corresponding to the transition event is used in the adjustment of the data strobe signal, which is received by the storage media as the data extraction reference of a write operation. | 04-17-2014 |
Kuan-Jui Huang, Kao-Hsiung Hsien TW
Patent application number | Description | Published |
---|---|---|
20090064496 | INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME - The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via. | 03-12-2009 |
20090267108 | LIGHT EMITTING DIODE CHIP PACKAGE AND METHOD OF MAKING THE SAME - The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer. | 10-29-2009 |
20090273004 | CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME - A chip package structure and method thereof uses a semiconductor substrate as a package substrate, which improve heat dissipation. Also, the chip package structure is incorporated with a planarization structure, which renders the chip and the package substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, electrical connections in series or in parallel between chips can be easily implemented by virtue of the planar patterned conductive layer. | 11-05-2009 |
20100090245 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted. | 04-15-2010 |
20120080693 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME - The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted. | 04-05-2012 |
Kuan-Jui Huang, Tu-Cheng TW
Patent application number | Description | Published |
---|---|---|
20120230055 | FRONT LIGHT ILLUMINATION DEVICE AND REFLECTIVE DISPLAY DEVICE EMPLOYING THE SAME - A display device includes a display layer and a light guide plate (LGP) arranged on the display layer. The LGP includes a first surface facing away from the display layer, an opposite second surface, and a lateral surface between the first and second surfaces, the lateral surface having a light incident portion. A light source and a scanning mirror are arranged on the lateral surface of the LGP. The light source configured to emit a light beam toward the scanning mirror, the scanning mirror being reciprocally rotatable about a rotating axis at a given frequency, the scanning mirror configured to reflect and direct the light beam from the light source to enter into the LGP through the light incident portion. | 09-13-2012 |
20120242623 | TOUCH SENSITIVE DEVICE AND DISPLAY DEVICE EMPLOYING THE SAME - A display device includes a display layer and a light guide plate (LGP) arranged on the display layer. A transparent plate is arranged between the LGP and the display layer, and the transparent plate houses a array of IR sensors. An IR source is arranged on the lateral surface of the LGP, and a scanning mirror is arranged on the lateral surface of the LGP. The IR sensors sense the IR light beams and determine whether a strength of the sensed IR light beams is decreased to below a predetermined threshold value, caused by a touch by a user, on the transparent plate at a location of said IR sensor, and send a signal associated with the touch to the control unit, the control unit is configured to receive the signal and determine the touch point according to the location of said IR sensor. | 09-27-2012 |