Minotti
Agatino Minotti, Masculacia IT
Patent application number | Description | Published |
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20090011549 | PROCESS AND SYSTEM FOR MANUFACTURING AN ENCAPSULATED SEMICONDUCTOR DEVICE - A process for manufacturing a semiconductor device envisages the steps of: positioning a frame structure, provided with a supporting plate carrying a die of semiconductor material, within a molding cavity of a mold; and introducing encapsulating material within the molding cavity for the formation of a package, designed to encapsulate the die. The frame structure is further provided with a prolongation element mechanically coupled to the supporting plate inside the molding cavity and coming out of the molding cavity, and the process further envisages the steps of: controlling positioning of the supporting plate within the molding cavity with the aid of the prolongation element; and, during the step of introducing encapsulating material, separating and moving the prolongation element away from the supporting plate. | 01-08-2009 |
20100159057 | PROCESS AND SYSTEM FOR MANUFACTURING AN ENCAPSULATED SEMICONDUCTOR DEVICE - A process for manufacturing a semiconductor device envisages the steps of: positioning a frame structure, provided with a supporting plate carrying a die of semiconductor material, within a molding cavity of a mold; and introducing encapsulating material within the molding cavity for the formation of a package, designed to encapsulate the die. The frame structure is further provided with a prolongation element mechanically coupled to the supporting plate inside the molding cavity and coming out of the molding cavity, and the process further envisages the steps of: controlling positioning of the supporting plate within the molding cavity with the aid of the prolongation element; and, during the step of introducing encapsulating material, separating and moving the prolongation element away from the supporting plate. | 06-24-2010 |
Agatino Minotti, Mascalucia IT
Patent application number | Description | Published |
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20110260314 | DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE - A die package is provided, including a die positioned on and in direct contact with a first heat sink element, and also including a package case and leads made of conductive material, protruding from the package case. The die package further includes a second heat sink element shaped as a spring element, in contact between the die and the leads, and emerging from a side of the package case opposite the first heat sink element. | 10-27-2011 |
20110291286 | ELECTRONIC DEVICE AND METHOD FOR CONNECTING A DIE TO A CONNECTION TERMINAL - An electronic device including a die-pad area, a die fixed to the die-pad area, a connection terminal, and a ribbon of conductive material. The ribbon is electrically connected to the die and to the connection terminal, and has a prevalent dimension along a first axis, a width, measured along a second axis, which is transverse to the first axis, and a thickness, which is negligible with respect to the width; the ribbon moreover has a cross section that defines a concave geometrical shape. | 12-01-2011 |
20120320545 | INTELLIGENT POWER MODULE AND RELATED ASSEMBLING METHOD - An intelligent power module includes a power circuit board having a plurality of power devices and fixed on a base plate of a case body able to be closed with a lid to form a protective case of the intelligent power module. The intelligent power module also includes a control circuit board suitable to drive the power devices of the power circuit board. The control circuit board is associated with the lid in such a way that the control circuit board is comprised within the case body. The control circuit board and the lid thus realizing an intelligent lid of the intelligent power module. | 12-20-2012 |
20130320570 | ELECTRONIC DEVICE FOR POWER APPLICATIONS - An electronic device for power applications and configured for being mounted on a printed circuit board is disclosed. The electronic device includes a semiconductor chip integrating a power component, and a package. The package comprises an insulating body embedding the semiconductor chip, and exposed electrodes for electrically connecting conductive terminals of the semiconductor chip to external circuitry in the printed circuit board. The electronic device is further configured to be fastened to a heatsink with a back surface of the insulating body in contact with a main surface of the heatsink for removing heat produced by the electronic device during the operation thereof. The insulating body lacks of a fixing portion in which a hole for receiving an insertable fastener element for the fastening of the electronic device to the heatsink is located. | 12-05-2013 |
20140001647 | FLIP-CHIP ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF | 01-02-2014 |
20160099200 | ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS - Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%. | 04-07-2016 |
Agatino Minotti, Mascalucia (ct) IT
Patent application number | Description | Published |
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20120217655 | ELECTRONIC DEVICE FOR HIGH POWER APPLICATIONS - An electronic device includes a first semi-conductor die, a second semi-conductor die and an electrically conductive element. The electrically conductive element includes a first electrically conductive part interposed at least partially between the first semi-conductor die and the second semi-conductor die, wherein said first part is electrically coupled to the first semi-conductor die. The electrically conductive element further includes a second electrically conductive part electrically coupled to the first part, wherein said second part extends from at least part of the first part. The first part is an electrically conductive strap between the dice, and the second part is clip extending from at least part of the strap. | 08-30-2012 |
Agatino Minotti, Cantania IT
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20160079092 | POWER DEVICE HAVING REDUCED THICKNESS - An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink. | 03-17-2016 |
Agatino Carmelo Minotti, Cantania IT
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20120025358 | SEMICONDUCTOR ELEMENT WITH SEMICONDUCTOR DIE AND LEAD FRAMES - A semiconductor element to be mounted on a circuit carrier includes a semiconductor die and at least one lead frame. In order to reduce the size required for mounting a semiconductor die on a circuit carrier, a semiconductor element includes a semiconductor die and at least one lead frame. The at least one lead frame is directly attached to the semiconductor die at a connection region of the semiconductor die, and the connection region provides an electrical connection to and mechanical support for the semiconductor die. | 02-02-2012 |
20130001764 | POWER DEVICE HAVING REDUCED THICKNESS - An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink. | 01-03-2013 |
Americo Michael Minotti, State Road, NC US
Patent application number | Description | Published |
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20090216183 | Multi medication nasal spray device and method - A nasal spray apparatus for simultaneously administrating metered amounts of multiple medicaments includes chambers for separately storing incompatible medicaments, such as an antihistamine and a steroid. Reciprocal piston pumps allow the medications to be sprayed into the user's nasal cavity. Two pumps can be used to separately transfer the medicaments to a receptacle where they can be initially mixed just prior to administration. A small volume receptacle is used to reduce the amount of mixture remaining after each stroke of the nasal spray apparatus. A check valve can be associated with each pump to further reduce medicament mixtures from cross contamination within storage chamber preparations. Collapsible components, including collapsible storage chambers or balloon capacitors can be employed to compensate for vacuums and back pressures as the medicaments are pumped to a spray nozzle. | 08-27-2009 |
Antonio Minotti, Rome IT
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20080212407 | Surface Micromechanical Process For Manufacturing Micromachined Capacitive Ultra-Acoustic Transducers and Relevant Micromachined Capacitive Ultra-Acoustic Transducer - The invention concerns a manufacturing process, and the related micromachined capacitive ultra-acoustic transducer, that uses commercial silicon wafer | 09-04-2008 |
Claudio Minotti, Verano Brianza IT
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20130059102 | Process For The Production Of Multilayer Blow-Molded Hollow Articles - The present invention relates to blow molded multilayer hollow articles and a coextrusion blow molding process for the production of said multilayer hollow articles, made of thermoplastic polymers and characterized by a specific visual effect. More in particular, the present invention relates to multilayer hollow articles and a coextrusion blow molding process for the production of said multilayer hollow articles, wherein at least one layer is a continuous layer with a uniform degree of thickness and at least one layer is a discontinuous or a non-uniform continuous layer with varying degree of thickness, which results in a specific surface pattern and/or visual color effect. | 03-07-2013 |
Jean Pierre Minotti, Gorduno CH
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20160059369 | HANDLING DEVICE FOR WIRE ELECTRIC DISCHARGE MACHINES - A wire electric discharge machine for machining a workpiece includes a handling device for handling core pieces produced by the machine during the machining of the workpiece and upper and lower wire guiding heads moveable with respect to each other and with respect to the workpiece. The handling device includes a gripper mounted in a fixed or movable relation to the upper wire guiding head. The gripper moves so as to face a produced core piece with its gripper base. The gripper includes a fluid inlet where fluid flow under positive pressure enters the gripper and a fluid outlet at the gripper base where the fluid flow exits the gripper. An interior of the gripper guides the fluid flow, producing a low pressure region at the gripper base as the fluid flow exits, generating lifting force to remove the produced core piece from the workpiece by movement of the gripper. | 03-03-2016 |
Jody M. Minotti, Bloomfield, CT US
Nicole Minotti, Appleton, WI US
Patent application number | Description | Published |
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20110215017 | NAVIGATION SYSTEM - An array of personal care product packages comprises a first package containing a first personal care product and a second package containing a second personal care product. The first package and the second package are each of a single primary brand. The first package is of a first sub-brand and the second package is of a second sub-brand that is different than the first sub-brand. Each package further includes a visual schema, where the visual schema comprises a primary viewing area. The primary viewing area includes a product identification region comprising product identification indicia, a qualitative information region comprising qualitative information indicia, and a photographic region comprising photographic indicia. In addition, the visual schema is repeated for the first package and the second package. | 09-08-2011 |
20140018764 | Containment System - A method for providing a containment system includes providing a permanently closed containment pant and providing a discrete absorbent insert. The containment pant includes an elastically extensible chassis and a sling positioned within the chassis that includes a fluid-impervious pouch. The pouch has a first end section maximum width of at least 145 mm, a central section maximum width of less than 115 mm, and a second end section maximum width of at least 145 mm. The containment pant is substantially devoid of an integrated absorbent core. The absorbent insert includes an absorbent core with a first end section maximum width of at least 120 mm, a central section maximum width of less than 100 mm, and a second end section maximum width of at least 120 mm. The absorbent insert is devoid of a fluid-impervious layer. | 01-16-2014 |
Patrice Minotti, Gennes FR
Patent application number | Description | Published |
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20080316871 | Drive Device, Particularly for a Clockwork Mechanism - A drive device formed by etching a wafer. The drive device includes a drive element that can sequentially mesh with a driven element and an actuating element that can displace the drive element according to a hysteresis movement thereby driving the driven element. Placement of the drive element on an outer edge of the wafer enables an interfacing of the drive element with a driven element placed opposite therefrom. A clockwork mechanism including a drive device of the aforementioned type and an input gear that can be rotationally driven by the drive device is also provided. | 12-25-2008 |
20090096323 | Method and Device for Moving an Element to Be Driven Using an Actuating Element Formed by Etching in a Semiconductor Material - The invention concerns an element to be driven, a driving element designed to be urged into engagement with the element to be driven and an actuating element adapted to move the driving element so that it drives the element to be driven in step-by-step displacement, the driving element and the actuating element being formed by etching in a semiconductor material wafer. The invention is characterized in that it comprises elastic prestressing means for maintaining the driving element in contact with the element to be driven. | 04-16-2009 |
20140060208 | PASSIVE, REVERSIBLE DEFORMATION SENSOR - The present invention relates to the field of microsensors, and particularly to a passive and reversible deformation sensor, specifically cycles of deformations in a direction OX of a structure, specifically during cycles of temperatures or mechanical stresses to which the structure is subjected, this sensor including elements ( | 03-06-2014 |
20140292137 | Actuation device with a drive element actuated by crawling - The subject matter here is an actuation device ( | 10-02-2014 |
20150022053 | PASSIVE INDEXING OF A MOVABLE ELEMENT HAVING TEETH - The invention relates to a device including: a movable element ( | 01-22-2015 |
Pietro Minotti, Giussano (monza) IT
Patent application number | Description | Published |
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20110207960 | Process For The Preparation Of Iodinated Contrast Agent - The present invention relies on a process for the preparation of non ionic iodinated contrast agents and, in more details, it relates to a process for the preparation of Iopamidol in high yields and with a high degree of purity. In more details, the invention discloses a process for the preparation of a compound of formula (III) comprising the 5 condensation reaction a compound of formula (II) with 2-amino-1,3-propandiol, being said reaction carried out in an aprotic dipolar solvent and in the presence of an alkaline or alkaline rare earth metal oxide or hydroxide. | 08-25-2011 |