Patent application number | Description | Published |
20090061688 | Card-type peripheral device - A card-type peripheral device includes an electronic component disposed in a case, and a terminal part including connection terminals connectable with a to-be-connected device, wherein a function of the electronic component and the number of terminals of the terminal part are maintained to be compatible with those of the to-be-connected device, and the outside dimensions of the case are set to be smaller than the outside dimensions of the to-be-connected device and greater than the outside dimensions of a predetermined small-size card. | 03-05-2009 |
20090063743 | Card-type peripheral device - A card-type peripheral device includes an electronic component including a memory disposed in a case, a terminal part including connection terminals connectable with a to-be-connected device, and a switch for disabling writing to the memory. The card-type peripheral device further includes a signal terminal capable of transmitting a signal indicating the status of the switch to the to-be-connected device. | 03-05-2009 |
20090077295 | Card-type peripheral device - A card-type peripheral device having a plurality of specifications of external interfaces includes a connector configured to connect the card-type peripheral device to a connectable device connectable to the card-type peripheral device, the connector including a dedicated terminal in which an interface to be used is set; an electronic component configured to be accessed via the set interface; a plurality of interface function units each configured to control an interface compliant with one of the plurality of specifications; and a communication function unit configured to perform communication with the electronic component using one of the interface function units having a specification corresponding to a setting of the dedicated terminal. | 03-19-2009 |
20090238018 | Integrated circuit including Built-In Self Test circuit to test memory and memory test method - An integrated circuit includes multiple memory circuits including memory cell arrays different in size, a BIST circuit which has a cell sequential transition test processor and which outputs a test cell address, a transition direction specification signal and an active signal. The integrated circuit has adjustment circuits which are provided respectively for the memory circuits and which replace the test cell address with the test cell address in a memory cell array area, or which convert the active signal into a signal indicating non-execution when the test cell address outputted from the BIST circuit corresponds to a cell in a virtual cell array being in an area outside the memory cell array. | 09-24-2009 |
20110103027 | CARD-TYPE PERIPHERAL APPARATUS - Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body. | 05-05-2011 |
20110161689 | CARD PERIPHERAL DEVICE AND CARD SYSTEM - Disclosed herein is a card peripheral device including, an electronic part unit, a connector part, and a power supply unit, wherein the electronic part unit includes a controller, and at least a second interface, out of a first interface and the second interface, and the controller has a function to vary data transfer speed depending on whether power feed of the first power by the power supply terminal is received or the second power by the power supply unit is received. | 06-30-2011 |
Patent application number | Description | Published |
20080275173 | Liquid Addition-curable Silicone Composition for Fiber-reinforced Composite Material,Fiber-reinforced Silicone Composite Material and Method of Producing Same - The present invention provides a liquid addition-curable silicone composition for a fiber-reinforced composite material which, when combined with a reinforcing fiber and molded, yields molded items with excellent heat resistance and strength that can be used favorably for aircraft members (such as the main wings and fuselage of passenger aircraft or military aircraft), spacecraft members, artificial satellite members, electrical and electronic device componentry (such as mobile telephone cases), construction members (such as repairing or reinforcing materials for engineering and construction) and automobile members (such as structural materials surrounding the engine) that are exposed to high temperatures. The invention also provides a fiber-reinforced silicone composite material, and an effective method of producing the composite material. The present invention provides: a liquid addition-curable silicone composition for a fiber-reinforced composite material, comprising the components (a), (b) and (c) listed below: (a) an organopolysiloxane in which the molar ratio of alkenyl groups relative to silicon atoms is within a range from 0.3 to 2.0, (b) an organohydrogenpolysiloxane containing hydrogen atoms bonded to silicon atoms, in which the molar ratio of the hydrogen atoms relative to silicon atoms is within a range from 0.3 to 2.0, and (c) a platinum group metal-based catalyst; a fiber-reinforced silicone composite material, comprising the above liquid addition-curable silicone composition as a matrix, and obtained by mixing the matrix with a reinforcing fiber and subsequently conducting curing; and a method of producing a fiber-reinforced silicone composite material, comprising the steps of: mixing the above liquid addition-curable silicone composition for a fiber-reinforced composite material with a reinforcing fiber, and curing the resulting mixture by heating. | 11-06-2008 |
20090069485 | Method of producing metal-ceramic composite material having metallic luster - A method of producing a metal-ceramic composite material having a metallic luster. This method involves subjecting a cured product obtained by curing a curable silicone composition containing a metal filler to heating under a non-oxidizing atmosphere, at a temperature that is within a range from 400 to 1,500° C. and is less than the melting point of the metal filler. Using this method, a metal-ceramic composite material that has a shape and dimensions that meet the required specifications with a high degree of precision can be produced with comparative ease. | 03-12-2009 |
20090169458 | METHOD OF PRODUCING SILICON CARBIDE - A method of producing silicon carbide is provided. The method includes heating a cured product of a curable silicone composition in a non-oxidizing atmosphere at a temperature exceeding 1,500° C. but not more than 2,600° C. The method is capable of producing high-purity silicon carbide simply and at a high degree of productivity, and is capable of simply producing a silicon carbide molded item having a desired shape and dimensions. | 07-02-2009 |
20120196135 | SILICON CARBIDE CONJUGATE AND METHOD OF JOINING SILICON CARBIDE MEMBERS - A high-purity silicon carbide conjugate having excellent heat resistance, and a method of producing such a conjugate. The silicon carbide conjugate is composed of a high-purity silicon carbide joining layer provided between a silicon carbide member and another silicon carbide member. The conjugate is obtained by interposing a curable silicone composition between the two silicon carbide members, curing the composition to obtained a cured product layer, and then thermally decomposing the cured product layer in a non-oxidizing atmosphere, thereby converting the layer to silicon carbide and joining the members together. The conjugate has excellent heat resistance and a high degree of purity. | 08-02-2012 |
20120201736 | METHOD OF PRODUCING A SILICON CARBIDE MOLDED ITEM - A method of producing a silicon carbide molded item is provided. The method includes molding a curable silicone composition comprising a silicon carbide powder or a combination of a silicon carbide powder and a carbon powder into a desired shape, curing the molded curable silicone composition to yield a cured silicone molded item, and then thermally decomposing the cured silicone molded item under a non-oxidizing atmosphere. The method is capable of simply producing a high-purity silicon carbide molded item having a desired shape and dimensions. | 08-09-2012 |
20120202046 | METHOD OF DENSIFYING POROUS SILICON CARBIDE SUBSTRATE - A densified silicon carbide body having excellent mechanical strength. This body is obtained by a method of densifying a porous silicon carbide substrate that includes the steps of impregnating a porous silicon carbide substrate with a curable silicone composition that contains a silicon carbide powder, curing the silicone composition, and thermally decomposing the cured product in a non-oxidizing atmosphere. The porous silicon carbide substrate can be densified and improved easily. | 08-09-2012 |
20120202069 | METHOD OF PRODUCING SILICON CARBIDE-COATED CARBON MATERIAL - A method of producing a silicon carbide-coated carbon material that comprises heating, under a non-oxidizing atmosphere, a carbon substrate and an amorphous inorganic ceramic material obtained by heating a non-melting solid silicone, thereby forming a silicon carbide coating film on the carbon substrate. A silicon carbide-coated carbon material that exhibits excellent heat resistance and has a uniform silicon carbide coating can be obtained. | 08-09-2012 |
20120216708 | SILICON CARBIDE POWDER COMPOSITION AND METHOD OF PRODUCING SILICON CARBIDE MOLDED PRODUCT USING SAME - A silicon carbide powder composition comprising a silicon carbide powder obtained by thermally decomposing a silicone cured product within a non-oxidizing atmosphere and an organic binder. The composition can be sintered to form a silicon carbide molded product having a complex shape even without the inclusion of a sintering assistant. | 08-30-2012 |
20120219798 | SPHERICAL SILICON CARBIDE POWDER, METHOD OF PRODUCING SAME, AND METHOD OF PRODUCING SILICON CARBIDE CERAMIC MOLDED PRODUCT USING SAME - A high-purity spherical silicon carbide powder is obtained by thermally decomposing a spherical cured silicone powder under a non-oxidizing atmosphere. | 08-30-2012 |
20130039832 | METHOD OF PRODUCING SILICON CARBIDE - A method of producing silicon carbide is provided. The method includes heating a cured product of a curable silicone composition in a non-oxidizing atmosphere at a temperature exceeding 1,500° C. but not more than 2,600° C. The method is capable of producing high-purity silicon carbide simply and at a high degree of productivity, and is capable of simply producing a silicon carbide molded item having a desired shape and dimensions. | 02-14-2013 |
20130323152 | READILY SINTERABLE SILICON CARBIDE POWDER AND SILICON CARBIDE CERAMIC SINTERED BODY - Provided are: a readily sinterable silicon carbide powder substantially having a stoichiometric composition and from which a dense sintered body can be obtained; a silicon carbide ceramic sintered body having a low specific resistance; and a production method thereof. This readily sinterable silicon carbide powder has a carbon/silicon elemental ratio of 0.96 to 1.04, an average particle diameter of 1.0 to 100 μm, and a ratio of 20% or less of an integrated value of an absorption intensity in a chemical shift range of 0 to 30 ppm to an integrated value of an absorption intensity in a chemical shift range of 0 to 170 ppm, in a | 12-05-2013 |