Patent application number | Description | Published |
20090059712 | OUTPUT DRIVER - An output driver is applicable to two or more interface standards. The output driver includes a pre-driver configured to generate pull-up control signals and pull-down control signals according to a logic value of data to be output and a target resistance, and adjust slew rates of the pull-up control signals and the pull-down control signals according to operation modes, and a driver configured to output the data in response to the pull-up and pull-down control signals. | 03-05-2009 |
20090256585 | DATA LINE TERMINATION CIRCUIT - A data line termination circuit includes a swing-width sensing unit configured to sense a swing width of a voltage of a data line and output a sensed signal, and a variable termination unit configured to adjust a termination resistance value of the data line in response to the sensed signal. The swing-width sensing unit can sense if the swing width is less than or greater than a predetermined swing width, and the swing width of the voltage of the data line can be reduced or increased to maintain the voltage of the data line within a predetermined range. | 10-15-2009 |
20100039093 | CIRCUIT FOR GENERATING INTERNAL VOLTAGE OF SEMINCONDUCTOR MEMORY APPARATUS - An internal voltage generating circuit of a semiconductor memory apparatus includes a control signal generating unit configured to enable one of a plurality of control signals in response to a calibration code; and a signal variable voltage distributing unit configured to determine a distribution ratio in response to one enabled control signal of the plurality of control signals and generate an internal voltage by distributing an external voltage at the determined distribution ratio. | 02-18-2010 |
20100164076 | STACKED SEMICONDUCTOR PACKAGE - A semiconductor package includes a wire board, a plurality of semiconductor chips configured to be stacked over the wire board and to be electrically coupled with the wire board, and at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage. | 07-01-2010 |
20100164084 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits. | 07-01-2010 |
20100164605 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit is capable of minimizing/decreasing the increase in the inductance of a package due to a power supply network thereof. The semiconductor integrated circuit includes a first power mesh configured to supply a first power to a first internal circuit, a second power mesh configured to supply a second power to a second internal circuit, the first power and the second power being used for different purposes and being equal in DC level, and a connection unit configured to connect the first power mesh to the second power mesh. | 07-01-2010 |
20100246288 | CIRCUIT AND METHOD FOR OUTPUTTING DATA IN SEMICONDUCTOR MEMORY APPARATUS - A data output circuit of a semiconductor memory apparatus includes a pre-driver generating pull-up and down signals from driving rising and falling data in active periods of rising and falling clocks, respectively, in accordance with a state of an output enable signal. A main driver generates last output data to a common node from the pull-up and down signals. An assistant pre-driver generates an assistant drive signal, which is activated when the rising data disagrees with the falling data, in correspondence with inputs of the rising data, the falling data, the rising clock, the falling clock, and a pipe output control signal. An assistant main driver generates assistant last output data to the common node from the pull-up and down signals in accordance with a state of the assistant drive signal. | 09-30-2010 |
20110001552 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first transmission line and a second transmission line disposed at different layers; a contact fuse coupled with the first transmission line and the second transmission line; a power driver configured to apply an electric stress to the contact fuse; and a fuse state output unit configured to output a fuse state signal having a logic level corresponding to an electric connection state of the contact fuse. | 01-06-2011 |
20110001559 | SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - A semiconductor device and a method for driving the same rapidly detect failure of a through-semiconductor-chip via and effectively repairing the failure using a latching unit assigned to each through-semiconductor-chip via. The semiconductor device includes a plurality of semiconductor chips that are stacked, and a plurality of through-semiconductor-chip vias to commonly transfer a signal to the plurality of semiconductor chips, wherein each of the semiconductor chips includes a multiplicity of latching units assigned to the through-semiconductor-chip vias and the multiplicity of latching units of each of the semiconductor chips constructs a boundary scan path including the plurality of through-semiconductor-chip vias to sequentially transfer test data. | 01-06-2011 |
20110006391 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units. | 01-13-2011 |
20110068822 | DATA LINE TERMINATION CIRCUIT - A data line termination circuit includes a swing-width sensing unit configured to sense a swing width of a voltage of a data line and output a sensed signal, and a variable termination unit configured to adjust a termination resistance value of the data line in response to the sensed signal. The swing-width sensing unit can sense if the swing width is less than or greater than a predetermined swing width, and the swing width of the voltage of the data line can be reduced or increased to maintain the voltage of the data line within a predetermined range. | 03-24-2011 |
20120025349 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits. | 02-02-2012 |
20120092062 | SEMICONDUCTOR SYSTEM - A semiconductor system includes a controller; a semiconductor device comprising a plurality of stacked semiconductor chips stacked over the controller, and a plurality of through-silicon vias (TSVs) configured to commonly transfer a signal to the plurality of stacked semiconductor chips; and a defect information transfer TSV configured to transfer TSV defect information sequentially outputted from at least one of the semiconductor chips to the controller, wherein the controller comprises: a plurality of first repair fuse units configured to set first fuse information based on the TSV defect information; and a plurality of first TSV selection units configured to selectively drive the TSVs in response to the first fuse information. | 04-19-2012 |
20120155200 | MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND CONTROL METHOD THEREOF - A memory system includes a memory device, a control device configured to control the memory device, a first channel configured to transfer a row command from the control device to the memory device, and a second channel configured to transfer a column command from the control device to the memory device. | 06-21-2012 |
20130246867 | TEST CIRCUIT, MEMORY SYSTEM, AND TEST METHOD OF MEMORY SYSTEM - This technology relates to smoothly performing a test on a memory circuit having a high memory capacity while reducing the size of a test circuit. A test circuit according to the present invention includes a test execution unit configured to perform a test on a target test memory circuit, an internal storage unit configured to store data for the test execution unit, and a conversion setting unit configured to set a part of or the entire storage space of the target test memory circuit as an external storage unit for storing the data for the test execution unit. | 09-19-2013 |
20130299770 | RESISTIVE MEMORY DEVICE - A resistive memory device includes: a memory cell comprising first and second electrodes and a resistive layer formed therebetween, wherein the resistive layer is formed of a resistance change material; and a strained film formed adjacent to the resistive layer and configured to apply a strain to the resistive layer. | 11-14-2013 |