Lin, Kaohsiung
Barry Lin, Kaohsiung TW
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20110147903 | Leadframe Circuit and Method Therefor - An integrated circuit leadframe device supports various chip arrangements. As consistent with various embodiments, a leadframe includes a plurality of banks of conductive integrated circuit chip connectors. Each bank has a plurality of conductive strips respectively having an end portion, the end portions of each of the strips in the bank being substantially parallel to one another and arranged at an oblique angle to end portions of strips in at least one of the other banks. Each of the end portions has a tip extending to an interior portion of the leadframe device and separated from the other tips by a gap. A fastening material is arranged on at least some of the conductive strips and configured to fasten an integrated circuit chip to the conductive strips | 06-23-2011 |
Chang-Tsun Lin, Kaohsiung TW
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20090231141 | RFID TAG USING MONOPOLE ANTENNA - A radio frequency identification (RFID) tag using a monopole antenna is provided, in which an antenna structure is disposed on a metal plate, two ends of an RFID chip are electrically connected to the antenna structure, and the antenna structure and the RFID chip form a loop structure. The RFID tag can be disposed on a surface of an object to be measured, or disposed in an inner accommodation space of the object to be measured, so it is widely used in various applications. Additionally, the RFID tag is easily manufactured, so the production cost can be reduced. Furthermore, the RFID tag has a larger readable distance, and an electromagnetic wave emitting direction of the RFID tag is adjustable according to different included angles between the metal plate and the antenna structure, thereby causing signals to be read easily and identification ability to improve, two desirable effects. | 09-17-2009 |
20120175491 | RFID TAG HOLDER - The present invention relates to an RFID tag holder, which comprises an RFID tag carrier used to carry an RFID tag, and a base having a circular surface, a holding portion and at least one magnetic component disposed therein. The shape of the circular surface matches that of the disposing hole, the magnetic component is used to make the disposing hole magnetically attachable to combine the base with the disposing hole, and two clip arms of a holding unit grip the holding portion and hold the RFID tag carrier after passing through two through holes of a metal substrate. The RFID tag holder has the following advantages: fast installation, low cost and reusability; is suitable for disposing holes with any depth and size; reduced interference and improved reading effect; no extra processing cost; dust-proof, water-proof and oil-resistant; and better composability, extensibility and flexibility. | 07-12-2012 |
Chang-Yu Lin, Kaohsiung TW
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20100006581 | Vessel - A vessel includes a body, an intermediate cover, and an upper cover; the intermediate cover is positioned above an upper opening of the body, and has a spout, which forms a liquid outlet of the vessel together with a corresponding spout formed on the body; the upper cover is threadedly joined in the upper end of the body to fix the intermediate cover to the body; the spout of the body has a transverse upwards-sticking first stopping portion, and the spout of the intermediate cover has a transverse downwards-sticking second stopping portion; the first and the second stopping portions are a distance from each other, and the uppermost end of the first stopping portion is higher than the lowermost end of the second stopping portion; thus, the stopping portions together make it difficult for poisonous substance to be added the contents of the body through the outlet. | 01-14-2010 |
20100078432 | Vessel structure - A vessel includes a containing body, an upper cover, a thing holding member, and a bottom cover; the containing body has an upper opening; the upper cover is threadedly joined on the containing body to cover the opening; the upper cover has a drink outlet, and a moving cap is pivoted on the upper cover to seal the drink outlet; the upper cover further has several bores so that drinks can flow out of the containing body through the drink outlet easily; the thing holding member is securely joined on the containing body, and has several hollow holding portions on an inner circumferential side to contain drink materials such as tea bags and sugar bags; the bottom cover is joined on a lower end of the thing holding member to close the hollow holding portions. | 04-01-2010 |
20100288782 | Handle of cup - This invention relates to an improved handle of cup in which a receiving cavity is provided at the curved portion of the handle of cup. The receiving cavity is used to accommodate drink sachets containing instant beverage or seasoning sachets, and the receiving cavity can be closed by a lid so as to protect and to keep the drink sachet or seasoning sachet in good condition. In this manner, user can conveniently pick up a drink sachet or a seasoning sachet immediately when user uses the cup to make a cup of drink. | 11-18-2010 |
Che-Hsin Lin, Kaohsiung TW
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20080277579 | MASS ANALYZING APPARATUS - The present invention relates to a mass analyzing apparatus, comprising a first metal electrode plate, a second metal electrode plate, an RF power supply, a reactant gas and a mass spectrometry. The second metal electrode plate is grounded. There is a gap between the first metal electrode plate and the second metal electrode plate. The RF power supply is electrically connected to the first metal electrode plate. Electric discharge is caused between the first metal electrode plate and the second metal electrode plate, so that the reactant gas becomes dissociation plasma. The dissociation plasma reacts with a gas analyte from a sample and then enters the mass spectrometry for a mass analysis. In addition, since the dissociation plasma is generated under low temperature and atmospheric pressure, the mass analyzing apparatus of the present invention is applicable for biological samples that need to be analyzed at a low temperature. | 11-13-2008 |
20090308525 | METHOD OF MANUFACTURING MICROLENS - A method for manufacturing microlens comprises the steps of: coating a photosensitive polymer onto a first substrate to form a polymer film having a first surface in contact with the first substrate and a second surface; heating the polymer film; exposing the second surface of the polymer film to form a mold layer with at least one through hole; pressing and abutting the mold layer onto a second substrate and heating the photosensitive polymer within the mold layer to a temperature higher than a glass transition temperature of the photosensitive polymer for the photosensitive polymer to be melted and flow through the at least one through hole, attach onto the second substrate, and form at least one microlens on a surface of the second substrate; and performing an exposure to the at least one microlens and solidifying the at least one microlens. | 12-17-2009 |
20110157692 | OBJECTIVE-TYPE DARK-FIELD ILLUMINATION DEVICE FOR MICROFLUIDIC CHANNEL - An objective-type dark-field illumination device for a microfluidic channel is provided and includes an optical stop having a pair of symmetric curved slits used to adjust the optical path and inner numerical aperture of a dark-field light source generated by the device. The dark-field illumination can focus on a smaller spot to illuminate a sample in the microfluidic channel by matching a pin-hole combined with a transmitter objective lens. The optical path and smaller spot is advantageous to solve the problem of a traditional dark-field illumination that may generate background light noise scattered from inner walls of the microfluidic channel to lower the image contrast. Therefore, the signal or image resolution of capturing the scattered light and/or emitted fluorescent light emitted from the sample in the microfluidic channel can be enhanced. Meanwhile, the device can simultaneously excite and detect multiple fluorescent samples with different excited wavelengths in the microfluidic channel. | 06-30-2011 |
Cheng San Lin, Kaohsiung TW
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20110080799 | FLUID PROCESSING SYSTEM - A fluid processing system includes a first tube having a conductor disposed in the first tube, and a flow path disposed in the fluid processing system; the conductor is capable of being connected to a power supply unit such that when the power supply unit is turned on, the conductor is magnetized, and the fluid is refined by magnetic lines of force. An auger is disposed on an outer sidewall of the conductor to form a screw. Therefore, when the fluid enters into the fluid processing system, the fluid flows along the auger such that the time the fluid stays in the first tube and the screw is increased, and the fluid is thus processed by the magnetic field lines for a longer period of time | 04-07-2011 |
Cheng-Wen Lin, Kaohsiung TW
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20130137922 | Endoscope - An endoscope includes a tube having including a compartment extending in a longitudinal direction. A flexible strip has a diameter smaller than a diameter of the compartment. The flexible strip is received in the compartment and slideable relative to the tube in the longitudinal direction. The flexible strip is made of a super elastomer having an original shape before deformation. The flexible strip is capable of restoring the original shape after larger deformation. An image capturing module is mounted to the flexible strip. The image capturing module can transmit light beam and capture images. | 05-30-2013 |
Chian-Chi Lin, Kaohsiung TW
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20100052136 | Three-Dimensional Package and Method of Making the Same - A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder. | 03-04-2010 |
Chien-Chih Lin, Kaohsiung TW
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20120235958 | CHIP CARD DISPLAY SYSTEM - A sheet of piezoelectric material is configured in a chip card; alternating current (AC) is generated through bending the piezoelectric material back and forth, the alternating current (AC) is then rectified into direct current (DC) to energize the chip card display system to display stored information. | 09-20-2012 |
Chih-Chenh Lin, Kaohsiung TW
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20110250811 | MULTI-LAYERED MATERIAL AND A METHOD FOR MAKING THE SAME - A multi-layered material and a method for making the same are provided. The multi-layered material includes a first foamed layer, a substrate, a second foamed layer, and a surface layer. The first foamed layer has a plurality of first cells. The substrate is a fabric. The second foamed layer has a plurality of second cells. The foaming method of the second foamed layer is different from that of the first foamed layer. The size of the second cells is different from that of the first cells. The variation in size of the second cells is different from that of the first cells. The surface layer is disposed on the second foamed layer. Thus, when the multi-layered material is used as a surface cover of a ball, it can provide excellent resilience and control, and improve manufacturing efficiency. | 10-13-2011 |
20120021662 | LAMINATED MATERIAL AND METHOD FOR MAKING THE SAME - The present invention relates to a laminated material and a method for making the same. The laminated material includes a main layer, a surface layer and an adhesion layer. The main layer at least includes a first polymer resin. The surface layer is disposed on the main layer, the material of the surface layer is a second polymer resin, and the solid content of the second polymer resin is less than that of the first polymer resin. The adhesion layer is disposed under the main layer, and the material of the adhesion layer is thermoplastic resin which is adhesive when being heated, so that the laminated material can be directly attached to another element, thereby simplifying the process and reducing cost. | 01-26-2012 |
Chi-Hung Lin, Kaohsiung TW
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20090142583 | Composition of anti-glare coating - A composition of an anti-glare coating has a resin, multiple particles and a dispersant. The resin is selected from the group consisting of thermosetting resin and light-curing resin. The particles have a dimension that is from about 30 nanometers (nm) to about 10 micrometers (μm). Because the dispersant stabilizes and keeps a separation distance between each two particles, the particles cannot aggregate in or precipitate out of the anti-glare coating. Thus, the anti-glare coating can be coated easily on the substrate and a surface of the anti-glare film is uniform to provide an improved anti-glare effect. Moreover, the dispersant allows adjustment of haze, gloss and distinctness of image of a substrate coated with the anti-glare coating. | 06-04-2009 |
Chih-Yi Lin, Kaohsiung TW
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20100099343 | POLISHING PAD HAVING ABRASIVE GRAINS AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers. | 04-22-2010 |
20110159235 | COMPOSITE FIBER HAVING ELASTOMER AND METHOD FOR MAKING THE SAME, AND A SUBSTRATE HAVING THE COMPOSITE FIBER AND METHOD FOR MAKING THE SAME - A composite fiber having elastomer and method for making the same, and a substrate having the composite fiber and method for making the same are provided. The composite fiber includes a first composition and a second composition. The first composition is thermoplastic non-elastomer, and the second composition is thermoplastic elastomer (TPE). The second composition is in an amount of 5 to 70 weight % of the composite fiber. The first composition and the second composition are alternately distributed in a circumference of a cross-section of the composite fiber, and the length of the second composition is less than 50% of the total length of the circumference. The TPE can be dispersed uniformly and increase the adhesion between fibers, and the segmented fiber cross-section thereof further prevents the TPE from becoming too adhesive and affecting the processing during the fabrication of fibers and non-woven fabric substrates. Therefore, the non-woven fabric substrate or artificial leather made from the composite fiber has excellent textile feeling and physical properties. | 06-30-2011 |
20110177305 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. The polishing pad includes a fabric substrate and a second high polymeric elastomer resin. The fabric substrate is formed by a plurality of cross composite fibers. Each composite fiber has a plurality of fine fibers and a first high polymeric elastomer resin, and the first high polymeric elastomer resin discontinuously encloses the fine fibers. The second high polymeric elastomer resin encloses the composite fibers, and the first high polymeric elastomer resin and the second high polymeric elastomer resin have the same functional group. By adjusting the degree of saturation of the first high polymeric elastomer resin and the second high polymeric elastomer resin, the fine fibers will have smaller size and will not be easily entangled. Therefore, a workpiece to be polished will not be scratched and will have excellent surface quality. | 07-21-2011 |
Chin-Chun Lin, Kaohsiung TW
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20090212829 | LINE DRIVER ARCHITECTURE FOR 10/100/1000 BASE-T ETHERNET - A multimode line driver circuit is provided having improved performance. The multimode line driver comprises at least first and second driver circuits that, when “active,” respectively transmit data using first and second modes. The multimode line driver further comprises a circuit arrangement including a voltage regulator and an associated set of switches. In operation, at least some of the switches are coupled to the second driver circuit and are turned on when the first driver circuit is active. The voltage regulator supplies a direct current to at least some of the turned-on switches in order to decrease a common mode voltage at the second driver circuit while the first driver circuit transmits data using the first mode. As such, components of the second driver circuit can be powered off while the first driver circuit is active, thus reducing power consumption in the first mode. | 08-27-2009 |
Chi-Pin Lin, Kaohsiung TW
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20100213355 | Full-width Line Image-sensing Head - A full-width line image-sensing head (FLIH) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length L | 08-26-2010 |
20110019044 | Time Delay Integration Based MOS Photoelectric Pixel Sensing Circuit - A time delay integration (TDI) based MOS photoelectric pixel sensing circuit (TDIPSC) is proposed. The TDIPSC includes multi-element photoelectric pixel sensor (MEPS) having sub-pixel sensor elements SPSE | 01-27-2011 |
20110019046 | Wafer-scale Linear Image Sensor Chip and Method with Replicated Gapless Pixel Line and Signal Readout Circuit Segments - A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length L | 01-27-2011 |
Chorng-Tyan Lin, Kaohsiung TW
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20130147942 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES IN DIFFERENT SPACES WITHOUT FIDUCIAL MARK AND ITS SYSTEM - An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space. | 06-13-2013 |
20130148878 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES WITHOUT FIDUCIAL MARK - An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment. | 06-13-2013 |
Chuan-Lang Lin, Kaohsiung TW
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20100009323 | Simulation Software System and Method of Implementing The Same - A simulation software system includes a training module, a display device and a storage device. Events of a training material, operation blocks, response blocks and response images are provided in the storage device. A method of implementing the simulation software includes the steps of: defining a first of the events via the operation block and defining a second of the events via the response block; defining a response image or a series of response images depending upon the defined events, displaying the response image in the response block; judging whether the first and the second of the events have been completely defined; generating a training module from the first and the second of the events; connecting the training module with a human-machine interface and an abnormity/error-processing module. | 01-14-2010 |
20120196264 | SOP Training Simulation Method and System - An SOP training simulation method includes the steps of: executing a predetermined simulation file to display a file page on a screen display unit; utilizing an input unit with a first operation mode to input and directly preset first procedure data of predetermined training simulation; utilizing the input unit with a second operation mode to input second procedure data of response simulation on the file page; comparing the first procedure data with the second procedure data to evaluate the training simulation. The SOP training simulation system includes a control unit to execute the above steps. | 08-02-2012 |
Chu-Fu Lin, Kaohsiung TW
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20080224326 | Chip structure with bumps and testing pads - A chip structure comprising a semiconductor substrate, a plurality of dielectric layers, a plurality of circuit layers, a passivation layer, a metal layer and at least a bump. The semiconductor substrate has a plurality of electronic devices positioned on a surface layer of the semiconductor substrate. The dielectric layers are sequentially stacked on the semiconductor substrate and have a plurality of via holes. The circuit layers are disposed on one of the dielectric layers, wherein the circuit layers are electrically connected with each other through the via holes and are electrically connected to the electronic devices. The passivation layer is disposed over the circuit layers and the dielectric layers, wherein the passivation layer comprises an opening that exposes one of the metal layers. The metal layer is disposed over the passivation layer, wherein the metal layer comprises at least a bump pad and at least a testing pad, the bump pad electrically connecting with the testing pad. The bump is disposed on the bump pad. | 09-18-2008 |
20110049515 | CHIP STRUCTURE WITH BUMPS AND TESTING PADS - A chip structure comprising a silicon substrate, a MOS device, dielectric layers, a metallization structure, a passivation layer, a plurality of metal layers and a polymer layer. The metallization structure comprises a first circuit layer and a second circuit layer over the first circuit layer, and comprises a damascene electroplated copper. The passivation layer is over the metallization structure and dielectric layers, the passivation layer including a first opening exposing a contact point of the metallization structure. The polymer layer is disposed over the passivation layer and the first metal layer, a second opening in the polymer layer being over a second contact point of the first metal layer, the polymer layer covering a top surface and sidewall of the first metal layer. The second contact point is connected to the first contact point through the first opening, the second opening not being vertically over the first opening. | 03-03-2011 |
20140113452 | WAFER EDGE TRIMMING METHOD - A wafer edge trimming method comprises steps as follows: Firstly, an etch-resistant layer is formed on a surface of a wafer. A wet treatment process is then performed to remove a portion of the etch-resistant layer, so as to expose a portion of the surface adjacent to an edge of the wafer. Subsequently, an etching process is performed to remove a portion of the wafer that is not covered by the remained etch-resistant layer. | 04-24-2014 |
Chung-Chi Lin, Kaohsiung TW
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20110111904 | Independently Controllable Transmission Mechanism with an identity-ratio series type - An independently controllable transmission mechanism with an identity-ratio series type includes a first planetary gear train and a second planetary gear train mechanically connected therewith. The transmission mechanism has a power output end, a transmission control end, a power input end and a free transmission end. The power output end and the transmission control end are provided on the first planetary gear train and the second planetary gear train, respectively. The power input end is provided on the first planetary gear train or the second planetary gear train while the free transmission end is provided on the second planetary gear train or the first planetary gear train. The transmission control end is operated to freely shift the free transmission end as a power input end or a power output end. | 05-12-2011 |
Chung-Hsien Lin, Kaohsiung TW
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20100109477 | PRESTRESS-ADJUSTABLE PIEZOELECTRIC GRIPPING DEVICE - A prestress-adjustable piezoelectric gripping device is provided, in which a prestressing device adjusts a prestressing force applied to a piezoelectric element of a piezoelectric unit on the basis of a feedback signal from a force-sensing unit, so as to adjust the friction between the piezoelectric unit and a gripping unit. By utilizing the deformation of the piezoelectric element to drive the gripping unit many times, the gripping velocity and gripping force of the gripping unit can be controlled, and the prestress-adjustable piezoelectric gripping device of the invention can achieve a long driving displacement while maintaining high precision. | 05-06-2010 |
Chung-Shiang Lin, Kaohsiung TW
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20090172179 | Networked Transmission System And Method For Stream Data - Disclosed is a networked transmission system and method for stream data. The system comprises a network, a streaming server and an ordered series of a first up to n-th cooperative-sharing groups. There is a cooperative relationship among all users' terminals in a cooperative-sharing group. The streaming server provides a plurality of programs with stream data, each program being divided into one or more audio/video clips by a time-slot unit. The streaming server transmits the one or more audio/video clips to the leader node of the first cooperative-sharing groups. The leader node of each cooperative-sharing group transmits the currently received audio/video clip to the users' terminals within the same cooperative-sharing group, and passes the received audio/video clip to the leader node of the next cooperative-sharing group after one time slot. | 07-02-2009 |
Der Chyuan Lin, Kaohsiung TW
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20090122019 | Display For Information Handling System - An information handling system includes a chassis. A first display is coupled to the chassis. A card slot is defined by the chassis. A window is defined by the chassis immediately adjacent the card slot, and a card including a second display may be positioned in the card slot such that the second display may be viewed through the window. | 05-14-2009 |
Hsin-Chen Lin, Kaohsiung TW
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20140106817 | Multifunction, portable communication device - A multifunction, portable communication device is provided with a solar cell disposed on a top surface, a USB port disposed on an edge, a PCB electrically connected to the USB port, a keypad disposed on the top surface and electrically connected to the PCB, a rechargeable battery electrically connected to both the solar cell and the PCB, and an IR heating member electrically connected to the PCB, the keypad, and the rechargeable battery respectively, the IR heating member including an electromagnetic radiation member. | 04-17-2014 |
Hsin-Cheng Lin, Kaohsiung TW
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20080273310 | HOLDING DEVICE FOR A HEAT SINK - A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of the fixing posts being surrounded with a spring. The frame member provides a plurality of corners with a support leg vertically extending from the corners respectively and a first flat fixing ear horizontally extending outward from the corners. The first fixing ear has a first elongated hole with a first end part for being pierced by the fixing post and a second end part for fitting with the neck recess. The first elongated hole extends from the first end part to the second end part in a way of allowing the frame member being moved along a direction before the second end part fitting with neck recess. | 11-06-2008 |
Hsin-Nan Lin, Kaohsiung TW
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20100213883 | VARIABLE-DELAY-TIME CONTROL SYSTEM FOR A MOTOR - A variable-delay-time control system for a motor is provided. The system includes a control unit, a driving unit, and a motor. The control unit is used to output at least one control signal according to at least one predetermined signal, and the control signal has a variable delay time. The driving unit is connected to the control unit, and is used to receive the control signal and generate a driving signal. The motor is connected to the driving unit, and conduction time of the motor is controlled according to the driving signal and the variable delay time. With the variable-delay-time control system of the present invention, the delay time of the control signal is variable, so the motor can operate at a high efficiency (for example, at a reduced current). Moreover, as the variable-delay time can be adjusted according to the predetermined signal, the motor can operate at a high efficiency in different operating states, thus improving the overall efficiency of the motor. | 08-26-2010 |
Hui-Nan Lin, Kaohsiung TW
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20090026961 | Low power consumption LED emergency light - The present invention is to provide an emergency light comprising a housing, a matrix shaped LED light module, a charging module, and a power cord having one end extending out of the housing for connecting to an AC source and the other end electrically connected to the charging module and the matrix shaped LED light module respectively. Power of the AC source is either fed to the charging module for charging the charging module via the power cord or fed to the matrix shaped LED light module for illuminating a predetermined area with high-intensity light. Due to the low power consumption characteristic of the matrix shaped LED light module, the emergency light has the ability of consuming a minimum amount of energy in illumination and prolonging the time period of illumination while no electrical current is supplied to the emergency light. | 01-29-2009 |
I-Chen Lin, Kaohsiung TW
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20130008325 | MULTI-LINKAGE PRESS - A multi-linkage press contains a power transmission mechanism includes a rotary shaft driven by a power source; at least two eccentric wheel mechanisms including at least two eccentric wheels, each of the eccentric wheels including a crank sliding set to drive a first sliding block connected with a connecting rod; at least two multi-link mechanisms axially connected on the connecting rod and axially connected with two leveraged linkage assemblies; a sliding assembly including a slidable body with at least four longitudinal plungers, the four longitudinal plungers being axially connected with the two leveraged linkage assemblies to drive a slidable body to operate vertically, and between two of the four longitudinal plungers being connected a first connecting pillar, between another two of the four longitudinal plungers being connected a second connecting pillar, between the first connecting pillar and the second connecting pillar being coupled an axial shank. | 01-10-2013 |
I.l. Lin, Kaohsiung TW
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20110291690 | Apparatus and Method for Testing Non-Contact Pads of a Semiconductor Device to be Tested - The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on to and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip. | 12-01-2011 |
Jan Dong Lin, Kaohsiung TW
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20100319849 | METHOD AND SYSTEM FOR FAST FABRICATING GLUED LAMINATED TIMBER - A method for fast fabricating a glued laminated timber is provided. The method includes the following steps: preparing a plurality of prelaminating pieces, each of the prelaminating pieces having at least two laminating surfaces, arranging the prelaminating pieces to position the laminating surfaces substantially perpendicular with a horizontal plane, and uniformly distributing glue onto the laminating surfaces of the prelaminating pieces; drying the prelaminating pieces having glue distributed thereon to precuring the glue distributed on the laminating surfaces; sequentially stacking the prelaminating pieces one on another to obtain a stack, wherein each of the prelaminating pieces is stacked to another with its laminating surfaces only; conducting a compression treatment to the stack and maintaining the compression treatment for a certain time to obtain a glued laminated timber preform; and conducting a drying treatment to the glued laminated timber preform to obtain the glued laminated timber. | 12-23-2010 |
Jer Hong Lin, Kaohsiung TW
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20120080441 | DRINKING CONTAIER WITH COOLING RESERVOIR - A drinking container includes a main reservoir for containing a quantity of beverage; a cooling reservoir releasably sealingly secured to the main reservoir and including a passage on an inner surface, the passage having one end open to bottom and the other end open to interior of the cooling reservoir, and a spill opening defined by the passage; and a releasable enclosure releasably sealingly secured to the cooling reservoir and including at least one lid; wherein the quantity of beverage in the main reservoir can transfer to the cooling reservoir through the passage by tipping the main reservoir; and wherein each of the at least one lid can be opened by pressing. | 04-05-2012 |
Jyi-Tsong Lin, Kaohsiung TW
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20090101958 | TRENCH SOI-DRAM CELL AND METHOD FOR MAKING THE SAME - The present invention relates to a trench silicon-on-insulator (SOI) dynamic random access memory (DRAM) cell and a method for making the same. A source and a drain are utilized to each connect to one of two semiconductor conductive units on an external side of a main body having a plurality of semiconductor conductive units, and the semiconductor conductive units are utilized to accumulate electric charges generated from the drain so as to decrease a threshold voltage. In addition, the DRAM cell only uses one field effect transistor (FET) device ( | 04-23-2009 |
20100117151 | SEMICONDUCTOR DEVICE WITH PI-SHAPED SEMICONDUCTOR CONDUCTIVE LAYER AND METHOD FOR MAKING THE SAME - The semiconductor device with a π-shaped semiconductor conductive layer manufactured by the manufacturing method thereof utilizes two pathways of the π-shaped semiconductor conductive layer connected to the silicon layer of a silicon-on-insulator (SOI) substrate for heat dissipation, so as to reduce the self-heating effects (SHEs). Furthermore, the semiconductor device of the invention utilizes the self-aligned technique to form a self-aligned structure with a gate unit and the silicon layer, so that the process is simple, the production cost is reduced, the compacted ability and the yield are improved, the off current and short-channel effects (SCEs) are still similar to a conventional UTSOI MOSFET, and the stability and the reliability are therefore superior. | 05-13-2010 |
20130104964 | SOLAR CELL AND SOLAR CELL MODULE AND METHODS FOR MANUFACTURING THE SAMES | 05-02-2013 |
Jyung-Dong Lin, Kaohsiung TW
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20120231152 | METHODS FOR PREPARING A COATING SOLUTION FOR PRODUCING A TRANSPARENT CONDUCTIVE FILM - A method for preparing a coating solution for producing a transparent conductive film includes dissolving a zinc precursor and a metal salt with a solvent to form a first solution containing the zinc precursor and a second solution containing the metal salt. The first solution is mixed with the second solution. At least one stabilizer is added into a mixture of the first and second solutions to form a coating solution precursor. The coating solution precursor is heated and stirred until even dissolution of the zinc precursor and the metal salt. The heated and stirred coating solution precursor is placed steadily in an environment having a temperature lower than a room temperature to undergo crystal growth, obtaining a raw coating solution. The raw coating solution is then filtered to obtain a coating solution. | 09-13-2012 |
Kao-Cheng Lin, Kaohsiung TW
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20090101958 | TRENCH SOI-DRAM CELL AND METHOD FOR MAKING THE SAME - The present invention relates to a trench silicon-on-insulator (SOI) dynamic random access memory (DRAM) cell and a method for making the same. A source and a drain are utilized to each connect to one of two semiconductor conductive units on an external side of a main body having a plurality of semiconductor conductive units, and the semiconductor conductive units are utilized to accumulate electric charges generated from the drain so as to decrease a threshold voltage. In addition, the DRAM cell only uses one field effect transistor (FET) device ( | 04-23-2009 |
Kao-Hsiung Lin, Kaohsiung TW
Patent application number | Description | Published |
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20120077312 | FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL - Disclosed is a flip-chip bonding method to reduce voids in underfill material. A substrate with connecting pads is provided. At least a chip with a plurality of bumps is bonded on the substrate and then an underfill material is formed between the chip and the substrate. Finally, the substrate is placed in a pressure oven in which a positive pressure greater than one atm is provided, meanwhile, the underfill material is thermally cured with exerted pressures to reduce bubbles or voids trapped inside the underfill material to avoid popcorn issues due to CTE mismatch between the chip and the substrate. In one embodiment, another underfill material is further formed between a plurality of chips and bubbles or voids trapped between the chips are also reduced by the pressurized curing. | 03-29-2012 |
Keng Hung Lin, Kaohsiung TW
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20130043572 | Bump-On-Leadframe Semiconductor Package With Low Thermal Resistance - In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump | 02-21-2013 |
20130043573 | Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores - A semiconductor die is solder bump-bonded to a leadframe or circuit board using solder balls having cores made of a material with a melting temperature higher than the melting temperature of the solder to ensure that in the finished structure the die is parallel to the leadframe or circuit board. | 02-21-2013 |
20130043574 | Multi-Die Semiconductor Package With One Or More Embedded Die Pads - To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package. | 02-21-2013 |
20130252377 | Process For Fabricating Multi-Die Semiconductor Package With One Or More Embedded Die Pads - To avoid shorts between adjacent die pads in mounting, a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package. A process for fabricating the package includes a partial etch that defines the bottom surface of the embedded die pad and may include a through-etch that leaves one or more of the contacts or leads integrally connected to the embedded die pad. | 09-26-2013 |
Ken-Huang Lin, Kaohsiung TW
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20130321234 | MIMO ANTENNA DEVICE, ANTENNA AND ANTENNA PACKAGE - A multi-input and multi-output antenna device is disclosed. The MIMO antenna device comprises two antennas symmetrically disposed on a substrate. Each antenna comprises a T-shaped feeding unit, a radiation unit and a ground unit. The T-shaped feeding unit and the radiation unit are disposed on a first surface of the substrate. The T-shaped feeding unit forms a strip portion and a top portion. The radiation unit has first and second ends. The radiation unit extends from the first end to the second end to form a rectangular region and a spacing. The first end extends parallel to the top portion. The ground unit is disposed along two sides of the strip portion and electrically coupled to the second end. The two strip portions of the two T-shaped feeding units are parallel to and aligned with each other. The two ground units are electrically connected to each other. | 12-05-2013 |
Ko-Wei Lin, Kaohsiung TW
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20100176516 | Substrate having optional circuits and structure of flip chip bonding - The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive trace and a second conductive trace. The substrate body has a surface. The substrate pad is disposed on the surface of the substrate body. The first conductive trace is connected to a first circuit, and has a first breaking area so it forms a discontinuous line. The second conductive trace is connected to a second circuit, and has a second breaking area so tit forms a discontinuous line. The second conductive trace and the first conductive trace are connected to the same substrate pad. Thus, the substrate can choose to connect different circuits, so the substrate can be applied to different products by connecting the desired circuit, thus reducing the manufacturing cost. | 07-15-2010 |
Lieh-Chiu Lin, Kaohsiung TW
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20110317483 | Data Programming Circuits and Memory Programming Methods - A data programming circuit for storing a writing data into a memory cell is provided. The data programming circuit includes a control circuit and a current generating circuit. The control circuit generates a control signal according to the writing data. The current generating circuit provides a writing current to the memory cell to change a crystalline state of the memory cell. The writing current has a pulse width corresponding to the writing data, and the crystalline state corresponds to the writing data. | 12-29-2011 |
Mei-Ling Lin, Kaohsiung TW
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20100201477 | CHIP RESISTOR AND METHOD FOR MAKING THE SAME - The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance. | 08-12-2010 |
20110089025 | METHOD FOR MANUFACTURING A CHIP RESISTOR HAVING A LOW RESISTANCE - The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down. | 04-21-2011 |
20110234365 | CHIP RESISTOR HAVING LOW RESISTANCE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a chip resistor having low resistance and a method for manufacturing the same. The chip resistor includes a substrate, a resistive layer, a pair of conducting layers and at least one protective layer. The substrate has a first surface. The resistive layer is disposed on the first surface of the substrate. The conducting layers are disposed adjacent to the first surface of the substrate. The at least one protective layer is disposed on the resistive layer or the conducting layers. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, thereby improving yield rate and efficiency while reducing manufacturing cost. | 09-29-2011 |
Min-Chou Lin, Kaohsiung TW
Patent application number | Description | Published |
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20080312066 | Message energy memory ceramics - The present invention provides a message energy memory ceramics. The message information memory ceramics includes: (1) a plurality of message energy memory ceramics grains composed of a silicon oxide, an aluminum oxide, a sodium oxide, a potassium oxide, a magnesium oxide, a calcium oxide, a titanium oxide, an ferric oxide, a manganese oxide, and a zinc oxide; and (2) a powder of message energy memory ceramics grains composed of a silicon oxide, an aluminum oxide, a sodium oxide, a potassium oxide, a magnesium oxide, a calcium oxide, a titanium oxide, an ferric oxide, a manganese oxide, and a zinc oxide. The products of the present invention can be applied to general water supply stations, water towers, and drinking water machines. | 12-18-2008 |
Min-Chu Lin, Kaohsiung TW
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20080312066 | Message energy memory ceramics - The present invention provides a message energy memory ceramics. The message information memory ceramics includes: (1) a plurality of message energy memory ceramics grains composed of a silicon oxide, an aluminum oxide, a sodium oxide, a potassium oxide, a magnesium oxide, a calcium oxide, a titanium oxide, an ferric oxide, a manganese oxide, and a zinc oxide; and (2) a powder of message energy memory ceramics grains composed of a silicon oxide, an aluminum oxide, a sodium oxide, a potassium oxide, a magnesium oxide, a calcium oxide, a titanium oxide, an ferric oxide, a manganese oxide, and a zinc oxide. The products of the present invention can be applied to general water supply stations, water towers, and drinking water machines. | 12-18-2008 |
Po-Hsieh Lin, Kaohsiung TW
Patent application number | Description | Published |
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20100117151 | SEMICONDUCTOR DEVICE WITH PI-SHAPED SEMICONDUCTOR CONDUCTIVE LAYER AND METHOD FOR MAKING THE SAME - The semiconductor device with a π-shaped semiconductor conductive layer manufactured by the manufacturing method thereof utilizes two pathways of the π-shaped semiconductor conductive layer connected to the silicon layer of a silicon-on-insulator (SOI) substrate for heat dissipation, so as to reduce the self-heating effects (SHEs). Furthermore, the semiconductor device of the invention utilizes the self-aligned technique to form a self-aligned structure with a gate unit and the silicon layer, so that the process is simple, the production cost is reduced, the compacted ability and the yield are improved, the off current and short-channel effects (SCEs) are still similar to a conventional UTSOI MOSFET, and the stability and the reliability are therefore superior. | 05-13-2010 |
Po-Jung Lin, Kaohsiung TW
Patent application number | Description | Published |
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20120281926 | IMAGE FILE PROCESSING METHOD - A processing method for image file includes the following steps. An image file of an image is obtained, in which the image file includes a bit stream and an Exchangeable Image File (EXIF) data. A band indicator and a minimum coded unit (MCU) indicator are read according to an expanded range. A referential DC coefficient is obtained according to a hybrid direct current (DC) coefficient corresponding to a first MCU covered by the expanded range. A sub-clip of the MCU covered by the corresponding expanded range in the bit stream is decoded according to the read band indicator, the MCU indicator and the referential DC coefficient, so as to obtain at least one MCU. | 11-08-2012 |
Po-Wen Lin, Kaohsiung TW
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20100028660 | POLYMERIZABLE COMPOSITION AND ITS USES - The present invention provides a polymerizable composition, which comprises: | 02-04-2010 |
20100086743 | COMPOSITE OPTICAL FILM - The present invention relates to a composite optical film, which comprises a substrate having diffusion micro-structures and a structured surface on one side of the substrate wherein said composite optical film has an internal diffusion haze of no less than 5% as measured according to JIS K7136 standard method. The composite optical film of the present invention has both light-diffusion and light-converging properties. The composite optical film of the present invention, when utilized in a liquid crystal display (LCD), can not only effectively enhance the luminance of the LCD panel but also avoid light dispersion and Moiré phenomena that may occur when said composite optical film is stacked with other material films. | 04-08-2010 |
20110058257 | OPTICAL ELEMENT - The present invention provides an optical element, which comprises: | 03-10-2011 |
20120008212 | COMPOSITE OPTICAL FILM - A composite optical film is provided. The composite optical film sequentially includes a substrate, a light diffusion layer, and a light-gathering layer. The light diffusion layer includes a binder and plural micro beads dispersed therein. The thickness of the light diffusion layer is 2-6 times of the average diameter of the micro beads, and the distance between adjacent micro beads is smaller than the average diameter of the micro beads. The light-gathering layer has plural light-gathering micro structures. | 01-12-2012 |
Shang Wei Lin, Kaohsiung TW
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20090213656 | FLASH MEMORY HAVING INSULATING LINERS BETWEEN SOURCE/DRAIN LINES AND CHANNELS - A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions. | 08-27-2009 |
20100120210 | FLASH MEMORY HAVING INSULATING LINERS BETWEEN SOURCE/DRAIN LINES AND CHANNELS - A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions. | 05-13-2010 |
Shan-Ying Lin, Kaohsiung TW
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20110280815 | COMPOSITION FOR INHIBITING MELANIN PRODUCTION AND APPLICATION THEREOF - The present invention provides a composition for inhibiting melanin production to promote skin whitening, which is characterized by containing compounds represented by formula (I): | 11-17-2011 |
Sheng-Chin Lin, Kaohsiung TW
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20090142583 | Composition of anti-glare coating - A composition of an anti-glare coating has a resin, multiple particles and a dispersant. The resin is selected from the group consisting of thermosetting resin and light-curing resin. The particles have a dimension that is from about 30 nanometers (nm) to about 10 micrometers (μm). Because the dispersant stabilizes and keeps a separation distance between each two particles, the particles cannot aggregate in or precipitate out of the anti-glare coating. Thus, the anti-glare coating can be coated easily on the substrate and a surface of the anti-glare film is uniform to provide an improved anti-glare effect. Moreover, the dispersant allows adjustment of haze, gloss and distinctness of image of a substrate coated with the anti-glare coating. | 06-04-2009 |
Sheng-Huang Lin, Kaohsiung TW
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20080273301 | SECURE DEVICE FOR A HEAT SINK AND CPU - A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle further includes a main operation part and a handle part and the main operation part provides a guide groove with a first end and a second end. The guide groove extends along radial direction of main operation part from the first end to the second end and a uvula is formed between the first end and the second end. The circumferential side of the main operation part defines a press section for touching the contact face and a pivotal shaft is movably joined to the guide groove and the second hook section to actuate the second hook section moving upward or downward to selectively perform engagement or loosening while the pivotal shaft moving along the guide groove between the first and second ends. | 11-06-2008 |
20080273302 | RETAINING DEVICE FOR A HEAT SINK - A retaining device for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is actuated to rotate for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively. The first elastic part and the second elastic part oppositely extend horizontally and free ends of both the elastic parts are joined to two opposite lateral sides of an engaging part for controlling the engaging force evenly and decreasing plastic deformation. | 11-06-2008 |
20080273309 | RETAINING TOOL FOR A HEAT SINK - A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is angularly lifted for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively. The first elastic part extends curvedly a circular bend outward the heat sink and the second elastic part extending curvedly another bend inward the heat sink and free ends of both the elastic parts are joined to two opposite lateral sides of an engaging part for controlling the engaging force evenly and decreasing plastic deformation. | 11-06-2008 |
20080273942 | STRUCTURAL SCREW SECURE DEVICE FOR A RADIATOR ASSEMBLY - A structural screw device for a radiator assembly includes a frame and four screw members. The frame with four corners provides at least a leg post with an axial through hole respectively. The respective screw member is inserted into the leg post and the main body of the screw member is surrounded with an elastic member. The axial through hole of the leg post provides a step at intersection of the first and second hole sections. The free end of the leg post has split paw portions and each of the paw portions has an inner projection such that the neck section is caught with the projection while the screw member is inserted into the through hole in a way of the engaging section extending to the paw portions and the elastic member being biased against the step. Therefore, the projection is capable of being propped up to be away from the neck section and restoring to hold the neck section. | 11-06-2008 |
Sheng-Wei Lin, Kaohsiung TW
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20120168666 | COATING COMPOSITION AND USES THEREOF - A coating composition comprising a photocatalyst composite and a silicone resin is provided, in which the content of the photocatalyst composite ranges from about 1% to about 70% by weight (wt %), based on the total weight of the coating composition, and the photocatalyst composite contains a heat insulation material and a photocatalyst material. An energy-saving material is further provided, which includes a substrate and a film formed from the coating composition of the present invention on at least one of the surfaces of the substrate. The energy-saving material is capable of effectively shielding off infrared (IR) light, substantially decreasing indoor temperature, and reducing power consumption. In addition, in the presence of the photocatalyst which can absorb ultraviolet light, the material also exhibits good superhydrophilic and self-cleaning properties and provides antimicrobial and deodorization effects. | 07-05-2012 |
Shiu-Ru Lin, Kaohsiung TW
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20100130379 | Weighted Chemiluminescent Chip array Method for Multiple Marker Detection - A gene chip for chemiluminescent detection is obtained. The chip uses multiple markers. Weighted scores are given to genes separately according to their influences on forming a cancer. The present invention provides an objective and accurate disease assistant diagnosis with a low cost, a high sensitivity and a good performance. The present invention can be widely applied to personal medical behaviors, like clinical diagnosis, treatment filtration, prognosis review, preventive medicine, etc. | 05-27-2010 |
20110177961 | Method of Diagnosing Active Mycobacterium Tuberculosis with Detecting Chip - The present disclosure diagnoses mycobacterium tuberculosis, not mycobacterium tuberculosis complex only. Specific target genes are selected from regions of difference of mycobacterium tuberculosis. After hybridization with labeling substances, sputum samples are processed through color developments separately for obtaining images to be analyzed automatically. Thus, the present disclosure rapidly diagnoses mycobacterium tuberculosis in the sputum samples with a simple operation and a low cost. | 07-21-2011 |
Tai-Yen Lin, Kaohsiung TW
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20090059553 | LIGHT GUIDING STRUCTURE AND MANUFACTURING OF THE SAME - The present invention discloses a light guiding system, applied to a portable device configured with at least a keying unit; an illuminator producing incident light to illuminate said portable device. The light guiding system comprising: a light guiding structure; at least an incident portion provided on a side of the light guiding structure to receive the incident light from the illuminator; a plurality of light guiding portions to guide the incident light to the at least one keying unit; and a chemical layer provided on the light guiding structure. | 03-05-2009 |
Teng-Hung Lin, Kaohsiung TW
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20130011214 | DRILLING SCRWE WITH COMPOUND THREADS - A drilling screw with compound threads comprises a head at one of the screw; a drilling tip at another thereof; a screwing rod extending from the head to the drilling tip; a middle section of the rod being formed with a flange; at least one tightening thread formed on the rod and between the flange and the head; at least one drilling thread formed on the screwing rod and extended between the flange and the drilling tip; and at least one expanding thread formed on the screwing rod and extended between the flange and the drilling tip. The thread angle of the expanding thread is identical to that of the drilling thread. A height of the expanding thread is smaller than that of the drilling thread and the spiral direction of the expanding thread is opposite to that of the drilling thread. The drilling operation is performed smoothly and firmly. | 01-10-2013 |
Tien-Jen Lin, Kaohsiung TW
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20110265321 | Manufacturing Method of Identifiable Print Circuit Board - A manufacturing method of identifiable print circuit board comprises a step of “disposing identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board. | 11-03-2011 |
Tse-Ming Lin, Kaohsiung TW
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20090098773 | SPACE MINIMIZED FLASH DRIVE - A space-minimized flash drive has a USB connector and a body, where the flash drive comprises a printed circuit board, a plurality of contact fingers, one or more memory devices, and a controller. The printed circuit board has a component section located inside the body and an insertion section extending into and located inside the USB connector. The memory device is disposed on the component section. The contact fingers are disposed on the top surface of the insertion section. The controller is disposed on the bottom surface of the insertion section located inside the USB connector. The footprint occupied by the controller and the corresponding empty footprint are saved to effectively reduce the length of the flash drive to miniaturize flash drives without interfering with the electrical connections of the contact fingers when plugging in the flash drive. | 04-16-2009 |
Tung-Ying Lin, Kaohsiung TW
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20090133622 | PLASMA ASSISTED APPARATUS FOR ORGANIC FILM DEPOSITION - A plasma assisted apparatus for organic film deposition, comprising: a plasma chamber, capable of thermally cracking a precursor in the plasma chamber; and a deposition chamber, being channeled with the plasma chamber for receiving the thermally cracked precursor. In an exemplary embodiment, the deposition chamber further comprises a substrate device, being provided for the thermally cracked precursor to deposit thereon to form an organic film. As the plasma chamber is separated from the deposition chamber in the aforesaid apparatus, a low-temperature film deposition process can be used for forming organic films while preventing the substrate device from being bombarded directly by plasma. In addition, as there is a flow guiding device arranged at the outlet of the plasma chamber, the thermally cracked precursor is guided or disturbed and thus is prevented from overly concentrating at the outlet or the center of the substrate device. Thereby, surface roughness as well as uniformity of the organic film can be effectively improved. | 05-28-2009 |
Tzyy-Pyng Lin, Kaohsiung TW
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20080223554 | FAN - A fan includes a fan blade wheel and a fan frame. A fan wheel seat is disposed at the center of the air outlet of the fan frame and the air outlet faces a heat generating component. An air inlet of the fan frame is disposed opposite to the air outlet. The fan wheel has a hub with first blades and projections extending radially from the circumferential side of the hub. The projections are disposed between every two of the first blades alternately such that it is auxiliary for guiding airflow outward the fan smoothly. Hence, air pressure at the air outlet increases greatly for enhancing effect of heat dissipation effectively. | 09-18-2008 |
Wei-Ru Lin, Kaohsiung TW
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20120232040 | MEDICATION FOR CLINICAL EXTENSIVELY-DRUG RESISTANT ACINETOBACTER BAUMANNII - A medication for | 09-13-2012 |
20140018324 | METHOD FOR IMPROVING TETRACYCLINE-RESISTANCE OF ACINETOBACTER BAUMANNII - A method for improving tetracycline-resistance of | 01-16-2014 |
Wen-Chieh Lin, Kaohsiung TW
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20130027192 | MOTOR CONTROL METHOD - A motor control method comprises: inputting a PWM signal into a control unit for the control unit to obtain a direction command and a speed command by an identification rule, and generating a control signal according to the direction and speed commands by the control unit; and generating a driving signal according to the control signal by the driving unit for driving a motor to operate according to the direction and speed commands. | 01-31-2013 |
Wen-Shen Lin, Kaohsiung TW
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20100000448 | BLOW-MOLDED TABLE - A collapsible table includes a blow-molded tabletop, a pair of opposing collapsible support stands, a pair of tubular frame members and a plurality of fasteners. The table top includes a hollow cavity between the top and bottom surfaces. A lip lies along the tabletop perimeter, encloses the hollow cavity, and extends beyond the bottom of the table. The support stands are pivotally attached to and between the frame members and support the tabletop in an upright position when positioned perpendicularly to the table top. The frame members are attached to the bottom of the table top by the fasteners. The fasteners extend through the frame members and bottom surface, but do not enter the top surface of the table top or the lip. | 01-07-2010 |
Ya-Yan Lin, Kaohsiung TW
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20100168444 | DIINDENOTHIOPHENE DERIVATIVES AND USE THEREOF - A diindenothiophene derivative of the following formula (1) is disclosed: | 07-01-2010 |
Yeh-Min Lin, Kaohsiung TW
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20110117695 | FABRICATION METHOD OF ORGANIC THIN-FILM TRANSISTORS - This invention discloses a fabrication method of organic thin-film transistors (OTFTs) using the micro-contact printing. The OTFT can be of the bottom-gate or top-gate configuration. The micro-contact printing operation of this fabrication method does not require clean-room environment and high processing temperature, and does not have the problem of 2D shrinkage of the printed patterns either. Furthermore, the pre-wetting technique employed in the micro-contact printing results in improved fidelity in the pattern transfer and solves the problems of pairing and cross-talking between neighboring patterns. | 05-19-2011 |
Yi-Fang Lin, Kaohsiung TW
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20090129098 | LIGHT GUIDE PLATE HAVING MULTI-FACET REFLECTION STRUCTURE - The light guide plate has a flat body. At least one of the light emission plane and the light reflection plane of the light guide plate has a number of linear reflection structures arranged in parallel along the surface. The reflection structures have a V-shaped cross section pointing outward from or inward into the surface. Each reflection structure further has at least one of its end surfaces slanting towards the other end. It is the reflection structures' slant end surfaces that provide additional collimation and enhancement to the light beams traveling through the light guide plate. | 05-21-2009 |
Yu-Hsiu Lin, Kaohsiung TW
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20090174260 | UPS System having a Function of Parallel Operation - A UPS system includes one or more UPS units with identical or different capacities. A control circuit, used to control a DC/AC inverter of the UPS unit, includes a voltage feedback control circuit and a current feedforward control circuit. The voltage feedback control circuit is used to control the amplitude and the waveform of load voltage. The current feedforward control circuit is used to operate the DC/AC inverter of the UPS unit as a virtual fundamental resistor and a virtual harmonic resistor which are serially connected to an output terminal of the DC/AC inverter such that each UPS unit can be distributed to provide an output current according to the capacity ratio of the UPS system. | 07-09-2009 |
Yun-Lian Lin, Kaohsiung TW
Patent application number | Description | Published |
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20130136812 | ALCOHOL EXTRACT OF DEHULLED ADLAY SEEDS FOR TREATING GASTRIC ULCER AND/OR STOMACH CANCER - The present invention provides a method for treating gastric ulcer and/or stomach cancer in a subject, which comprises administering to said subject an effective amount of an alcohol extract of dehulled adlay seeds. Preferably, an ethyl acetate sub-fraction of the alcohol extract of dehulled adlay seeds has a better effect in treating gastric ulcer and/or stomach cancer. | 05-30-2013 |
20130158107 | NOVEL FLAVONOIDS AND USES THEREOF - The present invention provides novel flavonoids extracted from an alcohol extract of dehulled adlay seeds. The present invention also provides a process for the preparation of the flavonoid and a method for treating inflammation in a subject, which method comprises administering to said subject an effective amount of the flavonoid and a pharmaceutically acceptable carrier or excipient. | 06-20-2013 |
20130197050 | NOVEL LACTAMS AND USES THEREOF - The present invention provides novel lactams extracted from an alcohol extract of dehulled adlay seeds. The present invention also provides a process for the preparation of the lactams and a method for treating breast cancer in a subject, which method comprises administering to said subject an effective amount of the lactam and a pharmaceutically acceptable carrier or excipient. | 08-01-2013 |
20130197097 | NOVEL SPIROENONE AND USES THEREOF - The present invention provides novel spiroenones extracted from an alcohol extract of dehulled adlay seeds. The present invention also provides a process for the preparation of the spiroenones and a method for treating breast cancer in a subject, which method comprises administering to said subject an effective amount of the spiroenone and a pharmaceutically acceptable carrier or excipient. | 08-01-2013 |
Yu-Shih Lin, Kaohsiung TW
Patent application number | Description | Published |
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20120068142 | RESISTANCE RANDOM ACCESS MEMORY ELEMENT AND METHOD FOR MAKING THE SAME - A resistance random access memory element includes a first electrode, an insulating layer, a diffusing metal layer, and a second electrode superimposed in sequence. The insulating layer includes a plurality of pointed electrodes. A method for making a resistance random access memory element includes growing and forming an insulating layer on a surface of a first electrode. A diffusing metal layer is formed on a surface of the insulating layer. A second electrode is mounted on a surface of the diffusing metal layer. A negative pole and a positive pole of a driving voltage are connected with the first and second electrodes, respectively. The diffusing metal in the diffusing metal layer is oxidized into metal ions by the driving voltage. The metal ions are driven into the insulating layer and form a plurality of pointed electrodes after reduction. | 03-22-2012 |