Patent application number | Description | Published |
20090058588 | WIRE WOUND ELECTRONIC PART - A wire wound electronic part includes a core having a wire wound core and flanges formed on both ends thereof, a coil conductor wound around the wire wound core and terminal electrodes disposed at the bottom of the flange, in which both ends of the coil conductor are conductively connected to the terminal electrodes by a solder, wherein a pair of grooves are formed at the bottom crossing the wire wound core of one of the flanges. The groove has a bottom and side walls disposed being slanted on both sides thereof, in which the vertical height for the side wall is formed larger than the length for the bottom of the side wall. The terminal electrodes are contained in the groove, and edge portion in the lateral direction of the terminal electrode is restricted by the side wall of the groove. The edge portion in the lateral direction of the terminal electrode is restricted by the side wall of the groove, which makes the lateral size stable and suppresses the movement of the molten solder in the lateral direction of the groove, thereby preventing unstable height and attitude of the wire wound electronic part upon mounting to a circuit substrate. | 03-05-2009 |
20090058591 | WIRE WOUND ELECTRONIC PART - A wire wound electronic part includes a ferrite core comprising ferrite having a columnar wire wound core and flanges formed at both ends thereof, a coil conductor wound around the wire wound core of the ferrite core, and at least a pair of terminal electrodes having a Cu conduction layer disposed to the outer surface of the flange, in which both ends of the coil conductor wound around the wire wound core are conductively connected to the terminal electrodes. The terminal electrode is formed by coating an electrode paste containing a Cu powder and a glass frit to the outer surface of the ferrite core, and then applying a heat treatment to the ferrite core. There is a reaction layer of a portion of the ferrite core and the glass frit at a boundary between the ferrite core and the Cu conduction layer. The terminal electrodes has the peel strength identical with that of an existent Ag terminal electrode, without forming a plate layer. | 03-05-2009 |
Patent application number | Description | Published |
20090048178 | LPS OR LIPID A BINDING AGENT AND NOVEL PEPTIDE - A lipopolysaccharide (LPS) and/or lipid A binding agent is provided. The LPS and/or lipid A binding agent contains an LPS and/or lipid A binding peptide, such as a peptide comprising an amino acid sequence of XYSSS (X=K, R, or H), or a derivative thereof, as an active ingredient. The LPS and/or lipid A binding agent is useful as, for example, an LPS and/or lipid A neutralizing agent or an LPS and/or lipid A removing agent. | 02-19-2009 |
20110098214 | LPS OR LIPID A BINDING AGENT AND NOVEL PEPTIDE - A lipopolysaccharide (LPS) and/or lipid A binding agent is provided. The LPS and/or lipid A binding agent contains an LPS and/or lipid A binding peptide, such as a peptide comprising an amino acid sequence of XYSSS (X=K, R, or H), or a derivative thereof, as an active ingredient. The LPS and/or lipid A binding agent is useful as, for example, an LPS and/or lipid A neutralizing agent or an LPS and/or lipid A removing agent. | 04-28-2011 |
Patent application number | Description | Published |
20110042689 | Semiconductor light-emitting element array device, image exposing device, image forming apparatus, and image display apparatus - A semiconductor light-emitting element array device includes a substrate; a plurality of removable layers being disposed on the substrate; and a thin-film semiconductor light-emitting device being disposed on each of the plurality of removable layers, being made of a different material from a surface material of the substrate, and having a semiconductor light-emitting element; wherein the plurality of removable layers are made of a material which is capable of being etched by a selective chemical etching process. An image exposing device includes an image exposing unit including the semiconductor light-emitting element array device. An image exposing device includes an image exposing unit including the semiconductor light-emitting element array device. An image display apparatus includes an image display unit including the semiconductor light-emitting element array device. | 02-24-2011 |
20110186876 | Semiconductor light emitting device and image forming apparatus - A semiconductor light emitting device includes laminated semiconductor light emitting elements. A first semiconductor light emitting element is provided on a mounting substrate via a reflection metal layer, and is configured to emit light of first wavelength. A first light-transmissive planarization insulating film is provided covering the first semiconductor light emitting element, and is configured to transmit the light of the first wavelength. A second semiconductor light emitting element is provided on the first semiconductor light emitting element via the first light-transmissive planarization insulating film. The second semiconductor light emitting element is configured to transmit the light of the first wavelength and to emit light of second wavelength. The second semiconductor light emitting element includes a first semiconductor multilayer reflection film facing the first semiconductor light emitting element, which is configured to transmit the light of the first wavelength and to reflect the light of the second wavelength. | 08-04-2011 |
20120248464 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND HEAD MOUNT DISPLAY DEVICE - A semiconductor light emitting device includes a thin-film semiconductor light emitting element, a substrate, a first insulation layer having a surface to which the thin-film semiconductor light emitting element is bonded, a first metal layer composed of aluminum and disposed on a side of the first insulation layer facing the substrate, and a second insulation layer disposed between the first insulation layer and the first metal layer. | 10-04-2012 |
20130194550 | DISPLAY MODULE, DISPLAY APPARATUS, AND MANUFACTURING METHODS THEREOF - A display module includes a substrate, a plurality of light emitting elements provided on the substrate, a bank provided on the substrate at a position separated by a predetermined distance from an outer circumferential edge of a display region on which the plurality of light emitting elements are arranged, the bank being configured to enclose at least a part of the outer circumferential edge of the display region, and an outer circumference protection part provided on the bank and on an outer circumferential region of the bank, the outer circumference protection part being formed of a resin material. | 08-01-2013 |
20130208026 | SEMICONDUCTOR LIGHT EMITTING APPARATUS, IMAGE DISPLAYING APPARATUS, MOBILE TERMINAL, HEAD-UP DISPLAY APPARATUS, IMAGE PROJECTOR, HEAD-MOUNTED DISPLAY APPARATUS, AND IMAGE FORMING APPARATUS - A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements. | 08-15-2013 |