Patent application number | Description | Published |
20080263350 | UPDATE IN-USE FLASH MEMORY WITHOUT EXTERNAL INTERFACES - A method, apparatus and program storage device for updating a non-volatile memory in an embedded system is provided. The invention includes detaching the non-volatile memory from all expectable non-volatile memory references, creating a temporary, volatile-memory file system for allocation of volatile memory space as needed for the non-volatile memory update process, copying all procedural code required to perform the non-volatile memory update into the volatile memory, changing the system search path definitions temporarily to point to the volatile memory, and performing the non-volatile memory update. | 10-23-2008 |
20090205197 | Method of providing flexible heat sink installations for early blade board manufacturing - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 08-20-2009 |
20090268410 | FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING - An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while live circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks. | 10-29-2009 |
20130111071 | Self-healing and reconfiguration in an integrated circuit | 05-02-2013 |
Patent application number | Description | Published |
20090021275 | METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD - A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position. | 01-22-2009 |
20090049944 | MICROMANIPULATOR FOR MOVING A PROBE - A micromanipulator for moving a probe comprises two elements which are mechanically connected to one another in such a way that one element can be moved relative to other element. The movement of the element occurs as a result of the pressure change of a fluid which acts upon an actuator which is in mechanical contact to a mobile element or to an element moving on a surface segment. | 02-26-2009 |
20090058442 | PROBER FOR TESTING COMPONENTS - A prober for testing components comprises a lower frame, over which a probe holder plate is disposed at a distance therefrom for receiving test probes that make contact with the components to be tested and to which a displacement device is connected. A substrate carrier is disposed in the space between the frame and the probe holder plate, and the probe holder plate is provided with an opening, below which the substrate carrier can be displaced. To expand the scope of application of probers used for testing components, all those components of the prober that surround the substrate are made from a non-magnetic material. | 03-05-2009 |
20090085595 | METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD - A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position. | 04-02-2009 |
20100294053 | PROBE HOLDER - A probe holder has a manipulator, a probe arm arranged on the manipulator, and a probe needle that is at least indirectly connected to the probe arm. To increase the number of contacts of a substrate to be tested and to make it possible to test a plurality of contacts in etched trenches of semiconductor elements in a group of wafers, the probe arm is connected to a needle support on which the probe needle and at least one second probe needle are arranged. | 11-25-2010 |