Patent application number | Description | Published |
20080211872 | DROPLET EJECTION APPARATUS ALIGNMENT - In one aspect, the invention features assemblies for depositing droplets on a substrate during relative motion of the assembly and the substrate along a process direction. The assemblies include a first printhead module and a second printhead module contacting the first printhead module, each of the printhead modules including a surface that includes an array of nozzles through which the printhead modules can eject fluid droplets, wherein each nozzle in the first printhead module's nozzle array is offset with respect to a corresponding nozzle in the second printhead module's nozzle array in a direction orthogonal to the process direction. | 09-04-2008 |
20090066758 | FLEXIBLE PRINTHEAD CIRCUIT - A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit. | 03-12-2009 |
20090201341 | Adjustable Mount Printhead Assembly - A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions. | 08-13-2009 |
20090303269 | DROP EJECTION ASSEMBLY - A fluid drop delivery device is disclosed. The device includes a plurality of nozzle openings from which fluid is ejected and a waste control aperture. | 12-10-2009 |
20090322187 | Piezoelectric Actuators - Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes. | 12-31-2009 |
20100039479 | PRINTHEAD - Ink jet printheads and printhead components are described. | 02-18-2010 |
20100091060 | Adjustable Mount Printhead Assembly - A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions. | 04-15-2010 |
20110006135 | FLUID EJECTOR HOUSING INSERT - A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C. | 01-13-2011 |
20110080449 | Non-wetting Coating on Die Mount - Printing devices are described that have a printing die with a coplanar adjacent layer. The coplanar adjacent layer is sufficiently non-wetting to fluids that the layer can be easily wiped clean of fluid that is inadvertently deposited thereon. A non-stick surface is optionally applied to the adjacent layer which can withstand both mechanical and chemical abrasion that can be caused by corrosive ejection fluids or wiping mechanisms. | 04-07-2011 |
20110092049 | METHOD AND APPARATUS FOR SUBSTRATE BONDING - Methods for bonding a first substrate to a second substrate are described. A surface of the first substrate is coated with an adhesive layer. The adhesive layer is cured to b-stage. The surface of the first substrate is positioned in contact with the second substrate. An edge of the first substrate is pressed to an edge of the second substrate to initiate Van der Waals bonding. The first and second substrates are allowed to come together by Van der Waals bonding. The bonded first and second substrates are subjected to a sufficient heat for a sufficient time period to cure completely the adhesive layer. | 04-21-2011 |
20110115852 | ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT - A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator. | 05-19-2011 |
20110122587 | FLEXIBLE CIRCUIT STRETCHING - A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate. | 05-26-2011 |
20110128324 | METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE - A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame. | 06-02-2011 |
20110212261 | NON-WETTING COATING ON A FLUID EJECTOR - A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector. | 09-01-2011 |
20110226807 | Bonded Circuits and Seals in a Printing Device - A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material. | 09-22-2011 |
20110234668 | Jetting Device with Reduced Crosstalk - A printing device for jetting a liquid includes a flow path body having a plurality of jetting flow paths, a liquid in the plurality of jetting flow paths, a piezoelectric actuator associated with each jetting flow path, a feed substrate having a plurality of fluid inlets, and a driver configured to apply a voltage pulse to the piezoelectric actuator. The first jetting flow path is adjacent to the second jetting flow path and a fluidic travel distance from the piezoelectric actuator of the first jetting flow path to a nozzle of the second jetting flow path is greater than a speed of sound in the liquid times the break off time of a droplet of the fluid from the nozzle. | 09-29-2011 |
20110250403 | BONDING ON SILICON SUBSTRATE - A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a lower membrane surface and an upper membrane surface, a transducer having a transducer surface substantially parallel to the upper membrane surface, and an adhesive connecting the membrane to the transducer surface. In some implementations, the lower membrane surface is substantially contiguous and the upper membrane surface protrudes therefrom. In some other implementations, the upper membrane surface is substantially contiguous and the lower membrane surface is recessed therein. | 10-13-2011 |
20130126081 | METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 05-23-2013 |
20130126098 | MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE - A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. | 05-23-2013 |
20130126589 | METHOD OF TRANSFERRING A LIGHT EMITTING DIODE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126827 | LIGHT EMITTING DIODE STRUCTURE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126891 | MICRO LIGHT EMITTING DIODE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130127020 | MICRO DEVICE TRANSFER HEAD - A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate. | 05-23-2013 |
20130128585 | MICRO DEVICE ARRAY - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130130416 | METHOD OF FABRICATING A MICRO DEVICE TRANSFER HEAD - A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate. | 05-23-2013 |
20130130440 | METHOD OF FABRICATING AND TRANSFERRING A MICRO DEVICE AND AN ARRAY OF MICRO DEVICES UTILIZING AN INTERMEDIATE ELECTRICALLY CONDUCTIVE BONDING LAYER - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 05-23-2013 |
20130210194 | METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES - Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate. | 08-15-2013 |
20130286097 | Forming A Funnel-Shaped Nozzle - Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion. | 10-31-2013 |
20130292529 | Fluid Ejection Module Mounting - A bracket includes a support strut configured to carry the fluid ejection module and an alignment strut coupled to the support strut. The alignment strut is configured to affix to the frame so as to orient the support strut with respect to the frame in each of three orthogonal linear directions and three orthogonal angular directions. The alignment strut includes three alignment mechanisms. Each of the first and second alignment features is held mechanically fixed on the alignment strut in a respective aligned position, and the third alignment mechanism is movable on the alignment strut. | 11-07-2013 |
20130293642 | Systems And Methods For Delivering And Recirculating Fluids - Among other things, a device for use in printing is described. The device comprises a first chamber for receiving a liquid and a first filter member in the first chamber. The first filter member separates the first chamber into a first part and a second part laterally adjacent to the first part. The first filter member comprises pores having an average size. The pores are configured to filter the liquid passing from the first part to the second part. The first filter member further comprises an opening adjacent to a top of the first chamber for air to pass from the first part to the second part. The opening has a size at least 10 times larger than the average size of the pores. There is a first inlet in fluid communication with the first part and a first outlet in fluid communication with the second part. | 11-07-2013 |
20130300812 | COMPLIANT MICRO DEVICE TRANSFER HEAD - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion. | 11-14-2013 |
20140022304 | Forming A Funnel-Shaped Nozzle - Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion. | 01-23-2014 |
20140027709 | METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE - A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material. | 01-30-2014 |
20140055528 | ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT - A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator. | 02-27-2014 |
20140061687 | LED ARRAY - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 03-06-2014 |
20140071580 | MASS TRANSFER TOOL - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads. | 03-13-2014 |
20140084240 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-27-2014 |
20140084482 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-27-2014 |
20140169924 | MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140169927 | MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140241843 | Mass Transfer Tool Manipulator Assembly - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140241844 | Micro Pick Up Array Mount With Integrated Displacement Sensor - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140290867 | MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE - A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. | 10-02-2014 |
20140299837 | MICRO LED DISPLAY - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 10-09-2014 |
20140363928 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 12-11-2014 |