Patent application number | Description | Published |
20080211872 | DROPLET EJECTION APPARATUS ALIGNMENT - In one aspect, the invention features assemblies for depositing droplets on a substrate during relative motion of the assembly and the substrate along a process direction. The assemblies include a first printhead module and a second printhead module contacting the first printhead module, each of the printhead modules including a surface that includes an array of nozzles through which the printhead modules can eject fluid droplets, wherein each nozzle in the first printhead module's nozzle array is offset with respect to a corresponding nozzle in the second printhead module's nozzle array in a direction orthogonal to the process direction. | 09-04-2008 |
20080246792 | METHOD AND APPARATUS FOR SCALABLE DROPLET EJECTION MANUFACTURING - A method includes ejecting liquid having a first composition from a first droplet ejection deposition system that includes a first printhead and a first fluid source, collecting information on the behavior of the liquid under a variety of ejection conditions for the first droplet ejection deposition system, and ejecting liquid having the first material composition from a second droplet ejection deposition system that includes a second printhead and a second fluid source under the selected ejection conditions. The first printhead has a small number of flow paths, and the first fluid source is configured to hold a small volume of liquid. The second printhead has a plurality of substantially identical flow paths, each of the flow paths being substantially identical to at least one of the small number of flow paths, and there being a significantly larger number of flow paths in the second printhead than in the first printhead. | 10-09-2008 |
20090066758 | FLEXIBLE PRINTHEAD CIRCUIT - A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit. | 03-12-2009 |
20090122118 | Printhead Module - A printhead module includes a printhead body, a nozzle plate and one or more piezoelectric actuators. The printhead body includes one or more pumping chambers, where each pumping chamber includes a receiving end to receive a printing liquid from a printing liquid supply and an ejecting end for ejecting the printing liquid from the pumping chamber. The nozzle plate includes one or more nozzles formed through the nozzle plate. Each nozzle can be in fluid communication with a pumping chamber and receive printing liquid from the ejecting end for ejection from the nozzle. The one or more piezoelectric actuators are connected to the nozzle plate. A piezoelectric actuator is positioned over each pumping chamber and includes a piezoelectric material configured to deflect and pressurize the pumping chamber, so as to eject printing liquid from a corresponding nozzle in fluid communication with the ejecting end of the pumping chamber. | 05-14-2009 |
20090201341 | Adjustable Mount Printhead Assembly - A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions. | 08-13-2009 |
20090230088 | FORMING A PRINT HEAD WITH A THIN MEMBRANE - A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane. | 09-17-2009 |
20090303269 | DROP EJECTION ASSEMBLY - A fluid drop delivery device is disclosed. The device includes a plurality of nozzle openings from which fluid is ejected and a waste control aperture. | 12-10-2009 |
20090322187 | Piezoelectric Actuators - Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes. | 12-31-2009 |
20100039479 | PRINTHEAD - Ink jet printheads and printhead components are described. | 02-18-2010 |
20100079523 | Control of Velocity Through a Nozzle - A method is described wherein one or more parameters are measured that affect the nozzle velocity at which a printing fluid is ejected from a pumping chamber through a nozzle. The printing fluid is contained in the pumping chamber actuated by deflection of a piezoelectric layer. A surface area of an electrode actuating the piezoelectric layer is reduced based at least in part on the measured one or more parameters. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer. | 04-01-2010 |
20100091060 | Adjustable Mount Printhead Assembly - A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions. | 04-15-2010 |
20100110144 | Applying a Layer to a Nozzle Outlet - A nozzle layer is described that has a semiconductor body having a first surface, a second surface opposing the first surface, and a nozzle formed through the body connecting the first and second surfaces, wherein the nozzle being configured to eject fluid through a nozzle outlet on the second surface, and a metal layer around the outlet on the second surface and at least partially inside the nozzle, the metal layer inside the nozzle being completely exposed. | 05-06-2010 |
20100134568 | MEMS Device with Uniform Membrane - A MEMS based device is described with recesses covered by a membrane. The membranes over the recesses are highly uniform due to being formed by a stack of layers that are epitaxial layers with high uniformity. The unnecessary layers of the stack, such as the handle layer, are removed prior to completion of the device to achieve a membrane with a desired thickness. | 06-03-2010 |
20100141713 | Short Circuit Protection for Inkjet Printhead - Systems and apparatus for ejecting fluid. A fluid injection apparatus includes a fluid ejector unit for ejecting a droplet of fluid, an integrated circuit, and a conductive trace electrically coupling the fluid ejector unit and the integrated circuit. A portion of the conductive trace includes a fuse. | 06-10-2010 |
20100214359 | Fluid Ejecting with Centrally Formed Inlets and Outlets - An apparatus for ejecting droplets of a fluid includes a substrate, a first plurality of nozzles formed in a first region of a nozzle face of the substrate, and a second plurality of nozzles formed in a second region of the nozzle face. The second region is separated from the first region. An inlet and an outlet are both formed in an upper face of the substrate opposite a third region of the nozzle face, the third region being located between the first region and the second region, and a plurality of fluid paths formed in the substrate and fluidically connecting the first plurality of nozzles and the second plurality of nozzles with the inlet and outlet. | 08-26-2010 |
20100220146 | Moisture Protection of Fluid Ejector - A fluid ejection apparatus includes a substrate having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the fluid passages, a plurality of actuators positioned on top of the substrate to cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles, a protective layer formed over at least a portion of the plurality of actuators, a housing component having a chamber, the chamber adjacent to the substrate, and an absorbent layer inside the cavity. The absorbent layer is more absorptive than the protective layer. | 09-02-2010 |
20100253721 | DEPOSITING DROPS ON A SUBSTRATE CARRIED BY A STAGE - A device for depositing drops includes a head configured to eject drops on a region of a substrate; a stage configured to hold the substrate while the head ejects drops on the region of the substrate; a first transporting device configured to transport the substrate in a transporting direction onto the stage; and a second transporting device configured to transport the substrate in the transporting direction off the stage. The stage and at least one of the first transporting device or the second transporting device are movable together in the transporting direction. | 10-07-2010 |
20110006135 | FLUID EJECTOR HOUSING INSERT - A fluid ejector includes a fluid ejection assembly, a housing, and an insert. The fluid ejection assembly includes one or more silicon bodies and a plurality of actuators. The one or more silicon bodies includes a silicon body having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the plurality of fluid passages. The plurality of actuators cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles. The housing assembly includes one or more plastic bodies, at least one plastic body attached to at least one silicon body to form a sealed volume on a side of the fluid ejection assembly opposite the nozzles. The insert is embedded in the at least one plastic body in proximity to the at least one silicon body, the insert having a coefficient of thermal expansion of less than 9 ppm/° C. | 01-13-2011 |
20110007117 | MEMS Jetting Structure For Dense Packing - A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element. | 01-13-2011 |
20110080449 | Non-wetting Coating on Die Mount - Printing devices are described that have a printing die with a coplanar adjacent layer. The coplanar adjacent layer is sufficiently non-wetting to fluids that the layer can be easily wiped clean of fluid that is inadvertently deposited thereon. A non-stick surface is optionally applied to the adjacent layer which can withstand both mechanical and chemical abrasion that can be caused by corrosive ejection fluids or wiping mechanisms. | 04-07-2011 |
20110092049 | METHOD AND APPARATUS FOR SUBSTRATE BONDING - Methods for bonding a first substrate to a second substrate are described. A surface of the first substrate is coated with an adhesive layer. The adhesive layer is cured to b-stage. The surface of the first substrate is positioned in contact with the second substrate. An edge of the first substrate is pressed to an edge of the second substrate to initiate Van der Waals bonding. The first and second substrates are allowed to come together by Van der Waals bonding. The bonded first and second substrates are subjected to a sufficient heat for a sufficient time period to cure completely the adhesive layer. | 04-21-2011 |
20110115341 | Insulated Film Use in a Mems Device - A method of forming an actuator and an actuable device formed by this method are disclosed. This method includes depositing a photoimageable material to form a first photoimageable layer on a piezoelectric layer; patterning the first photoimageable layer to form an aperture; and disposing a first conductive layer on the first photoimageable layer. The first conductive layer partially overlies the first photoimageable layer such that a first portion of the first conductive layer contacts the first photoimageable layer and a second portion of the first conductive layer electrically contacts the piezoelectric layer in the aperture. | 05-19-2011 |
20110115852 | ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT - A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator. | 05-19-2011 |
20110122587 | FLEXIBLE CIRCUIT STRETCHING - A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate. | 05-26-2011 |
20110128324 | METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE - A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame. | 06-02-2011 |
20110128335 | CIRCULATING FLUID FOR FLUID DROPLET EJECTING - A fluid droplet ejection apparatus includes a printhead having a fluid supply and a fluid return. A substrate is attached to the printhead, and the substrate includes a fluid inlet and a fluid outlet on a surface of the substrate proximate to the fluid supply and fluid return. Nozzles are in fluid communication with the fluid inlet. The fluid inlet of the substrate is in fluid communication with the fluid supply, and the fluid outlet is in fluid communication with the fluid return. A first circulation path through the substrate is between the fluid inlet and the fluid outlet. The fluid supply is in fluid communication with the fluid return through a second circulation path that is through the printhead and not through the substrate. | 06-02-2011 |
20110139901 | Moisture Protection Of Fluid Ejector - A fluid ejection apparatus includes a substrate having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the fluid passages, a plurality of actuators positioned on top of the substrate to cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles, and a protective layer formed over at least a portion of the plurality of actuators, the protective layer having an intrinsic permeability to moisture less than 2.5×10 | 06-16-2011 |
20110147483 | Compartmentalization of Fluid Ejector Device - A fluid ejection apparatus includes a substrate having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the fluid passages, a plurality of actuators positioned on top of the substrate to cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles, a housing component with a descending portion that projects down to the substrate, an integrated circuit chip supported on the substrate, a potting barrier secured to the housing component and positioned between the integrated circuit chip and the actuators, and a potting material between the integrated circuit chip and the barrier. | 06-23-2011 |
20110212261 | NON-WETTING COATING ON A FLUID EJECTOR - A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector. | 09-01-2011 |
20110226807 | Bonded Circuits and Seals in a Printing Device - A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material. | 09-22-2011 |
20110234668 | Jetting Device with Reduced Crosstalk - A printing device for jetting a liquid includes a flow path body having a plurality of jetting flow paths, a liquid in the plurality of jetting flow paths, a piezoelectric actuator associated with each jetting flow path, a feed substrate having a plurality of fluid inlets, and a driver configured to apply a voltage pulse to the piezoelectric actuator. The first jetting flow path is adjacent to the second jetting flow path and a fluidic travel distance from the piezoelectric actuator of the first jetting flow path to a nozzle of the second jetting flow path is greater than a speed of sound in the liquid times the break off time of a droplet of the fluid from the nozzle. | 09-29-2011 |
20110242168 | Method for Nozzle Velocity Control - A voltage is applied to an electrode positioned in contact with a piezoelectric layer, the electrode having a surface area. A deflection of the piezoelectric layer is measured in response to the applied voltage. The surface area of the electrode is reduced based at least in part on the measured deflection. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer. | 10-06-2011 |
20110242219 | Durable Non-Wetting Coating on Fluid Ejector - A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle. | 10-06-2011 |
20110250403 | BONDING ON SILICON SUBSTRATE - A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a lower membrane surface and an upper membrane surface, a transducer having a transducer surface substantially parallel to the upper membrane surface, and an adhesive connecting the membrane to the transducer surface. In some implementations, the lower membrane surface is substantially contiguous and the upper membrane surface protrudes therefrom. In some other implementations, the upper membrane surface is substantially contiguous and the lower membrane surface is recessed therein. | 10-13-2011 |
20120167823 | ELECTRODE CONFIGURATIONS FOR PIEZOELECTRIC ACTUATORS - Fluid ejection apparatuses and processes for making the same are disclosed. An apparatus for ejecting fluid droplets includes a substrate having a plurality of flow paths formed therein, each flow path including a respective pumping chamber and a respective nozzle, and the respective nozzle being configured to eject fluid droplets through a first surface of the substrate in response to actuation of the respective pumping chamber; and an actuation assembly including a drive electrode layer over a second surface of the substrate opposite to the first surface, a piezoelectric layer over the drive electrode layer, and a reference electrode layer over the piezoelectric layer, the drive electrode layer being patterned to define an individually controllable drive electrode over each of two or more pumping chambers in the substrate, and the reference electrode layer including a continuous reference electrode spanning the two or more pumping chambers in the substrate. | 07-05-2012 |
20120200619 | Fluid Circulation - Among other things, an apparatus for use in fluid jetting is described. The apparatus comprises a printhead including a flow path and a nozzle in communication with the flow path that has a first end and a second end. The apparatus also includes a first container fluidically coupled to the first end of the flow path, a second container fluidically coupled to the second end of the flow path, and a controller. The first container has a first controllable internal pressure and the second container has a second controllable internal pressure. The controller controls the first internal pressure and the second internal pressure to have a fluid flow between the first container and the second container through the flow path in the printhead according to a first mode and a second mode. In either mode, at least a portion of the fluid flowing along the flow path is delivered to the nozzle when the nozzle is jetting. The first mode has the first internal pressure higher than the second internal pressure and the second mode has the second internal pressure higher than the first internal pressure. The fluid flows from the first container to the second container according to the first mode and flows from the second container to the first container according to the second mode. | 08-09-2012 |
20120206014 | PIEZOELECTRIC TRANSDUCERS USING MICRO-DOME ARRAYS - An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements. | 08-16-2012 |
20120235539 | PIEZOELECTRIC TRANSDUCERS USING MICRO-DOME ARRAYS - An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements. | 09-20-2012 |
20130126081 | METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 05-23-2013 |
20130126098 | MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE - A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. | 05-23-2013 |
20130126589 | METHOD OF TRANSFERRING A LIGHT EMITTING DIODE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126827 | LIGHT EMITTING DIODE STRUCTURE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130126891 | MICRO LIGHT EMITTING DIODE - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130127020 | MICRO DEVICE TRANSFER HEAD - A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate. | 05-23-2013 |
20130128585 | MICRO DEVICE ARRAY - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 05-23-2013 |
20130130416 | METHOD OF FABRICATING A MICRO DEVICE TRANSFER HEAD - A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate. | 05-23-2013 |
20130130440 | METHOD OF FABRICATING AND TRANSFERRING A MICRO DEVICE AND AN ARRAY OF MICRO DEVICES UTILIZING AN INTERMEDIATE ELECTRICALLY CONDUCTIVE BONDING LAYER - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 05-23-2013 |
20130210175 | Forming a Device Having a Curved Piezoelectric Membrane - Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane. | 08-15-2013 |
20130210194 | METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES - Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate. | 08-15-2013 |
20130248618 | Moisture Protection Of Fluid Ejector - A fluid ejection apparatus includes a substrate having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the fluid passages, a plurality of actuators positioned on top of the substrate to cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles, and a protective layer formed over at least a portion of the plurality of actuators, the protective layer having an intrinsic permeability to moisture less than 2.5×10 | 09-26-2013 |
20130278688 | FLUID CIRCULATION - Among other things, an apparatus for use in fluid jetting is described. The apparatus comprises a printhead including a flow path and a nozzle in communication with the flow path that has a first end and a second end. The apparatus also includes a first container fluidically coupled to the first end of the flow path, a second container fluidically coupled to the second end of the flow path, and a controller. The first container has a first controllable internal pressure and the second container has a second controllable internal pressure. The controller controls the first internal pressure and the second internal pressure to have a fluid flow between the first container and the second container through the flow path in the printhead according to a first mode and a second mode. In either mode, at least a portion of the fluid flowing along the flow path is delivered to the nozzle when the nozzle is jetting. The first mode has the first internal pressure higher than the second internal pressure and the second mode has the second internal pressure higher than the first internal pressure. The fluid flows from the first container to the second container according to the first mode and flows from the second container to the first container according to the second mode. | 10-24-2013 |
20130285086 | METHOD OF FORMING A MICRO LED DEVICE WITH SELF-ALIGNED METALLIZATION STACK - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, a patterned sacrificial layer is utilized to form a self-aligned metallization stack and is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. | 10-31-2013 |
20130300812 | COMPLIANT MICRO DEVICE TRANSFER HEAD - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion. | 11-14-2013 |
20130316529 | METHOD OF FORMING A MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure. | 11-28-2013 |
20130344630 | Durable Non-Wetting Coating on Fluid Ejector - A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle. | 12-26-2013 |
20140008813 | COMPLIANT MONOPOLOAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 01-09-2014 |
20140027709 | METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE - A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material. | 01-30-2014 |
20140048909 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 02-20-2014 |
20140055528 | ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT - A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator. | 02-27-2014 |
20140061687 | LED ARRAY - A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate. | 03-06-2014 |
20140064904 | COMPLIANT MICRO DEVICE TRANSFER HEAD WITH INTEGRATED ELECTRODE LEADS - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm. | 03-06-2014 |
20140071580 | MASS TRANSFER TOOL - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads. | 03-13-2014 |
20140084240 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-27-2014 |
20140084482 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 03-27-2014 |
20140104243 | Content-Based Adaptive Refresh Schemes For Low-Power Displays - A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame. | 04-17-2014 |
20140111575 | NOZZLE PLATE MAINTENANCE FOR FLUID EJECTION DEVICES - An ink jet printhead includes: a nozzle plate having an underside and including one or more nozzles in the underside configured to dispense drops of fluid in a dispensing direction; and a multi-level maintenance structure coupled to the nozzle plate such that a gap exists between a portion of the maintenance structure and the underside of the nozzle plate. The maintenance structure includes: a first portion having a first upper surface suspended at a first distance from the underside of the nozzle plate; and a second portion that is coupled to the first portion, the second portion having a second upper surface suspended at a second distance from the underside of the nozzle plate, which is greater than the first distance, the second upper surface laterally displaced relative to the first upper surface. | 04-24-2014 |
20140158415 | MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer. | 06-12-2014 |
20140159043 | ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINES - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area. | 06-12-2014 |
20140159064 | LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE - Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. | 06-12-2014 |
20140159065 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING CAVITY - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is held within an array of staging cavities on a carrier substrate. Each micro device is laterally surrounded by sidewalls of a corresponding staging cavity. | 06-12-2014 |
20140159066 | STABILIZATION STRUCTURE INCLUDING SACRIFICIAL RELEASE LAYER AND STAGING BOLLARDS - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity. | 06-12-2014 |
20140159067 | ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY - A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area. | 06-12-2014 |
20140159324 | COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads. | 06-12-2014 |
20140168037 | SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER - A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. | 06-19-2014 |
20140169924 | MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140169927 | MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140196851 | COMPLIANT MICRO DEVICE TRANSFER HEAD - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 07-17-2014 |
20140209248 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 07-31-2014 |
20140239089 | MEMS Jetting Structure For Dense Packing - A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element. | 08-28-2014 |
20140241843 | Mass Transfer Tool Manipulator Assembly - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140241844 | Micro Pick Up Array Mount With Integrated Displacement Sensor - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140267683 | METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST - A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. | 09-18-2014 |
20140290867 | MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE - A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate. | 10-02-2014 |
20140299572 | COMPLIANT MICRO DEVICE TRANSFER HEAD WITH INTEGRATED ELECTRODE LEADS - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm. | 10-09-2014 |
20140299837 | MICRO LED DISPLAY - A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate. | 10-09-2014 |
20140339495 | MICRO LED WITH WAVELENGTH CONVERSION LAYER - A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition. | 11-20-2014 |
20140340900 | STABILIZATION STRUCTURE INCLUDING SHEAR RELEASE POSTS - A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads. | 11-20-2014 |
20140354717 | Fluid Circulation - Among other things, an apparatus for use in fluid jetting is described. The apparatus comprises a printhead including a flow path and a nozzle in communication with the flow path that has a first end and a second end. The apparatus also includes a first container fluidically coupled to the first end of the flow path, a second container fluidically coupled to the second end of the flow path, and a controller. The first container has a first controllable internal pressure and the second container has a second controllable internal pressure. The controller controls the first internal pressure and the second internal pressure to have a fluid flow between the first container and the second container through the flow path in the printhead according to a first mode and a second mode. In either mode, at least a portion of the fluid flowing along the flow path is delivered to the nozzle when the nozzle is jetting. The first mode has the first internal pressure higher than the second internal pressure and the second mode has the second internal pressure higher than the first internal pressure. The fluid flows from the first container to the second container according to the first mode and flows from the second container to the first container according to the second mode. | 12-04-2014 |
20140355168 | MICRO PICK UP ARRAY WITH COMPLIANT CONTACT - Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array. | 12-04-2014 |
20140363928 | MICRO DEVICE STABILIZATION POST - A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface. | 12-11-2014 |
20140367633 | LED DISPLAY WITH WAVELENGTH CONVERSION LAYER - A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversions layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum. | 12-18-2014 |
20140367705 | REFLECTIVE BANK STRUCTURE AND METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE - Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer. | 12-18-2014 |
20140367711 | LED LIGHT PIPE - A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device, a light pipe around the micro LED device to cause internal reflection of incident light from the micro LED device within the light pipe, and a wavelength conversion layer comprising phosphor particles over the light pipe. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition. | 12-18-2014 |
20150021466 | MICRO PICK UP ARRAY ALIGNMENT ENCODER - Micro pick up arrays and methods for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array alignment encoder detects relative position between a micro pick up array having an encoder scale and a target substrate having a corresponding reference scale. In an embodiment, the micro pick up array alignment encoder facilitates alignment of the micro pick up array with the target substrate. | 01-22-2015 |
20150028362 | ADHESIVE WAFER BONDING WITH CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate. | 01-29-2015 |
20150076528 | ADHESIVE WAFER BONDING WITH SACRIFICIAL SPACERS FOR CONTROLLED THICKNESS VARIATION - A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers. | 03-19-2015 |