Patent application number | Description | Published |
20110220182 | Solar Panel Tracking and Performance Monitoring Through Wireless Communication - In one embodiment, a wireless device is embedded in a solar panel for providing remote tracking and/or performance monitoring of the solar panel. The wireless device may be a wireless tracking device including a memory for storing the identification or identity information of the solar panel or of the individual solar cells forming the panel. The wireless device may be a wireless tracking and monitoring device to provide both tracking and performance monitoring functions. In another embodiment, the wireless device is affixed to the exposed side of the back sheet of the solar panel but within the junction box interface so that the wireless device is enclosed in the junction box housing. In other embodiments, some of the elements of the wireless device may be embedded in the solar panel while other elements are affixed to the exposed back sheet inside the junction box housing. | 09-15-2011 |
20110312286 | Activating Dormant Wireless Circuitry Using Motion or Incident Light - A wireless device includes a controller and a wireless transceiver where the controller is operative to place the wireless transceiver in a low power consumption mode based on predefined energy saving control policy. In one embodiment, the wireless device includes an accelerometer generating an output signal indicative of motion or vibration of the wireless device where the output signal of the accelerometer is applied to cause the wireless transceiver to exit from the low power consumption mode. In another embodiment, the wireless device includes a photovoltaic module generating an output voltage signal indicative of incident light impinging on the photovoltaic module where the output voltage signal of the photovoltaic module is applied to cause the wireless transceiver to exit from the low power consumption mode. | 12-22-2011 |
20120211058 | Antenna for a Wireless Element Affixed to a Solar Module For Enhancing Communication Range - A solar panel includes a wireless device attached to or embedded in the solar panel where the wireless device includes a wireless transceiver circuit and a memory. In one embodiment, the solar panel includes an antenna formed on the metal frame of the solar panel where the antenna is electrically connected to the wireless device to extend a communication range of the wireless device. In another embodiment, the solar panel includes an antenna formed attached to a junction box of the solar panel. The antenna can be a slot antenna or a patch antenna. | 08-23-2012 |
20120227792 | System and Method For Storing Panel-Specific Data onto a Wireless Tag Affixed to a Solar Panel - A solar panel includes a wireless tag affixed to the solar panel where the wireless tag includes a wireless communication interface, a memory, and an auxiliary communication port. The memory of the wireless tag is configured to store at least panel-specific data of the solar panel where the panel-specific data includes at least current-voltage characteristics of the solar panel. The data is stored onto the memory of the wireless tag through the auxiliary communication port and the stored data is accessible through the wireless communication interface of the wireless tag. In another embodiment, a method for storing panel-specific data in a solar panel includes placing the solar panel with a wireless tag affixed thereto in a solar panel characterization chamber to perform characterization test and storing panel-specific data of the solar panel, including at least current-voltage characteristics of the solar panel, in the memory of the wireless tag. | 09-13-2012 |
20120229161 | Method For Detecting Underperforming Solar Wafers In A Solar Panel or Underperforming Solar Panel in a Solar Array - A method in a solar panel including one or more bypass diodes coupled to one or more sections of solar wafers includes measuring a current flowing through each section of the solar panel; measuring a current flowing through each bypass diode; and assessing the measured current value of the one or more sections of the solar panel and the measured current values of the bypass diodes to determine if the solar panel is malfunctioning. In another embodiment, the method measures a current flowing through the solar panel and through the bypass diodes to determine if the solar panel is malfunctioning. In another embodiment, a method in a solar array determines an underperforming solar panel by measuring the output current and the output voltage of the solar panels in the array. | 09-13-2012 |
20120298166 | Solar Panel with Energy Efficient Bypass Diode System - A solar panel including N panel sections and individual bypass diodes for each panel section includes a panel bypass diode connected in parallel with and in opposite polarity to the solar panel. The solar panel may further include one or more group bypass diodes when the solar panel includes three or more panel sections. Each group bypass diode is connected across a group of M adjacent panel sections, M being selected from 2 to N−1. The group bypass diode is connected in parallel with and in opposite polarity to the group of M adjacent panel sections. A group bypass diode is fully forward biased to conduct current through the solar panel when the associated group of M adjacent panel sections experience performance degradation. The panel bypass diode is fully forward biased to conduct current through the solar panel when the N panel sections experience performance degradation. | 11-29-2012 |
Patent application number | Description | Published |
20140370263 | PLASTICIZABLE HEAT-INSULATING COMPOSITION, TRANSPARENT HEAT-INSULATING INTERMEDIATE SHEET AND TRANSPARENT HEAT-INSULATING SANDWICH-STRUCTURED PANEL - A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions. | 12-18-2014 |
20150108388 | Light Absorbing Composition And Light-Absorbing Structure Made Therefrom - Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles. | 04-23-2015 |
20150346402 | NEAR-INFRARED RADIATION ABSORBING MASTERBATCH, NEAR-INFRARED RADIATION ABSORBING PRODUCT MADE FROM THE MASTERBATCH, AND METHOD OF MAKING NEAR-INFRARED RADIATION ABSORBING FIBER FROM THE MASTERBATCH - The near-infrared radiation absorbing masterbatch provided is prepared by melt-extruding a mixture comprising near-infrared radiation absorbing particles and a first polymer. The particles have a near-infrared absorption at a wavelength ranging from 0.7 μm to 2 μm and a far-infrared emissivity equal to or more than 0.85. The near-infrared light radiated by the particles has a wavelength ranging from 2 μm to 22 μm. Accordingly, the product made from the masterbatch, such as the near-infrared radiation absorbing fiber, plate, or film can not only absorb sunlight and store heat, but also radiate far-infrared light. Hence, the product has a thermal effect for keeping the human body warm and can serve as indoor and outdoor heat storing products at the same time. | 12-03-2015 |
20160067932 | INFRARED ABSORPTION FILM, INFRARED ABSORPTION FILM MANUFACTURING METHOD AND CAMERA MODULE COMPRISING THE INFRARED ABSORPTION FILM - An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6. | 03-10-2016 |
Patent application number | Description | Published |
20090181265 | ENERGY MANAGEMENT MODULE AND DRIVING DEVICE - A driving device for driving a load is disclosed, including a secondary cell, a fuel cell, a fuel supply device, and an energy management module. The energy management module is coupled to the secondary cell, the fuel cell, and the fuel supply device for generating a current signal to the load and a first and a second signal to the fuel supply device according to an electrical signal and a liquid level signal of the fuel cell, and driving the fuel supply device to supply a fuel solution to the fuel cell. | 07-16-2009 |
20090197132 | FUEL-CELL STRUCTURE - A fuel-cell structure is provided. The fuel-cell structure includes a base, at least one cell unit, a first supplier, a second supplier and a third supplier. The cell unit disposed on the base includes a reaction region, a first connecting port and an outputting terminal, wherein the first connecting port and the outputting terminal are coupled to the reaction region. The first supplier provides a first fluid transmitted to the reaction region of the cell unit via the first connecting port of the cell unit. The second supplier provides a second fluid transmitted to the reaction region of the cell unit, wherein the second fluid and the first fluid are reacted with respect to the reaction region of the cell unit, so that the reaction region of the cell unit provides a first electric power outputting through the outputting terminal. The third supplier provides a third fluid transmitted to the reaction region of the cell unit via the first connecting port of the cell unit, to humidify the cell unit by the third fluid. | 08-06-2009 |
20110159401 | DIRECT METHANOL FUEL CELL STRUCTURE - The invention provides a direct methanol fuel cell. The direct methanol fuel cell includes a membrane having a first surface and an opposite second surface. The membrane is sandwiched between a pair of electrodes. Two terminals of the membrane and a portion of the first and second surfaces adjacent to the two terminals are exposed from a pair of the electrodes. A pair of gas diffusion layers is respectively disposed on the pair of electrodes. A plurality of first border material layers having a plurality of holes is respectively physically embedded on the exposed first and second surfaces. A plurality of adhesion materials is respectively mounted on the border material layers, passing through the holes to contact the first and second surfaces of the membrane. | 06-30-2011 |
20110318670 | FUEL CELL MEA (MEMBRANE ELECTRODE ASSEMBLY) WITH A BORDER PACKAGING STRUCTURE - A fuel cell MEA with a border packaging structure. A catalyst coated membrane includes an anode catalyst layer, a cathode catalyst layer, and a proton exchange membrane disposed therebetween. An anode border packaging member is connected between the anode catalyst layer and an anode gas diffusion layer. A cathode border packaging member is connected between the cathode catalyst layer and a cathode gas diffusion layer and adheres to the anode border packaging member at outer edges of the catalyst coated membrane. The anode border packaging member and the cathode border packaging member respectively include two adhesive layers and a substrate layer formed therebetween. The anode border packaging member and the cathode border packaging member are respectively connected between the anode catalyst layer and the anode gas diffusion layer and between the cathode catalyst layer and the cathode gas diffusion layer by the adhesive layers. | 12-29-2011 |
Patent application number | Description | Published |
20090175492 | Image synthesis system for a vehicle and the manufacturing method thereof - The present invention discloses an image synthesis system for a vehicle to provide the driver with a downward-facing image of the car's 360° surrounding view. The system includes: a first camera, which is used to shoot a first image of the periphery of the vehicle; a second camera, which is used to shoot a second image of the periphery of said vehicle, wherein the second image and the first image have an overlap region; an image processing device comprising a defining component and a synthesis component, which is used to synthesize the first image and the second image and output a third image; a display device, which is used to display the third image. | 07-09-2009 |
20130059416 | FLIP-CHIP BGA ASSEMBLY PROCESS - A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array. | 03-07-2013 |
20130062752 | RING STRUCTURE FOR CHIP PACKAGING - A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner. | 03-14-2013 |
20130093094 | Method and Apparatus for Die Assembly - Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits. | 04-18-2013 |
20130095607 | Methods and Apparatus For Alignment In Flip Chip Bonding - Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment. | 04-18-2013 |
20130119565 | Rotating Curing - A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like. | 05-16-2013 |
20130260511 | LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES - A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies. | 10-03-2013 |
20140001652 | PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL | 01-02-2014 |
20150059159 | APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - An apparatus for manufacturing a semiconductor device includes a holder for holding a carrier and a supporting base for receiving the holder comprising a recess for accommodating a plurality of balls mounted on a surface of the carrier. Furthermore, a method of manufacturing a semiconductor device includes providing a carrier, providing an apparatus comprising a supporting base including a recess, holding the carrier on the supporting base and accommodating a plurality of balls mounted on a surface of the carrier in the recess. | 03-05-2015 |
20150069089 | LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES - An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM. | 03-12-2015 |
20150093856 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a WLP semiconductor structure includes several operations. One of the operations is providing a carrier and the carrier includes a top surface. One of the operations is covering a portion of the top surface with a plurality of active dies. One of the operations is disposing a protrudent band on a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier. One of the operations is forming a molding compound on the carrier to cover the plurality of active dies. | 04-02-2015 |
20150145115 | EMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, a die including a first surface and a second surface, a plurality of first conductive bumps disposed between the second surface of the carrier and the die, wherein the die is flip bonded on the carrier, and a molding disposed over the carrier and surrounding the die, wherein the molding includes a recessed portion disposed on the first surface of the die thereby leaving a portion of the first surface is uncovered by the molding. Further, a method of manufacturing a semiconductor device includes providing a carrier, flip bonding a die on the carrier, disposing a rubber material on a first surface of the die and within the first surface of the die, and forming a molding surrounding the rubber material and covering the carrier. | 05-28-2015 |
20150155221 | ADHESIVE PATTERN FOR ADVANCE PACKAGE RELIABILITY IMPROVEMENT - The present disclosure relates to an integrated chip package having a plurality of different adhesive layers that provide for a low lid induced stress good warpage control of a substrate and/or IC die, and an associated method of formation. The integrated chip package has an integrated chip (IC) die coupled to an underlying substrate by an electrically conductive interconnect structure. A first adhesive layer, having a first Young's modulus, is disposed onto the substrate at a first plurality of positions surrounding the IC die. A second adhesive layer, having a second Young's modulus different than the first Young's modulus, is disposed onto the substrate at a second plurality of positions surrounding the IC die. A lid is affixed to the substrate by the first and second adhesive layers and extends to a position overlying the IC die. | 06-04-2015 |
20150179607 | Semiconductor Packaging Structure and Process - A method and structure for packaging a semiconductor device are provided. In an embodiment a first substrate is bonded to a second substrate, which is bonded to a third substrate. A thermal interface material is placed on the second substrate prior to application of an underfill material. A ring can be placed on the thermal interface material, and an underfill material is dispensed between the second substrate and the third substrate. By placing the thermal interface material and ring prior to the underfill material, the underfill material cannot interfere with the interface between the thermal interface material and the second substrate, and the thermal interface material and ring can act as a physical barrier to the underfill material, thereby preventing overflow. | 06-25-2015 |
20150187679 | Lid Design for Heat Dissipation Enhancement of Die Package - Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened. | 07-02-2015 |
20150187734 | Packages with Die Stack Including Exposed Molding Underfill - A method includes bonding a first device die onto a top surface of a package substrate, and performing an expose molding on the first device die and the package substrate. At least a lower portion of the first device die is molded in a molding material. A top surface of the molding material is level with or higher than a top surface of the first device die. After the expose molding, a second device die is bonded onto a top surface of the first device die. The second device die is electrically coupled to the first device die through through-silicon vias in a semiconductor substrate of the first device die. | 07-02-2015 |
20150214074 | Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices - Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring. | 07-30-2015 |
20150214128 | System and Method for Bonding Package Lid - Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill. | 07-30-2015 |
20150357309 | Package Structure and Methods of Forming the Same - Embodiments relate to packages and methods of forming packages. A package includes a package substrate, a first device die, first electrical connectors, an encapsulant, a redistribution structure, and a second device die. The first device die is attached to a side of the package substrate, and the first electrical connectors are mechanically and electrically coupled to the side of the package substrate. The encapsulant at least laterally encapsulates the first electrical connectors and the first device die. The redistribution structure is on the encapsulant and the first electrical connectors. The redistribution structure is directly coupled to the first electrical connectors. The first device die is disposed between the redistribution structure and the package substrate. The second device die is attached to the redistribution structure by second electrical connectors, and the second electrical connectors are directly coupled to the redistribution structure. | 12-10-2015 |
20150357318 | METHOD OF MANUFACTURING A CHIP PACKAGE - Chip packages and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a chip package includes: stacking a second chip on a first chip, wherein a first interconnect including a support structure and a bonding structure is disposed between the first chip and the second chip; bonding the first chip and the second chip via a thermal process applied to the bonding structure of the first interconnect; stacking a third chip on the second chip, wherein a second interconnect including a support structure and a bonding structure is disposed between the second chip and the third chip; bonding the second chip and the third chip via the thermal process applied to the bonding structure of the second interconnect; and reflowing the bond between the first and second chips and simultaneously reflowing the bond between the second and third chips. | 12-10-2015 |
20160071744 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Some embodiments of the present disclosure provide a method of manufacturing a device. The method includes providing a carrier, the carrier including a top surface, covering a portion of the top surface with a plurality of active dies, disposing a protrudent band over a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier, and forming a molding compound over the carrier to cover the plurality of active dies. A method for determining a width of the protrudent band of a device described herein is also provided. | 03-10-2016 |
Patent application number | Description | Published |
20150213588 | IMAGE CAPTURING DEVICE AND METHOD FOR DETECTING IMAGE DEFORMATION THEREOF - An image capturing device and a method for detecting image deformation thereof are provided. The method is for the image capturing device having a first sensor and a second image sensor, and the method includes the following steps. A first image is captured through the first image sensor, and a second image is captured through the second image sensor. A deform detection is performed according to the first and second images so as to obtain a comparison information between the first and second images. Whether a coordinate parameter relationship between the first and second images being varied is determined according to the comparison information, in which the coordinate parameter relationship is associated with a spatial configuration relationship between the first and second image sensors. | 07-30-2015 |
20150213589 | IMAGE CAPTURING DEVICE AND METHOD FOR CALIBRATING IMAGE DEFORMATION THEREOF - An image capturing device and a method for calibrating image deformation thereof are provided. The image capturing device has a first image sensor and a second image sensor and the method includes following steps. A plurality of image groups are captured through the first image sensor and the second image sensor. Each of the image groups includes a first image and a second image, and the image groups include a reference image group. Whether an image deformation occurs on a first reference image and a second reference image in the reference image group is detected. If it is detected that the image deformation occurs on the reference image group, a current calibration parameter is updated according to a plurality of feature point comparison values corresponding to the image groups. The current calibration parameter is used for performing an image rectification on each of the first images and the second images. | 07-30-2015 |
20150215607 | IMAGE CAPTURING DEVICE AND METHOD FOR CALIBRATING IMAGE DEFORMATION THEREOF - A method for calibrating image deformation of an image capturing device having a first and second lens, a focusing actuator, and a prestored first focusing step-to-focusing distance relation includes the following steps. A plurality of image sets are captured by the first and second lens, where each of the image sets includes a first and second image, and the images sets include a reference image set. It is detected whether the reference image set is deformed. When the reference image set is detected to be deformed, the first focusing step-to-focusing distance relation is calibrated according to a focusing step and a focusing distance corresponding to each of the image sets, where the focusing step corresponding to each of the image sets is the number of steps that the focusing actuator is required to move the first and second lens to a focusing position to generate each of the image sets. | 07-30-2015 |
20150215615 | IMAGE CAPTURING DEVICE AND METHOD FOR CALIBRATING IMAGE DEFECTION THEREOF - A method for calibrating image defection of an image capturing device having a first and second lens, a focusing actuator, and a prestored first focusing step-to-focusing distance relation includes the following steps. A plurality of image sets are captured by the first and second lens, where each of the image sets includes a first and second image, and the images sets include a reference image set. It is detected whether the reference image set is defective. When the reference image set is detected to be defective, the first focusing step-to-focusing distance relation is calibrated according to a focusing step and a focusing distance corresponding to each of the image sets, where the focusing step corresponding to each of the image sets is the number of steps that the focusing actuator is required to move the first and second lens to a focusing position to generate each of the image sets. | 07-30-2015 |
20150292873 | IMAGE CAPTURE DEVICE, DEPTH GENERATING DEVICE AND METHOD THEREOF - An image capture device, a depth generating device and a method thereof are disclosed. The present disclosure is characterized in that a depth calculation technology with a structure light projection and a pictorial depth calculation technology are combined to better both of resolution and accuracy of the calculated image depth. In addition, the utilization of a modified flashlight enables the combination of the two technologies to be applied to a hand-held capture device. | 10-15-2015 |
20150304527 | LENS DISTORTION CORRECTION METHOD - The present disclosure illustrates a lens distortion correction method to solve influence for distortion correction caused by an alignment error between a lens center and a center of image sensor unit during assembling. The present disclosure is characterized in that the spatial geometric calibration is incorporated with the lens distortion correction and different image centers are selected repeatedly when transformation relationship of image coordinates id used to perform the lens distortion correction, so as to correct the image center of the image to be corrected and enhance the accuracy of lens distortion correction. | 10-22-2015 |
20160080657 | IMAGE CAPTURING DEVICE AND DIGITAL ZOOM METHOD - The present invention discloses an image capturing device and a digital zoom method. The image capturing device comprises a first lens module, a second lens module, a feature extraction unit, an image zooming-deformation unit and an image merging unit. The first lens module and the second lens module are applied to capture a first image and a second image, respectively. The feature extraction unit extracts a plurality of first image features and second image features from the first image and the second image, respectively, and generating pixel offset characteristics. Based on a zoom factor and the pixel offset characteristics, the image zooming-deformation unit zooms and deforms the first and second images to generate a third image and a fourth image. The image merging unit bases the zoom factor to merge the third image and the fourth image for obtaining a combined image. | 03-17-2016 |
Patent application number | Description | Published |
20100029035 | METHOD OF MANUFACTURING A PHOTOELECTRONIC DEVICE - This application discloses a method of manufacturing a photoelectronic device comprising steps of providing a semiconductor stack layer, forming at least one metal adhesive on the semiconductor stack layer by a printing technology, forming an electrode by heating the metal adhesive to remove the solvent in the metal adhesive, wherein an ohmic contact is formed between the electrode and the semiconductor stack layer. | 02-04-2010 |
20100258171 | SOLAR PHOTOVOLTAIC DEVICE - A solar photovoltaic device is provided and includes a solar cell body, a window layer on the solar cell body, and a current collection layer on the window layer. The current collection layer includes a patterned structure, and a portion of the window layer is exposed by the patterned structure. | 10-14-2010 |
20110005595 | SOLAR CELL MODULE AND THE FABRICATION METHOD OF THE SAME - The application illustrates a solar cell module, included a base device, a solar cell on the base device, and a concentrator on the solar cell. The concentrator directly contacts with the solar cell and concentrates the light to the solar cell for opto-electric transformation. | 01-13-2011 |
20130286634 | METHOD FOR MANUFACTURING OPTOELECTRONIC DEVICES - A method for manufacturing optoelectronic devices comprising the steps of: providing a common growth substrate; forming a light-emitting epitaxy structure on the common growth substrate; forming a stripping layer on the light-emitting epitaxy structure; forming a solar cell epitaxy structure on the stripping layer; forming an adhesive layer on the solar cell epitaxy structure; proving a solar cell permanent substrate on the adhesive layer; and removing the stripping layer to form a light-emitting device and a solar cell device separately. | 10-31-2013 |
20130298972 | OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF - A method for manufacturing an optoelectronic device includes steps of: providing an optoelectronic structure; forming a first contact layer having a pattern on the upper surface of the optoelectronic structure; forming a dielectric layer on the first contact layer and the optoelectronic structure; removing the dielectric layer on the first contact layer; and forming an electrode structure on the first contact layer. | 11-14-2013 |
20140196782 | METHOD FOR MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MADE THEREBY - Disclosed is a method for yield enhancement of making a semiconductor device. The method for yield enhancement of making a semiconductor device comprises the steps of: providing the semiconductor device comprising an epitaxial layer including a defect; forming a dielectric layer on the epitaxial layer; detecting and identifying a location of the defect; and etching the dielectric layer and leaving a part of the dielectric layer to cover an area substantially corresponding to the detected defect. The semiconductor device made by the method is also disclosed. | 07-17-2014 |
20140199784 | Method and Apparatus for Making a Semiconductor Device - Disclosed is an apparatus and method for yield enhancement of making a semiconductor device. The apparatus for yield enhancement of making a semiconductor device comprises: a semiconductor device comprising an epitaxial layer in which a defect is included, and a photo-resistor on the epitaxial layer and covering the defect; an image recognition system to detect and identify a location of the defect; and an exposing module comprising a first light source to expose a part of the photo-resistor substantially corresponding to the detected defect identified by the image recognition system. | 07-17-2014 |
20150155433 | LIGHT-EMITTING DEVICE - A light-emitting device includes: a Distributed Bragg reflector comprising alternate first semiconductor layers and second semiconductor layers, wherein each first semiconductor layer comprises a low-refractive-index part having a depth; and a light-emitting semiconductor stack associated with the Distributed Bragg reflector; wherein the depths of the low-refractive-index parts of the first semiconductor layers are gradually changed in a direction toward the light-emitting semiconductor stack. | 06-04-2015 |