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Takayuki Naba
KANAGAWA-KEN, JP
1. 20090283309 CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY AND SEMI-CONDUCTOR DEVICE USING THE BONDED BODY 11-19-20092. 20090090452 PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE 04-09-2009
3. 20090056996 ELECTRONIC COMPONENT MODULE - 1 has a circuit board 2 in which metal plates 5 and 7 are bonded to both surfaces of a ceramic substrate 3 03-05-2009