Patent application number | Description | Published |
20090056742 | Process for Decontaminating an Organic Solid Substrate Contaminated by Solid Radioactive Particulate Inorganic Contaminants, Using Dense Pressurized CO2 - Process for decontaminating, cleaning a solid organic substrate contaminated by solid radioactive particulate inorganic contaminants, in which:
| 03-05-2009 |
20090186153 | PROCESS FOR SYNTHESISING COATED ORGANIC OR INORGANIC PARTICLES - A process for the “in situ” manufacture, in a pressurized CO | 07-23-2009 |
20100143608 | METHOD AND DEVICE FOR PREPARING A MULTILAYER COATING ON A SUBSTRATE - Method for preparing a substrate comprising a solid support and a plurality of layers on the support; at least one layer consisting of a uniform, homogeneous, and continuous film of particles of one or more metal oxide(s), or of uniformly, homogeneously, dispersed particles of one or more metal oxide(s), on the support or on an underlying layer; at least one layer consisting of a continuous or discontinuous film of one or more metal(s) or of one or more metal alloy(s), or of dispersed nanoparticles of one or more metal(s) or of one or more metal alloy(s), on the support or on an underlying layer; the method comprising the following steps: a)—impregnating the heated solid support or an already deposited underlying layer with a solution of precursors of the metal oxide or oxides in a supercritical fluid, and depositing a uniform, homogeneous, and continuous film of particles of one or more metal oxide(s), or of uniformly, homogeneously, dispersed particles of one or more metal oxide(s), on the support or on the underlying layer; b)—depositing a continuous or discontinuous film of one or more metal(s) or of one or more metal alloy(s), or dispersed nanoparticles of one or more metal(s) or of one or more metal alloy(s), on the support or on an underlying layer, by chemical vapour deposition CVD, from one or more precursors; the steps a) and b) being carried out in the same chamber, same reactor. | 06-10-2010 |
Patent application number | Description | Published |
20090161405 | DATA STORAGE MEDIUM AND ASSOCIATED METHOD - A data storage medium includes | 06-25-2009 |
20100221891 | METHOD OF PRODUCING A HYBRID SUBSTRATE BY PARTIAL RECRYSTALLIZATION OF A MIXED LAYER - A method of producing a hybrid substrate includes preparing a monocrystalline first substrate to obtain two surface portions. A temporary substrate is prepared including a mixed layer along which extends one surface portion and is formed of first areas and adjacent different second areas of amorphous material, the second areas forming at least part of the free surface of the first substrate. The first substrate is bonded to the other surface portion with the same crystal orientation as the first surface portion, by molecular bonding over at least the amorphous areas. A solid phase recrystallization of at least part of the amorphous areas according to the crystal orientation of the first substrate is selectively carried and the two surface portions are separated. | 09-02-2010 |
20100323497 | METHOD OF TRANSFERRING A THIN LAYER ONTO A TARGET SUBSTRATE HAVING A COEFFICIENT OF THERMAL EXPANSION DIFFERENT FROM THAT OF THE THIN LAYER - A method of transferring a thin layer from a source substrate having a surface layer of a first material along a free surface thereof to a target substrate having at least one surface layer of a second material along a free surface thereof, where the first material differs from the second material, includes forming within the surface layer of the source substrate a weakened zone delimiting a thin layer with respect to the free surface, and assembling the free surface of the source substrate to the free surface of the target substrate in a stack of alternating layers comprising the first and second materials, so that there are, on either side of an interface formed by bringing the free surfaces into intimate contact. The cumulative thicknesses of the layers of the first material are substantially equal to the cumulative thickness of the layers of the second material, the layers having thicknesses at least equal to 50 microns and at least 1000 times the depth at which the weakened zone is formed. The thin layer is detached by applying at least partially thermal energy to fracture the weakened zone. | 12-23-2010 |
20110163410 | METHOD FOR PRODUCING HYBRID COMPONENTS - A method for producing a hybrid substrate, including a support substrate, a continuous buried insulator layer and, on this continuous layer, a hybrid layer including alternating zones of a first material and at least one second material, wherein these two materials are different by their nature and/or their crystallographic characteristics. The method forms a hybrid layer, including alternating zones of first and second materials, on a homogeneous substrate, assembles this hybrid layer, the continuous insulator layer and the support substrate, and eliminates a part at least of the homogeneous substrate, before or after the assembling. | 07-07-2011 |
20110201177 | METHOD IN THE MICROELECTRONICS FIELDS OF FORMING A MONOCRYSTALLINE LAYER - A process for forming a thin film of a given material includes providing a first substrate having, on the surface, an amorphous and/or polycrystalline film of the given material and a second substrate is bonded to the first substrate by hydrophobic direct bonding (molecular adhesion), the second substrate having a single-crystal reference film of a given crystallographic orientation on the surface thereof. A heat treatment is applied at least to the amorphous and/or polycrystalline film, where the heat treatment causes at least a portion of the amorphous and/or polycrystalline film to undergo solid-phase recrystallization along the crystallographic orientation of the reference film, where the reference film acts as a recrystallization seed. The at least partly recrystallized film is then separated from at least a portion of the reference film. | 08-18-2011 |
Patent application number | Description | Published |
20080196747 | Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water - Adhesion by molecular bonding of two free surfaces of first and second substrates, for example formed by monocrystalline silicon wafers, comprises at least successively:
| 08-21-2008 |
20080272396 | Simplified Method of Producing an Epitaxially Grown Structure - Method to produce a structure consisting of depositing a material by columnar epitaxy on a crystalline face of a substrate ( | 11-06-2008 |
20080280419 | METHOD FOR NANOSTRUCTURING OF THE SURFACE OF A SUBSTRATE - Under consideration here is a method for the production of periodic nanostructuring on one of the surfaces of a substrate ( | 11-13-2008 |
20080318366 | METHOD FOR PRODUCING A SUPPORT FOR THE GROWTH OF LOCALISED ELONGATED NANOSTRUCTURES - The invention relates to a method for producing a support comprising nanoparticles ( | 12-25-2008 |
20090162991 | PROCESS FOR ASSEMBLING SUBSTRATES WITH LOW-TEMPERATURE HEAT TREATMENTS - The invention relates to a process for producing a bond between a first and a second substrate ( | 06-25-2009 |
20090246933 | METHOD OF PRODUCING A STRAINED LAYER - A method of producing a strained layer on a substrate includes assembling a layer with a first structure or first means of straining including at least one substrate or one layer capable of being deformed within a plane thereof under the influence of an electric or magnetic field or a photon flux. The layer is strained by modifying the electric or magnetic field or the photon flux. The strained layer is assembled with a transfer substrate and all or part of the first straining structure is removed. | 10-01-2009 |
20110207293 | METHOD OF PRODUCING A HYBRID SUBSTRATE HAVING A CONTINUOUS BURIED EECTRICALLY INSULATING LAYER - A method for producing a hybrid substrate includes preparing a first substrate including a mixed layer and an underlying electrically insulating continuous layer, the mixed layer made up of first single-crystal areas and second adjacent amorphous areas, the second areas making up at least part of the free surface of the first substrate. A second substrate is bonded to the first substrate, the second substrate including on the surface thereof, a reference layer with a predetermined crystallographic orientation. The first substrate is bonded to the second substrate by hydrophobic molecular bonding of at least the amorphous areas. A recrystallisation of at least part of the amorphous areas to solid phase is carried out according to the crystallographic orientation of the reference layer, and the two substrates are separated at the bonding interface. | 08-25-2011 |
20120088352 | PROCESS FOR ASSEMBLING SUBSTRATES WITH LOW-TEMPERATURE HEAT TREATMENTS - The invention relates to a process for producing a bond between a first and a second substrate. The process includes preparing surfaces of the substrates to be assembled, and attaching the surfaces to form an assembly of these two surfaces, by direct molecular bonding. The assembly is then heat treated, which includes maintaining the temperature within the range of 50° C. to 100° C. for at least one hour. | 04-12-2012 |
20120100719 | METHOD FOR MAKING A PLANAR MEMBRANE - A method for determining a minimum tension compensation stress which will have a membrane of a thickness of less than or equal to one micrometer, secured to a frame, having, in the absence of any external stress, a desired deflection. The membrane can be made as planar as possible in absence of any external stress, and its thickness can be less than or equal to one micrometer. | 04-26-2012 |
20130075365 | METHOD FOR BUILDING A SUBSTRATE HOLDER - A method for making a support of at least one substrate, including: making a stack including at least two substrates, each of the two substrates including two opposite main faces, both substrates being secured to each other such that one of the main faces of a first of the two substrates is positioned facing one of the main faces of the second of the two substrates and against an etch-stop material; etching, through the first of the two substrates and with stop on the etch-stop material, at least one location that can receive a substrate that can be supported by the support. | 03-28-2013 |
20130156989 | MANUFACTURING A FLEXIBLE STRUCTURE BY TRANSFERS OF LAYERS - A method for manufacturing a flexible structure including implanting ionic species in first and second source substrates so as to form first and second embrittlement regions respectively, delimiting first and second thin films, providing a flexible substrate, the stiffness R of which is less than or equal to 10 | 06-20-2013 |
20140014618 | METHOD FOR PRODUCING A SUBSTRATE HOLDER - A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area. | 01-16-2014 |
20140178596 | METHOD FOR RECYCLING A SUBSTRATE HOLDER - A method for recycling a substrate holder adapted to receive a substrate for at least one deposition step of a layer of a material on the substrate also leading to the depositing of a layer of a material on the substrate holder, the method including implanting ion species through a receiving surface of the substrate holder so as to form at least one buried weakened plane delimiting a thin film underneath the receiving surface of the substrate holder, exfoliating the thin film from the substrate holder so as to break up the thin film, and removing a stack including at least one layer of a material deposited on the thin film resulting from the at least one deposition step of the layer of a material on the substrate. | 06-26-2014 |
20140295642 | DOUBLE LAYER TRANSFER METHOD - A method of transferring a layer including: a) providing a layer joined to an initial substrate with a binding energy E0; b) bonding a front face of the layer on an intermediate substrate according to an intermediate bonding energy Ei; c) detaching the initial substrate from the layer; e) bonding a rear face onto a final substrate according to a final bonding energy Ef; and f) debonding the intermediate substrate from the layer to transfer the layer onto the final substrate; step b) comprising a step of forming siloxane bonds Si—O—Si, step c) being carried out in a first anhydrous atmosphere and step f) being carried out in a second wet atmosphere such that the intermediate bonding energy Ei takes a first value Ei1 in step c) and a second value Ei2 in step f), with Ei1>E | 10-02-2014 |
Patent application number | Description | Published |
20080257420 | SLAM SHUT SAFETY DEVICE - A safety device for a gas distribution system includes a valve body, an upper casing attached to the valve body, the upper casing housing two springs. The two springs are co-axially located and separated by a casting tube. Further, the two springs are attached to a movable diaphragm that is exposed to gas system pressure. A snap ring flange is also attached to the valve body, the snap ring flange being used to secure the safety device to a main regulator in the gas distribution system. The valve body also includes a cam mounted within the valve body. A limit switch is directly connected to the cam such that the limit switch moves directly in response to movement of the diaphragm. Additionally, a reset pin extends from the valve body and interacts with the cam such that the cam may be reset from a closed position to an open position by moving the reset pin. | 10-23-2008 |
20120273066 | SLAM SHUT SAFETY DEVICE - A safety device for a gas distribution system includes a valve body and an upper casing attached to the valve body, the upper casing housing two springs. The two springs are separated by a casting tube. The two springs are attached to a movable diaphragm that is exposed to gas system pressure. The valve body also includes a cam mounted within the valve body. A limit switch is directly connected to the cam such that the limit switch moves directly in response to movement of the diaphragm. Additionally, a reset pin extends from the valve body and interacts with the cam such that the cam may be reset from a closed position to an open position by moving the reset pin. | 11-01-2012 |
20130133755 | Slam-Shut Safety Device Having a Cage - A slam-shut device includes an inlet, an outlet, a valve seat, and defines a flow path. A valve disc is shiftable between an open position and a closed position, and reset pin responsive to an actuator is coupled to the valve disc and shifts between an untripped position and a tripped position. A cylindrical cage is mounted within the valve body and is disposed in the flow path, and includes a plurality of flow apertures slidably receives the valve disc. The cage includes a first end adjacent the valve seat and a second end away from the valve seat, and the cage forms a cylindrical recess disposed adjacent the second end of the cage and spaced from the flow apertures. | 05-30-2013 |
Patent application number | Description | Published |
20100007874 | METHOD FOR ENSURING THE SAFETY OF THE COMPONENTS OF THE DRIVE TRAIN OF A VEHICLE FOLLOWING THE DETERIORATION OF THE FUEL - The invention relates to a method of ensuring the safety of the components of the drive train of a vehicle equipped with a heat engine, before or during its startup phase following a deterioration of the quality of the fuel contained in the tank ( | 01-14-2010 |
20100168984 | METHOD OF ADJUSTING INJECTION, COMBUSTION AND/OR POST-TREATMENT PARAMETERS OF AN INTERNAL COMBUSTION ENGINE WITH AUTO-IGNITION - The present invention relates to a method for adjusting injection, combustion and/or post-treatment parameters of an internal combustion engine with auto-ignition, characterized in that it comprises a step of determining the content and the type of biofuel present in the fuel feeding the injection system. | 07-01-2010 |
20100252737 | SPECTROMETER FOR FLUID ANALYSIS - A spectrometer includes: a lighting device (LSRC) configured to generate a light beam covering a wavelength band, a probe configured so that the light beam coming from the lighting device interacts with a fluid to be analyzed, and a spectrum analyzing device configured to receive the light beam after it has interacted with the fluid to be analyzed, and to provide light intensity measurements for various ranges of wavelengths. The lighting device includes several light-emitting components ( | 10-07-2010 |
20100305827 | DEVICE FOR THE CENTRALIZED MANAGEMENT OF MEASUREMENTS AND DATA RELATING TO THE LIQUID AND GAS FLOWS NEEDED FOR THE OPERATION OF A COMBUSTION ENGINE - The invention relates to a device for the centralized management of measurements and data relating to liquid and/or gas flows needed for the correct operation of a combustion engine controlled by an engine computer and/or of a vehicle, said device comprising means for analyzing at least two liquid and/or gas flows including at least one light source, at least one optical signals detector and at least one system for analyzing the detected signals. At least one of said analysis means is used to analyze two of said flows. In this way, this device minimizes the bulk and added mass incurred by the analytical methods employed to analyze the various flows and simplifies the management of such a system. | 12-02-2010 |
20120017873 | SPARK ADVANCE ADJUSTMENT - The invention relates to an additional process for the spark advance adjustment. This process is used for the tight adjustment of the spark advance angle depending on the structure of the fuel molecules from at least one mapping. This adjustment covers the entire operation range of the engine. This process reduces the pollutant emission when the engine is cold, as soon as the engine starting and stabilisation phase when the engine control and adjustment systems are not in a closed adjustment loop yet. The spark advance adjustment can also be used for operation at the rattle boundary during high load operation and at the engine full load. | 01-26-2012 |
Patent application number | Description | Published |
20110237068 | METHOD FOR FORMING ELECTRIC VIAS - A method for forming through vias connecting the front surface to the rear surface of a semiconductor substrate, including the steps of: forming openings in the substrate, thermally oxidizing walls of the openings, filling the openings with a sacrificial material, forming electronic components in the substrate, etching the sacrificial material, filling the openings with a metal, and etching the rear surface of the substrate all the way to the bottom of the openings. | 09-29-2011 |
20120126230 | METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP STACK DEVICE - A method for manufacturing a semiconductor chip stack device is provided. The method includes forming a first connecting element array on a surface of a first semiconductor chip; forming a second connecting element array on a surface of a second semiconductor chip, the second array comprising more connecting elements than the first array and the pitch of the first array being a multiple of the pitch of the second array; applying the first chip against the second chip; and setting up test signals between the first and second chips to determine the matching between the connecting elements of the first array and the connecting elements of the second array. | 05-24-2012 |
20120225326 | MODULE ELEMENT, IN PARTICULAR FOR A BIOFUEL CELL, AND MANUFACTURING PROCESS - A module of a biofuel cell includes three module elements each having a porous membrane. At least two of the porous membranes are electrically conducting and form the cathode and the anode of the biofuel cell. The third membrane, which is preferably positioned between the two electrically conducting membranes need not be conducting, but defines two emergent cavities within the module. A porous through-channel extends through a silicon support of the module so as to connect one of the emergent cavities to at least one external wall of the silicon support. | 09-06-2012 |