Patent application number | Description | Published |
20150238185 | IMPLANTABLE LAYERS AND METHODS FOR ALTERING IMPLANTABLE LAYERS FOR USE WITH SURGICAL FASTENING INSTRUMENTS - A method is disclosed for altering a implantable layer which includes the steps of obtaining an implantable layer comprising a surface at least partially comprised from a material with a glass transition temperature and a melting temperature, heating the surface to a temperature higher than the glass transition temperature and lower than the melting temperature, manipulating the surface, allowing the manipulated surface to cool below the glass transition temperature, and releasing the surface. | 08-27-2015 |
20150238188 | IMPLANTABLE LAYERS AND METHODS FOR MODIFYING THE SHAPE OF THE IMPLANTABLE LAYERS FOR USE WITH A SURGICAL FASTENING INSTRUMENT - A method is disclosed for altering an implantable layer for use with a surgical instrument which includes the steps of obtaining an implantable layer comprised at least partially from a material including a glass transition temperature and a melting temperature, wherein the implantable layer includes a first shape, heating the material to a temperature higher than the glass transition temperature and lower than the melting temperature, manipulating the implantable layer to a second shape different than the first shape, allowing the material to cool below the glass transition temperature, and releasing the implantable layer. | 08-27-2015 |
20150239180 | IMPLANTABLE LAYERS AND METHODS FOR ALTERING ONE OR MORE PROPERTIES OF IMPLANTABLE LAYERS FOR USE WITH FASTENING INSTRUMENTS - A method is disclosed for changing the spring rate of an implantable layer for use with a surgical instrument which includes the steps of obtaining an implantable layer having a first spring rate, wherein the implantable layer is at least partially comprised of a material having a glass transition temperature and a melting temperature, heating the implantable layer to a temperature higher than the glass transition temperature and lower than the melting temperature, deforming the implantable layer to change the first spring rate to a second spring rate, wherein the second spring rate is different than the first spring rate, allowing the implantable layer to cool below the glass transition temperature, and releasing the implantable layer. | 08-27-2015 |
Patent application number | Description | Published |
20150137951 | EFFICIENTLY RESOLVING THE VALUES FOR THE TAG PARAMETERS THEREBY SYNDICATING THE TAG DATA AS EARLY AS POSSIBLE - A method, system and computer program product for resolving values of parameters of tags. A map is created which includes the number of times each parameter is referenced by the tags in a web page requested by a client device. The parameters in the map are then sorted in a list in descending order based on the number of times referenced by the tags. The value for the parameter listed at the top of the list is looked up. If the value cannot be located, then those tags that are associated with this parameter are added to a list of tags to be ignored. By ignoring such tags in this list, the resolving of tag values for tags to be syndicated can occur more quickly and efficiently, including syndicating the tag data before the web page is completely loaded. | 05-21-2015 |
20150137952 | EFFICIENTLY RESOLVING THE VALUES FOR THE TAG PARAMETERS THEREBY SYNDICATING THE TAG DATA AS EARLY AS POSSIBLE - A method, system and computer program product for resolving values of parameters of tags. A map is created which includes the number of times each parameter is referenced by the tags in a web page requested by a client device. The parameters in the map are then sorted in a list in descending order based on the number of times referenced by the tags. The value for the parameter listed at the top of the list is looked up. If the value cannot be located, then those tags that are associated with this parameter are added to a list of tags to be ignored. By ignoring such tags in this list, the resolving of tag values for tags to be syndicated can occur more quickly and efficiently, including syndicating the tag data before the web page is completely loaded. | 05-21-2015 |
20150235263 | MANAGING COOKIE DATA - A method, information handling system and/or computer program product provides a cookie to a user. The method comprises: analyzing data in a consolidated set of the user's internet activities; generating a server side cookie for a website based on the analyzed data; in response to the user visiting the website with a first client, providing the server side cookie to the first client; merging the server side cookie with a client side cookie at the first client; and using the merged cookie to provide personalized recommendations to the user. | 08-20-2015 |
20150236925 | MANAGING COOKIE DATA - A method, information handling system and/or computer program product provides a cookie to a user. The method comprises: analyzing data in a consolidated set of the user's internet activities; generating a server side cookie for a website based on the analyzed data; in response to the user visiting the website with a first client, providing the server side cookie to the first client; merging the server side cookie with a client side cookie at the first client; and using the merged cookie to provide personalized recommendations to the user. | 08-20-2015 |
Patent application number | Description | Published |
20090055134 | System and Method for Implementing Optimized Creation of Openings for De-Gassing in an Electronic Package - System and method for designing an electronic package. A placement manager receives a physical design of an electronic package from a packaging design tool. The placement manager receives design constraints regarding the physical design for the electronic package. The placement manager inserts specifications for at least one de-gassing opening in the physical design for the electronic package, wherein the specification for at least one de-gassing opening are created in accordance with said design constraints regarding said physical design of said electronic package. The placement manager outputs an updated physical design of the electronic package. | 02-26-2009 |
20090063867 | Method, System and Computer Program Product for Preventing Execution of Software Without a Dynamically Generated Key - A method, system and computer program product for partitioning the binary image of a software program, and partially removing code bits to create an encrypted software key, to increase software security. The software program's binary image is partitioned along a random segment length or a byte/nibble segment length, and the code bits removed, and stored, along with their positional data in a software key. The software key is encrypted and is separately distributed from the inoperable binary image to the end user. The encrypted key is stored on a secure remote server. When the end user properly authenticates with the developer's remote servers, the encrypted security key is downloaded from the secure remote server and is locally decrypted. The removed code bits are reinserted into the fractioned binary image utilizing the positional location information. The binary image is then operable to complete execution of the software program. | 03-05-2009 |
20090063868 | Method, System and Computer Program Product for Preventing Execution of Pirated Software - A method, system and computer program product for preventing execution of pirated software. A file is loaded on an end user's computer containing a binary image that is generated by removing one or more code bits from an executable code. A request is sent to a remote server to return a software key required for execution of the executable code from the binary image. The software key is downloaded to the end user's computer on which the binary image is loaded. One or more bits from the software key is inserted into the appropriate location of the binary image to regenerate the executable code. The executable code is enabled for execution on the end user's computer only following the embedding of the one or more bits. | 03-05-2009 |
20090268422 | SCALABLE ELECTRONIC PACKAGE ASSEMBLY FOR MEMORY DEVICES AND OTHER TERMINATED BUS STRUCTURES - A scalable electronic package assembly for memory devices and other terminated bus structures is disclosed. The scalable electronic package assembly includes a first electronic carrier and a second electronic carrier. The first electronic carrier includes a first set of electronic devices controlled by a controller. The second electronic carrier includes a second set of electronic devices that are also controlled by the controller on the first electronic carrier. The second electronic carrier is electrically connected to the first electronic carrier via multiple solder columns. The second electronic carrier is physically stacked on top of the first electronic carrier via an insulator. | 10-29-2009 |
20110295543 | PERFORMANCE IMPROVEMENT FOR A MULTI-CHIP SYSTEM VIA KERF AREA INTERCONNECT - A semiconductor wafer comprises a first chip and a second chip, each chip comprising a core, link layer and physical layer. A kerf area physically connects the two chips on the wafer, and a kerf area interconnect selectively couples the link layers of the two chips while the two physical layers are disabled. | 12-01-2011 |
20130015502 | STRUCTURE AND METHOD FOR FORMING A LIGHT DETECTING DIODE AND A LIGHT EMITTING DIODE ON A SILICON-ON-INSULATOR WAFER BACKSIDEAANM Fox; Benjamin A.AACI RochesterAAST MNAACO USAAGP Fox; Benjamin A. Rochester MN USAANM Gibbs; Nathaniel J.AACI Iowa CityAAST IAAACO USAAGP Gibbs; Nathaniel J. Iowa City IA USAANM Maki; Andrew B.AACI RochesterAAST MNAACO USAAGP Maki; Andrew B. Rochester MN USAANM Onsongo; David M.AACI AustinAAST TXAACO USAAGP Onsongo; David M. Austin TX USAANM Timpane; Trevor J.AACI RochesterAAST MNAACO USAAGP Timpane; Trevor J. Rochester MN US - A structure and method for fabricating a light emitting diode and a light detecting diode on a silicon-on-insulator (SOI) wafer is provided. Specifically, the structure and method involves forming a light emitting diode and light detecting diode on the SOI wafer's backside and utilizing a deep trench formed in the wafer as an alignment marker. The alignment marker can be detected by x-ray diffraction, reflectivity, or diffraction grating techniques. Moreover, the alignment marker can be utilized to pattern openings and perform ion implantation to create p-n junctions for the light emitting diode and light detecting diode. By utilizing the SOI wafer's backside, the structure and method increases the number of light emitting diodes and light detecting diodes that can be formed on a SOI wafer, enables an increase in overall device density for an integrated circuit, and reduces attenuation of light signals being emitted and detected by the diodes. | 01-17-2013 |