Patent application number | Description | Published |
20090304562 | Radical Sterilization Apparatus - [Problems] To provide a radical sterilization apparatus which can generate hydroxy (OH) radical and oxygen (O) radical at a high density to thereby surely and economically sterilize a subject to be treated. | 12-10-2009 |
20090317295 | Sterilizer and Sterilization Method Using the Same - It is intended to provide a sterilizer, which aim is at efficiently sterilizing a subject such as a container by using active oxygen generated with the use of plasma, and a sterilization method using the same. In particular, it is intended to develop a technique for stably generating active oxygen with the use of plasma and thus provide a sterilizer, which enables, if necessary, stable plasma formation and active oxygen generation in the atmosphere and can inhibit thermal damages caused by the plasma on a subject to be sterilized, and a sterilization method using the same. A sterilizer wherein a gas ( | 12-24-2009 |
20100209292 | PLASMA STERILIZING DEVICE AND METHOD - Provided are a plasma sterilizing device and a method for generating a plasma in an elongated thin tube constituting a sterilizing object, and performing the sterilizing treatment of the interior of the elongated thin tube. The plasma sterilizing device and a method can sterilize even an elongated thin tube of an internal diameter of 5 mm or less efficiently, can prevent the inner wall of the elongated thin tube from being damaged, can suppress the danger of a secondary infection, and can suppress the contamination of the elongated thin tube by the sputtering of an electrode. The plasma sterilizing device comprises a container ( | 08-19-2010 |
20110079582 | PLASMA GENERATING DEVICE AND METHOD - An object of the invention is to provide a plasma generating device and method for generating plasma through electrodeless discharge within a long tubule and carrying out a plasma process on the inside of the long tubule. The plasma generating device has a container | 04-07-2011 |
20140328728 | PLASMA GENERATION DEVICE - There is provided a plasma generation device capable of suppressing arc discharge in which discharge is localized to cause a high temperature, and allowing atmospheric discharge plasma to be stably generated with a high generation efficiency in a low temperature at about a room temperature without being spatially biased. The plasma generation device arranged with a plurality of electrodes facing each other includes a discharge position control unit, which is arranged between each of the plurality of electrodes, and is formed by containing an inverse characteristic material composed of a fluid having polarizability and a property that dielectric constant decreases with an increase in temperature, in a container formed of a dielectric material, wherein the inverse characteristic material is spaced apart from each of the plurality of electrodes. | 11-06-2014 |
Patent application number | Description | Published |
20110033381 | MOLECULAR PROBE FOR IMAGING OF PANCREATIC ISLET AND THE PRECURSOR, AND USE OF THE SAME - A precursor of molecular probe for imaging of pancreatic islets is provided. A polypeptide represented by any one of the following formulae (1) to (4), or a polypeptide having a homology with the foregoing polypeptide. | 02-10-2011 |
20110059483 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - To provide a molecular probe for imaging of pancreatic islets. A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe includes any one of the following polypeptides; polypeptides represented by the following formulae (1), (5), and (9); and polypeptides having homology with the foregoing polypeptides; | 03-10-2011 |
20110081663 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - A molecular probe for imaging of pancreatic islets is provided. The molecular probe includes a polypeptide represented by the following formula (1), or a polypeptide that has a homology with the foregoing polypeptide. | 04-07-2011 |
20110171129 | Molecular Probe Precursor for Imaging of Pancreatic Islet, and Use Thereof - A precursor of a molecular probe for imaging of pancreatic islets is provided. The precursor includes a polypeptide represented by any one of the following formulae (1) to (12), or a polypeptide having a homology with the foregoing polypeptide: | 07-14-2011 |
20110206605 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe comprises a polypeptide represented by the following formula (1), (2), or (3), or a polypeptide having homology with the foregoing polypeptide, | 08-25-2011 |
20120087863 | Peptide Derivative and Use of the Same - A new peptide derivative is provided. The peptide derivative is represented by the following general formula (I), | 04-12-2012 |
20120107239 | Precursor of Molecular Probe for Pancreatic Islet Imaging and Use of the Same - A precursor of a molecular probe for imaging of pancreatic islets is a compound expressed as the following formula (I): | 05-03-2012 |
20130052132 | Method for Producing Radioactively Labeled Polypeptide - The present invention relates to a method for producing a polypeptide. The method includes labeling a molecular probe precursor represented by an amino acid sequence of the formula (1) using a labeling compound capable of labeling a lysine or lysine derivative: | 02-28-2013 |
20140127128 | Molecular Probe for Imaging of Pancreatic Islets and Use of the Same - To provide a molecular probe for imaging of pancreatic islets. A molecular probe for use in imaging of pancreatic islets is provided. The molecular probe includes any one of the following polypeptides: polypeptides represented by the following formulae (1), (5), and (9); and polypeptides having homology with the foregoing polypeptides: | 05-08-2014 |
20150231284 | MOLECULAR PROBE FOR IMAGING OF PANCREATIC ISLET AND THE PRECURSOR, AND USE OF THE SAME - A precursor of molecular probe for imaging of pancreatic islets is provided. A polypeptide represented by any one of the following formulae (1) to (4), or a polypeptide having a homology with the foregoing polypeptide. | 08-20-2015 |
20150352233 | Polypeptide and Imaging Method - A peptide that can be used as an imaging probe for GLP-1R is provided. In an embodiment, a polypeptide is represented by the following formula (3); | 12-10-2015 |
Patent application number | Description | Published |
20080247748 | POSITION CONTROLLER, DRIVING MECHANISM AND IMAGE PICKUP SYSTEM - In a position controller, a driving mechanism and an image pickup system according to the present invention, an operation of controlling a position of a movable member is performed by using, as a reference value, a first resistance value giving a first change point at which a resistance change rate per unit temperature change in a shape-memory-alloy member changes from a first rate to a second rate different from said first rate. Thus, the present invention makes it possible to control the position of the movable member based on a resistance of a shape-memory-alloy member, without a position sensor. | 10-09-2008 |
20080282696 | DRIVE APPARATUS AND LENS DRIVE APPARATUS - A drive apparatus having: a shape memory alloy having a property such that a temperature transformation sensitivity in a temperature range from a starting point of austenite transformation (As) at a predetermined stress to an end point of austenite (Af) is higher than a temperature transformation sensitivity in other temperature range, and a temperature transformation sensitivity in a temperature range from a starting point of martensite transformation (Ms) at a predetermined stress to an end point of martensite transformation (Mf) is higher than a temperature transformation sensitivity in other temperature range; and a driven member which is moved by a transformation of the shape memory alloy; wherein the driven member is moved in a temperature range of higher temperature transformation sensitivity. | 11-20-2008 |
20110176047 | DRIVING DEVICE AND IMAGING DEVICE - Provided is a driving device having a rod-like terminal capable of stably fixing an SMA and connecting a conductive member without preventing the size of the driving device from being reduced and affecting the performance of the SMA. Also provided is an imaging device. The driving device is equipped with a string-shaped shape-memory alloy as a driving source and includes: a base member serving as the base of the driving device; and the rod-like terminal made of a metal penetrating the base member and secured to the base member. One end side of the rod-like terminal is caulked to interpose and hold the shape-memory alloy, and the other end side of the rod-like terminal has a crimp portion where the conductive member for supplying current to the shape-memory alloy is crimped and fixed. | 07-21-2011 |
20110242398 | SHAPE MEMORY ALLOY ACTUATOR DRIVE DEVICE AND METHOD, AND IMAGING DEVICE USING THE SAME - A driving circuit ( | 10-06-2011 |
20130329438 | ILLUMINATION DEVICE - An illumination device includes: a sheet-shaped, flexible illumination panel including on its surface a light emitting face being configured to emit light when supplied with electrical power; a main body including a mounting face whereon the illumination panel is to be mounted; and an installation cover to be installed on the main body and including a pressing region pressing the light emitting face of the illumination panel against the mounting face of the main body. With the illumination device, it is possible to achieve desired light distribution characteristics of the sheet-shaped illumination panel. | 12-12-2013 |
20140327359 | Illumination Apparatus and Light Emitting Module - An illumination apparatus includes: a plurality of light emitting modules connected in series; a constant current source; and a fault detection circuit for detecting that the plurality of light emitting modules have at least one thereof with a short circuit fault. The light emitting module includes: an organic EL panel; a threshold value detection circuit configured to output a constant voltage when the organic EL panel between its anode and cathode has a potential difference equal to or larger than a threshold value; and a VI conversion circuit receiving the constant voltage from the threshold value detection circuit, converting the constant voltage into a constant current, and outputting the constant current. The fault detection circuit detects whether the plurality of light emitting modules have a short circuit fault based on a total value of the constant current output from each light emitting module. | 11-06-2014 |
20140347857 | LIGHTING APPARATUS - A lighting apparatus may include a holding member, a lighting panel, and an attachment bracket for removably attaching the lighting panel to the holding member. The lighting panel may form a first position in which a light-emitting surface of the lighting panel and a light-emitting surface of a lighting panel are located substantially on the same plane with each other and a second position in which the lighting panel is pressed from its light-emitting surface side so that the attachment bracket pivots around a portion where the attachment bracket is attached to the holding member and the lighting panel is inclined with respect to the lighting panel. As the lighting panel forming the second position is moved in a direction away from the holding member, the attachment bracket is released from the holding member, and the lighting panel forming the second position is readily removed from the holding member. | 11-27-2014 |
20150228698 | PORTABLE INFORMATION APPLIANCE - An object of the present invention is to provide a portable information appliance having a thin organic electroluminescent illumination panel capable of color adjustment and uniform light emission. | 08-13-2015 |
20150280152 | LUMINESCENT DEVICE AND METHOD OF MANUFACTURING THE SAME - A luminescent device that has at least an anode layer ( | 10-01-2015 |
Patent application number | Description | Published |
20130184377 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group. | 07-18-2013 |
20150291861 | PHENOLIC-HYDROXYL-CONTAINING RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, SUBSTANCE OBTAINED BY CURING SAME, AND SEMICONDUCTOR SEALANT - Provided are a phenolic-hydroxyl containing resin, an epoxy resin, and a curable resin composition containing either resin that have high flowability and exhibit high heat resistance and flame retardancy after curing, a cured composition formed therefrom, and a sealant. A phenolic-hydroxyl containing resin is prepared by reacting a polycondensate of a phenolic compound (a) and formaldehyde with an aralkylating agent. The phenolic-hydroxyl containing resin contains as essential components a monoaralkylated derivative (x1) of the phenolic compound (a) having one aralkyl group on an aromatic nucleus thereof and a diaralkylated derivative (x2) of the phenolic compound (a) having two aralkyl groups on an aromatic nucleus thereof. An epoxy resin is prepared by converting the phenolic-hydroxyl containing resin into a polyglycidyl ether. | 10-15-2015 |
Patent application number | Description | Published |
20140138706 | ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPONENT - An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole. | 05-22-2014 |
20140291825 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip. | 10-02-2014 |
20150115718 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit. | 04-30-2015 |
20150289356 | POWER MODULE - In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin. | 10-08-2015 |
20160049358 | ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPONENT - An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole. | 02-18-2016 |
Patent application number | Description | Published |
20140127382 | GALLATE-TYPE CATECHIN-CONTAINING DRINK - A drink contains (a) gallate-type catechin, (b) collagen having an average molecular weight of 4000 or more, and (c) at least one thickening and stabilizing agent selected from water-soluble soy fiber, gum arabic, pectin, carrageenan, tamarind seed gum, psyllium seed gum, ghatti gum, alginic acid and a salt thereof, polyglutamic acid and a salt thereof, and carboxymethylcellulose, in which the contents (Unit: wt %) [A], [B], and [C] of the components (a), (b), and (c) are in the ranges satisfying the following expressions; i) 0.06≦[A]≦0.6; 3.0≦([B]/[A])≦20.0; and ([C]/[A])≧0.4. | 05-08-2014 |
20160089332 | GEL-LIKE COMPOSITION HAVING HIGH UBIQUINOL CONTENT - This invention relates to a gel-like composition in which ubiquinol is dispersed and stabilized in a gel and which contains 0.2 to 5% by weight of ubiquinol, 5 to 15% by weight of gelatin, 55 to 80% by weight of carbohydrate and/or water-soluble dietary fiber, and 9 to 18% by weight of water, and further contains ascorbic acid and/or gallate type catechin. | 03-31-2016 |
Patent application number | Description | Published |
20120080786 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board. | 04-05-2012 |
20120175754 | WIRING BOARD - A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component. | 07-12-2012 |
20120181708 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 07-19-2012 |
20140162411 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 06-12-2014 |
20140284820 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 09-25-2014 |
20150216049 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane. | 07-30-2015 |
20150245485 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a first insulating layer, a first conductor layer formed on a surface of the first insulating layer and including first pads, and a wiring structure including a second conductor layer formed on the first insulating layer, a second insulating layer laminated on the second conductor layer, a third conductor layer formed on the second insulating layer, and formed through the second insulating layer. The second conductor layer includes second pads formed on the first insulating layer, the third conductor layer includes third pads formed on the second insulating layer, the via conductors are positioned such that the via conductors are connecting the second pads and the third conductor layer, and the wiring structure is formed such that the second conductor layer and third conductor layer are not electrically connected to the first conductor layer. | 08-27-2015 |
20150255359 | ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board. | 09-10-2015 |
20160037629 | PRINTED WIRING BOARD - A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer. | 02-04-2016 |
20160066423 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer including insulating material, and a conductor layer formed on a surface of the insulating layer and including conductor pads and conductor patterns such that the conductor pads are positioned to connect one or more electronic components and that the conductor patterns are formed between the conductor pads. The conductor patterns are formed such that each conductor pattern has a pattern width of 3 μm or less and that the conductor patterns have a pattern interval of 3 μm or less between adjacent conductor patterns, and the insulating layer has recess portions formed on the surface between the conductor patterns at least along the conductor patterns such that the recess portions have a depth in a range of 0.1 μm to 2.0 μm relative to a contact interface at which the conductor patterns and the insulating layer are in contact with each other. | 03-03-2016 |
Patent application number | Description | Published |
20090022633 | CATALYTIC CONVERTER, HOLDING MATERIAL FOR CATALYTIC CONVERTER AND PRODUCTION METHOD THEREOF - The present invention relates to a holding material for a catalytic converter including a catalyst carrier, a metal casing for receiving the catalyst carrier, and the holding material wound around the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, the holding material including a low thermal conductivity layer, in which the low thermal conductivity layer includes: a molded material containing an inorganic powder; or a composite material of a porous substrate with an aerogel. | 01-22-2009 |
20090041638 | Catalytic converter, holding material for catalytic converter and production method thereof - The present invention relates to a holding material for a catalytic converter including a catalyst carrier, a metal casing for receiving the catalyst carrier, and the holding material wound around the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, the holding material having a plurality of high-density sites which are spaced apart from one another in the holding material, each site having a higher density than sites of the holding material in which the higher density sites are not provided. | 02-12-2009 |
20100143212 | HOLDING MATERIAL FOR CATALYTIC CONVERTER, METHOD FOR PRODUCING THE SAME, AND CATALYTIC CONVERTER - The present invention relates to a holding material for a catalytic converter including a catalyst carrier having an elliptical cross section, a metal casing for receiving the catalyst carrier, and the holding material mounted on the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, in which the holding material has a first portion and a second portion, and the first portion in contact with a region of the catalyst carrier, corresponding to 40 to 95% of a major axis centering on an intersection of an ellipse and a minor axis in the elliptical cross section of the catalyst carrier, is larger than the second portion in contact with any other region of the catalyst carrier in basis weight. | 06-10-2010 |
20120313282 | HOLDING MATERIAL FOR CATALYST CONVERTER AND MANUFACTURING METHOD OF SAME - The present invention relates to a holding material for a catalyst converter, where the catalyst converter contains a catalyst carrier having a cross-section of a flattened shape, a metal casing to which the catalyst carrier is received, and the holding material attached to the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, in which the holding material has a first part positioned in a minor axis direction of a cross-section of the catalyst carrier and having a high basis weight, a second part positioned in a major axis direction of the cross-section of the catalyst carrier and having a low basis weight, and a third part having a basis weight gradually decreased toward the second part from the first part. | 12-13-2012 |
20150033714 | HOLDING MATERIAL FOR GAS TREATMENT DEVICE, GAS TREATMENT DEVICE, AND PRODUCTION PROCESSES THEREFOR - Provided are a holding material for a gas treatment device, which is inexpensive, has a simple structure, and exhibits high holding force, a gas treatment device, and a method for manufacturing the same. A holding material for a gas treatment device according to the present invention is a holding material, which is a holding material to be arranged, in a gas treatment device including a treatment structure and a casing for housing the treatment structure, between the treatment structure and the casing, the holding material including silica fibers and an alumina sol in an amount of 3 parts by mass or more in terms of a solid content with respect to 100 parts by mass of the silica fibers. | 02-05-2015 |
20150038320 | INORGANIC FIBER AND PROCESS FOR MANUFACTURING SAME - Provided is a method for producing inorganic fiber including: preparing a spinning raw material liquid which comprises an aluminum source, a calcium source, a silicon source and a spinning auxiliary, in which the content of the spinning auxiliary is, in terms of solid matter, 3 parts by mass or more relative to 100 parts by mass of the total of the aluminum source, the calcium source and the silicon source; spinning the spinning raw material liquid by a sol-gel method to obtain crude inorganic fiber; and firing the crude inorganic fiber to produce inorganic fiber that comprises 35 mass % to 88 mass % of Al | 02-05-2015 |
20150210598 | INORGANIC FIBERS AND MOLDED BODY USING THE SAME - Inorganic fibers including 43.2 to 53.0 mol % of Al | 07-30-2015 |
Patent application number | Description | Published |
20090134556 | LIQUID ENCLOSING TYPE VIBRATION ISOLATING APPARATUS - To provide a liquid enclosing type vibration isolating apparatus capable of achieving two resonance characteristics by one orifice path, in a liquid enclosing type vibration isolating apparatus including a main liquid chamber a portion of a chamber wall of which is constituted by a vibration isolating base member, an auxiliary liquid chamber a portion of a chamber wall of which is constituted by a first diaphragm | 05-28-2009 |
20100213652 | FLUID-FILLED VIBRATION DAMPING DEVICE - A fluid-filled vibration damping device including: a pressure-receiving chamber and an equilibrium chamber disposed on either side of a partition plate, while being connected through a first orifice passage; a moveable film arranged to either a pressure-receiving chamber side or an equilibrium chamber side of the partition plate while being spaced away therefrom to define therebetween an intermediate chamber; a second orifice passage connecting the intermediate chamber and one of the pressure-receiving and the equilibrium chambers while being tuned to higher frequency than the first orifice passage; and a flow straightening plate arranged in opposition to the moveable film at least at one of the intermediate chamber side and an opposite side thereof, the flow straightening plate having a plurality of flow straightening apertures opening towards the moveable film and furnished with a flow limiting member. | 08-26-2010 |
20140367546 | VIBRATION DAMPING DEVICE - A vibration damping device including: an inner shaft member; a main rubber elastic body fixed to an outer circumference surface of the inner shaft member; and an outer bracket attached to an outer circumference surface of the main rubber elastic body. At least one locking projection formed to an inner circumference surface on a bracket main unit provided to the outer bracket is inserted and locked in a circumference direction in at least one locking groove formed on the outer circumference surface of the main rubber elastic body. The main rubber elastic body is held between axially opposed surfaces of an abutting protruding part formed on one axial end of the bracket main unit and a retaining protruding part formed on a press fit metal fitting press fit and fixed to another axial end of the bracket main unit. | 12-18-2014 |
20140367547 | ENGINE MOUNT AND POWER UNIT VIBRATION DAMPING SUPPORT STRUCTURE - An engine mount for use in a power unit vibration damping support structure configured to be mounted on a transmission side in a state without a distributed support load of a weight of the power unit being applied, the engine mount including: an inner shaft member; an outer tube member arranged separated to an outer circumference side of the inner shaft member; and a main rubber elastic body fixed to the inner shaft member while being attached to the outer tube member non-adhesively such that the inner shaft member and the outer tube member are elastically connected by the main rubber elastic body, wherein the outer tube member is configured to be attached to the power unit, and the inner shaft member is configured to be attached to a vehicle body. | 12-18-2014 |