Patent application number | Description | Published |
20090173522 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring. | 07-09-2009 |
20090175023 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring. | 07-09-2009 |
20100078205 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole. | 04-01-2010 |
20100078213 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections. | 04-01-2010 |
20100108371 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component in which an electronic component is flip-chip mounted to be built in, including a conductive-pattern layer, a connection terminal formed in the conductive-pattern layer and electrically connected to the electronic component, and a solder resist layer formed on the conductive-pattern layer. The solder resist layer is formed around the connection terminal on the conductive-pattern layer, but it is not formed in at least part of the other region on the conductive-pattern layer. | 05-06-2010 |
20100236822 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board is formed with a substrate, conductive patterns laminated in the thickness direction of the substrate, multiple pads having a predetermined pitch and formed on the same layer as the conductive patterns, a conductive bonding layer arranged on each of the multiple pads, and an electronic component having electrodes. Here, the electronic component is arranged inside the substrate. The electrodes of the electronic component and the multiple pads are electrically connected to each other by means of bonding layers. Also, the height of each of the multiple pads is greater than the height of the conductive pattern adjacent to each pad. Moreover, a protective material related to the bonding layers is not formed at least on the layer where the pads and the first conductive patterns are formed. | 09-23-2010 |
20110240357 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer. | 10-06-2011 |
20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
20120018198 | ELECTRONIC COMPONENT AND PRINTED WIRING BOARD - An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, a resin filler filling the space inside the trench portion lined by the upper electrode, an insulation layer formed on the surface of the substrate, a conductive portion formed on the insulation layer and positioned to cover the trench portion, and a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode. | 01-26-2012 |
20120032335 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion. | 02-09-2012 |
20120080786 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board. | 04-05-2012 |
20120142147 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole. | 06-07-2012 |
20120175754 | WIRING BOARD - A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component. | 07-12-2012 |
20120181708 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 07-19-2012 |
20120199389 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections. | 08-09-2012 |
20120228012 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and having a terminal, a conductive pattern formed on the second surface of the insulation layer and electrically connected to the terminal, and an insulative film formed on the second surface of the insulation layer and on the conductive pattern. The terminal of the electronic component has a protruding portion which protrudes from the second surface of the insulation layer. | 09-13-2012 |
20120247818 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, and a through-hole conductor connecting the first and second conductive layers. The substrate has an insulation structure and a metal layer, the metal layer has opening through which the conductor passes and has side wall recessed into the metal layer and forming the opening, the structure has first resin layer on one side of the metal layer, second resin layer on the opposite side and filler filling the opening, the conductor has first portion in the first layer and second portion in the second layer, the first and second portions are connected in the filler, the first portion is tapered from the first toward second conductive layers, and the second portion is tapered from the second toward first conductive layers. | 10-04-2012 |
20120287586 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 11-15-2012 |
20130081866 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer. | 04-04-2013 |
20130081870 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures. | 04-04-2013 |
20130182401 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. | 07-18-2013 |
20130192883 | PRINTED WIRING BOARD - A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other. | 08-01-2013 |
20130192884 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface. | 08-01-2013 |
20130194764 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 08-01-2013 |
20130215586 | WIRING SUBSTRATE - A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line. | 08-22-2013 |
20130221505 | PRINTED WIRING BOARD - A printed wiring board includes a substrate, a first buildup formed on a first surface of the substrate and including the outermost conductive layer, and a second buildup layer formed on a second surface of the substrate and including the outermost conductive layer. The outermost layer of the first buildup has pads positioned to connect a semiconductor component, the first buildup has a component mounting region directly under the component such that the outermost layer of the first buildup has a portion in the region, the outermost layer of the second buildup has a portion directly under the region, and the portions satisfy the ratio in the range of from 1.1 to 1.35, where the ratio is obtained by dividing a planar area of the portion of the second buildup by a planar area of the portion of the first buildup. | 08-29-2013 |
20130256007 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other. | 10-03-2013 |
20130284506 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a substrate having opening penetrating from first to second surfaces, an electronic component in the opening having first and second electrodes, a first insulation layer over the first surface, a second insulation layer over the second surface, a first via conductor in the first layer having bottom connected to the first electrode, a second via conductor in the first layer having bottom connected to the second electrode, a third via conductor in the second layer having bottom connected to the first electrode, and a fourth via conductor in the second layer having bottom connected to the second electrode. The first conductor is longer than the third conductor and has the bottom having greater width than the bottom of the third conductor, and the second conductor is longer than the fourth conductor and has the bottom having greater width than the bottom of the fourth conductor. | 10-31-2013 |
20140014399 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %. | 01-16-2014 |
20140042602 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less. | 02-13-2014 |
20140118976 | PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT - A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer. | 05-01-2014 |
20140133119 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the fist substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate. | 05-15-2014 |
20140153205 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 06-05-2014 |
20140162411 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 06-12-2014 |
20140216800 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode. | 08-07-2014 |
20140247571 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole. | 09-04-2014 |
20140284820 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 09-25-2014 |
20150022982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component. | 01-22-2015 |