Koyanagi, Tokyo
Asuka Koyanagi, Tokyo JP
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20100272989 | ELASTOMER POROUS MATERIAL AND METHOD OF PRODUCING THE SAME - In the elastomer porous material of the invention, when cells in a first observation region of a first cross section are observed at a certain magnification, cells having a shape factor SF1, which indicates the roundness of a circle and is represented by the following formula: | 10-28-2010 |
20100311851 | ELASTOMER POROUS MATERIAL AND METHOD OF PRODUCING THE SAME - In the elastomer porous material of the invention, when cells in a first observation region of a first cross section are observed at a certain magnification, cells having an aspect ratio a/b, wherein a represents the maximum diameter of each cell and b represents the length of the minor axis of that cell as measured in a direction orthogonal thereto, of 1.3 or less account for 70% or more of all cells in the first observation region, and, when cells in a second observation region of a second cross section orthogonal to the first cross section are observed at a certain magnification, cells having an aspect ratio a/b, wherein a represents the maximum diameter of each cell and b represents the length of the minor axis of that cell as measured in a direction orthogonal thereto, of 1.3 or less account for 70% or more of all cells in the second observation region. | 12-09-2010 |
Atsushi Koyanagi, Tokyo JP
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20100084727 | PRINTED WIRING BOARD, A METHOD OF MANUFACTURING PRINTED WIRING BOARD, A SENSOR MODULE, AND A SENSING DEVICE - A printed wiring board on which a package to be arranged, including: a first layer that is relatively rigid; and a second layer that is relatively flexible and on which the package is to be soldered, wherein an area other than a package arrangement area of the second layer is joined to the first layer by an adhesion layer. | 04-08-2010 |
20130242365 | SCANNING DISPLAY DEVICE AND SPECKLE REDUCTION METHOD - A scanning display device includes: a light source section including at least one light source configured to emitting coherent light; a light scanning section including: a scan mirror configured to reflect the light originated from the light source section and scan over a screen; and a turning section configured to turn the scan mirror; a depolarizer having outgoing polarized light distribution in which a state of polarization of outgoing light consecutively changes within an element plane, wherein: the depolarizer is placed in an optical path along which the light emitted by the light source section reaches the screen; and the state of polarization of the light is changed, thereby scanning the screen with light that has a polarized light distribution, in which the state of polarization consecutively changes, in a beam diameter. | 09-19-2013 |
Haruki Koyanagi, Tokyo JP
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20140294386 | OPTICAL TRANSMITTING APPARATUS AND OPTICAL RECEIVING APPARATUS - An optical transmitting apparatus includes semiconductor laser elements. Upon receiving laser beams, a multiplexed beam is emitted from a wavelength multiplexing filter. The wavelength multiplexing filter includes a triangular prism and a wavelength multiplexing filter film. A front end face and a rear end face of the prism are not parallel to each other so that a prism angle at which a surface parallel to the front end face intersects a surface parallel to the rear end face, is an acute angle. The prism angle is the angle at which the laser beam impinging from the front end face into the triangular prism is reflected by the wavelength multiplexing filter film toward the front end face and the multiplexed beam is directed to the optical axis side of the optical fiber. | 10-02-2014 |
Hiroo Koyanagi, Tokyo JP
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20080286688 | Photosensitive Resin Composition and Cured Product Thereof - [PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof. | 11-20-2008 |
20080306180 | Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof - The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C). | 12-11-2008 |
20090029848 | Process for Producing Microparticulate Hardening Catalyst - A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B). | 01-29-2009 |
20090042126 | Photosensitive resin composition and cured article thereof - A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided. | 02-12-2009 |
20090286087 | Thermosetting Resin Composition and Use thereof - Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance. | 11-19-2009 |
Hitoshi Koyanagi, Tokyo JP
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20100091090 | WIDE-ANGLE IMAGE ACQUIRING METHOD AND WIDE-ANGLE STEREO CAMERA DEVICE - Epipolar lines of first and second images are made consistent with each other in a paralleling step, so that it has the advantages (1) and (2) as set forth in the background section. Further, distortions of the first and second images are corrected in a correcting step, and, even if characters conversion is carried out, it can avoid excessively reduction of central portions in the first and second images or excessively enlargement of side edge portions. Thus, while maintaining of the above mentioned advantages (1) and (2), wide angle image acquiring method and a wide angle stereo camera device which make three-dimensional space holding possible can be provided. | 04-15-2010 |
20130003101 | IMAGE FORMING SYSTEM, CONTROLLER AND RASTERIZATION ACCELERATOR - An image forming system comprising: a controller, provided with a list creation means to create a display list by analyzing PDL data decompression means to decompress compressed image data, a drawing means to execute drawing based on the image data, and a print data creation means to create the print data based on the image data for sending the print data to a printer; and a rasterization accelerator, provided with a second drawing means to execute drawing processing based on the display list, and a compression means to compress the image data drawn by the second drawing unit, for sending the image data to the controller, wherein the rasterization accelerator comprises determination means for determining, based on the information of the display list, whether to execute or not the compression of the image data, and a compression method in case of executing the compression. | 01-03-2013 |
20130027735 | IMAGE FORMING APPARATUS, ACCELERATOR AND IMAGE FORMING METHOD - Disclosed is an image forming apparatus that makes it possible to suppress the scale enlargement of the electric circuit, so as to make the apparatus highly flexible. The apparatus forms an image based on image data acquired by applying a rendering operation to depiction commands and includes: a converting section to convert input data to the depiction commands; a first rendering section to apply the rendering operation to a first depiction command; a second rendering section to apply the rendering operation to a second depiction command; a reading section to read out first information from the storage section; a determining section to determine whether the first rendering section or the second rendering section should apply the rendering operation to each of the depiction commands; and a control, section to make either the first rendering section or the second rendering section apply the rendering operation to each of the depiction commands. | 01-31-2013 |
Kaoru Koyanagi, Tokyo JP
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20110175443 | ALTERNATING CURRENT AUTONOMOUS DISTRIBUTED AC POWER SYSTEM - The objective of this invention is to provide an autonomous distributed electric power system without depending on a known electric power system. In order to achieve such objective, this invention proposes a following feature: Output frequencies of autonomous grid-connection inverters ( | 07-21-2011 |
Kazuyuki Koyanagi, Tokyo JP
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20150234770 | ELECTRONIC DEVICE, COMMUNICATION SYSTEM, AND HOT-PLUG CONTROL METHOD - This electronic device includes connector to which an external device is connected via a communication cable, controller, and output unit. Connector includes at least first and second pins. A predetermined voltage is supplied from the external device to the first pin. Controller includes a communication unit to which a signal is input from the external device via a pin other than the first and second pins of connector, and outputs, when the communication unit is in an activated state, a first signal indicating the activated state. Output unit outputs, when the first signal has not been output, a detection signal indicating that a connection has not been established with the external device to the external device via the second pin. | 08-20-2015 |
Keiji Koyanagi, Tokyo JP
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20100183117 | X-RAY GENERATING APPARATUS AND X-RAY CT APPARATUS USING THE SAME - There are provided an X-ray generating apparatus capable of switching X-ray beams of high energy and low energy to each other at high speed, and an X-ray CT apparatus capable of performing high-speed and high-quality multi-energy imaging by using the same. The X-ray generating apparatus is constructed by an X-ray tube | 07-22-2010 |
Kenichi Koyanagi, Tokyo JP
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20130285202 | SEMICONDUCTOR DEVICE - To provide a semiconductor device including a capacitor which includes a cylindrical or columnar lower electrode, a support film in contact with the upper portion of the lower electrode for supporting the lower electrode, a dielectric film covering the lower electrode and the support film, and an upper electrode facing the lower electrode with the dielectric film interposed therebetween, wherein the dielectric film has a first thickness on the upper surface of the support film and a second thickness thinner than the first thickness on the side surface of the lower electrode, and thereby the mechanical strength of the support film is increased. | 10-31-2013 |
Kimiyuki Koyanagi, Tokyo JP
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20120205983 | THREE-LEVEL POWER CONVERSION APPARATUS - Wiring between semiconductor modules and a direct current power supply circuit, which construct a three-level power conversion apparatus, is made to be low inductance, so that reduction in size and cost can be attained easily. | 08-16-2012 |
20150085549 | POWER CONVERSION APPARATUS - A power conversion apparatus includes a first power conversion circuit including a first switching element, a second power conversion circuit including a second switching element, a DC conductor which is provided in the first power conversion circuit and supplies a DC power to the first power conversion circuit, and a connection conductor which is provided in the first power conversion circuit, has a length having an inductance for inhibiting a flow of a ripple current caused by switching of the second switching element of the second power conversion circuit, and connects the DC conductor and the second power conversion circuit. | 03-26-2015 |
Masaaki Koyanagi, Tokyo JP
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20110302032 | CONTENT RECOMMENDATION DEVICE AND CONTENT RECOMMENDATION METHOD - A content recommendation device includes: a use information storage section storing types of information related to use as information related to use of content by a user; a recommended content deciding section deciding content to be recommended to the user in accordance with each of the types of information related to use as a recommended content, and deciding types of recommended content items corresponding to the types of information related to use; a switching rule storage section storing a switching rule setting a period for switching the type of the recommended content as a rule set by a regional manager who is in charge of selling content in a specific region; a selection section selecting one type of the recommended content among the types of recommended content items when a recommended content suggestion request is generated from a terminal of the user residing in the specific region, and sequentially selecting different types of content after the period set by the switching rule; and a recommended information providing section providing information representing the recommended content selected by the selection section for the terminal of the user. | 12-08-2011 |
20110302240 | CONTENT RECOMMENDATION SYSTEM, CONTENT RECOMMENDATION DEVICE, AND CONTENT RECOMMENDATION METHOD - A content recommendation system includes: a client terminal operated by a user; and a content recommendation server that recommends content to the terminal through a network and includes a preference discrimination information storage section accumulating and storing preference discrimination information in which information related to evaluation of content input to the terminal by a user and identification information of the user are associated with each other, a content feature information storage section storing content feature information in which data indicating features of content are associated with identification information of content, a preference information creation section creating preference information of each user by integrating evaluation for content with the feature of the content for each user based on the preference discrimination information and the content feature information, and a recommended content list providing section transmitting a list of recommended content, extracted by evaluating the degree of similarity of features with the preference information based on the content feature information, to the terminal. | 12-08-2011 |
20120254428 | SERVER DEVICE AND SERVICE PROVISION METHOD - A server device is provided, which includes a reception unit receiving device identification information of a client device and user identification information of a user of the client device from the client device; a device determination unit determining whether or not it is possible to grant the user authorization to use a service on the basis of the device identification information; a user determination unit determining whether or not it is possible to grant the user the authorization to use on the basis of the user identification information; and a transmission unit transmitting information on the authorizable services of the services, for which it is determined that it is possible to grant the user the authorization to use on the basis of the device identification information and the user identification information, to the client device. | 10-04-2012 |
Masaru Koyanagi, Tokyo JP
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20090051020 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A semiconductor memory device includes: A method of manufacturing a semiconductor device, wherein a semiconductor chip is mounted on a lead frame including a plurality of lead lines, and terminals included in the semiconductor chip are connected to the lead lines, thereby to manufacture the semiconductor device, comprising the steps of: | 02-26-2009 |
20090161427 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive. | 06-25-2009 |
20100309733 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device is provided, which includes an input buffer provided with a first inverter that can electrically adjust circuit threshold values, a circuit: threshold value monitor provided with a second inverter having the same circuit configuration as the first inverter to detect the circuit threshold values of the first inverter when the input and output of the second inverter are short-circuited, respectively, a memory storing parameter values that correspond to the circuit threshold values detected by the circuit threshold value monitor, and a data-reader circuit reading the parameter values given to the first inverter from the memory. | 12-09-2010 |
20110128063 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first and second level shift circuits. The first level shifter includes a plurality of transistors and is connected to a power source voltage supply node of a first power source system and to which a first signal of a second power source system and a level inversion signal of the first signal are input. The second level shifter includes a plurality of transistors and is connected to the power source voltage supply node of the first power source system and to which the level inversion signal of the first signal of the second power source system and an output signal of the first level shifter are input. The first and second level shifters have substantially the same circuit configuration and driving abilities of corresponding ones of the transistors in the first and second level shifters are substantially set equal. | 06-02-2011 |
20110128073 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first to six transistors and a constant current source circuit. The first and second transistors form a current mirror circuit connected to a first power source node. The third and fourth transistors form a differential pair circuit. The third and fourth transistors receive first and second external signals at their gates, respectively. The constant current source circuit has one end connected to source terminals of the third and fourth transistors, and the other end connected to a second power source node. The fifth and sixth transistors form a current pathway between a common gate node of the first and second transistors and the constant current source circuit. The gate of fifth transistor is connected to a signal output node. The gate of sixth transistor receives a signal of logic opposite to a signal to be obtained at the signal output node. | 06-02-2011 |
20110133792 | BUFFER CIRCUIT - A buffer circuit in accordance with an embodiment comprises output transistors connected between a first fixed voltage terminal and an output terminal, and gate control transistors connected between a second fixed voltage terminal and a gate of one of the output transistors or between two of gates of the output transistors. The output transistors are configured to turn on to change a voltage of the output terminal. The gate control transistors are configured to apply a gate voltage to the gates of the output transistors. A gate of each of the gate control transistors is applied with a certain voltage, such that when a source of each of the gate control transistors changes from a first potential to a second potential, a potential difference between the gate and the source attains a threshold voltage or greater, whereby each of the gate control transistors is turned on. | 06-09-2011 |
20120250423 | INPUT CIRCUIT - The first input circuit detects an input signal to output a first output signal having the same phase as the input signal. The second input circuit is configured to detect a first strobe signal to output a second output signal. The third input circuit is configured to detect a second strobe signal as a reversed signal of the first strobe signal to output a third output signal. A data latch circuit includes a first latch circuit and a second latch circuit. It is configured to latch the first output signal in either one of the first latch circuit or the second latch circuit according to the first output signal, the second output signal and the third output signal. It also allows the other one of the first latch circuit or the second latch circuit to input the first output signal thereto. | 10-04-2012 |
20130027108 | LEVEL SHIFT CIRCUIT - According to one embodiment, a level shift circuit includes a plurality of level shift units which are connected to each other and in which the delay time of the rising edge of an output voltage is different from the delay time of the falling edge of the output voltage. The delay time of the rising edge of the output voltage from the previous level shift unit is compensated by the delay time of the falling edge of the output voltage from the next level shift unit, and the delay time of the falling edge of the output voltage from the previous level shift unit is compensated by the delay time of the rising edge of the output voltage from the next level shift unit. | 01-31-2013 |
20130181764 | SEMICONDUCTOR INTEGRATED CIRCUIT - A constant current source circuit includes one end connected to a second node as sources of third and fourth transistors, and the other end connected to a second power supply node that supplies a second voltage different from a first voltage. The clamp circuit is configured to form a current path between the second node and the second power supply node. It adjusts the potential of the second node to a certain potential when a first external input signal is switched from a first state to a second state. | 07-18-2013 |
20130228867 | SEMICONDUCTOR DEVICE PROTECTED FROM ELECTROSTATIC DISCHARGE - According to one embodiment, a semiconductor device includes a first semiconductor chip, at least one second semiconductor chip, a first connector, and a second connector. The first semiconductor chip includes a first input pad, first protection circuit, and first internal circuit. The at least one second semiconductor chip includes a second input pad, second protection circuit, and second internal circuit. The first connector electrically connects the first and second input pads. The second connector connects the first protection circuit and first input pad of the first semiconductor chip. The second protection circuit of the at least one second semiconductor chip is not connected to the second input pad. | 09-05-2013 |
20130242664 | INTERFACE CIRCUIT - According to an embodiment, an interface circuit is provided with an output buffer which generates an output waveform on the basis of the ON/OFF operation of a transistor and a driver circuit which drives the transistor and is capable of independently changing a turn-ON speed and a turn-OFF speed of the transistor. | 09-19-2013 |
20140062587 | SEMICONDUCTOR DEVICE HAVING STACKED CHIPS - According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip. | 03-06-2014 |
20140140152 | SEMICONDUCTOR STORAGE DEVICE AND CONTROL METHOD THEREOF - According to one embodiment, a semiconductor storage device includes a plurality of semiconductor chips and a control unit. The plurality of semiconductor chips is configured to connect to a signal transmission path and is controlled individually by individual chip enable signals. The plurality of semiconductor chips each includes a termination circuit connected to the signal transmission path. When one of the semiconductor chips is selected to input or output data, the control unit activates the termination circuit provided in the semiconductor chip that is not selected based on a first instruction signal and the chip enable signal. | 05-22-2014 |
20140285231 | SEMICONDUCTOR DEVICE AND TRIMMING METHOD FOR THE SAME - According to one embodiment, a semiconductor device includes a termination circuit and a controller. The termination circuit includes a first resistor connected to an external connection terminal, a plurality of first transistors of a first conductive type connected in parallel between the first resistor and a voltage source, a second resistor connected to the external connection terminal, and a plurality of second transistors of a second conductive type connected in parallel between the second resistor and ground. The controller is configured to control switching of the first and second transistors such that a combined resistance value of the first and second resistors and the termination circuit is constant. | 09-25-2014 |
20140285247 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first differential amplifier and a second differential amplifier. The first differential amplifier charges the first output terminal with a second voltage different from a first voltage. The first differential amplifier uses a first clock signal, stopping the charging at the first output terminal, receives first complementary data of the first voltage at the rising edge of a second clock signal, and outputs the first complementary data at the second voltage. The second differential amplifier charges the second output terminal with the second voltage. The second differential amplifier uses a third clock signal, stopping the charging at the second output terminal, receives second complementary data of the first voltage at the rising edge of a fourth clock signal, and outputs the second complementary data at the second voltage. | 09-25-2014 |
20140286091 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a reference voltage generation circuit configured to generate a reference voltage, and a voltage changing circuit configured to generate a second voltage from a first voltage based on a difference between the second voltage and the reference voltage and apply the second voltage to a load capacitance. The reference voltage generation circuit includes a variable current source and a capacitor which are connected in series and is configured to change the reference voltage linearly. | 09-25-2014 |
20150016205 | SEMICONDUCTOR CIRCUIT - A semiconductor circuit includes a first input section into which a first input signal is inputted, a second input section into which a second input signal is inputted, an output generation circuit which is connected to the first and second input sections and generates an output signal based on the input signals, an output section which outputs the output signal, and a current source which is connected to connection nodes between the input sections and the output generation circuit. | 01-15-2015 |
20150070084 | SEMICONDUCTOR DEVICE - A semiconductor device includes an input-part receiving a first voltage and an output-part outputing a second voltage. A current mirror part receives the first voltage. A reference voltage is supplied to a gate of a reference transistor. The reference transistor is electrically connected between the current-mirror part and a ground voltage. A monitor transistor includes a gate electrically connected to the second power-supply voltage, and is electrically connected between the current-mirror part and the ground voltage. A voltage-generation transistor includes a gate electrically connected to both the current-mirror part and the reference transistor. The voltage-generation transistor is electrically connected between the input-part and the output-part. A first capacitor including one end electrically connected to the output-part, and the other end electrically connected to both the current-mirror part and the reference transistor. | 03-12-2015 |
20150078085 | SEMICONDUCTOR DEVICE HAVING STACKED CHIPS - According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip. | 03-19-2015 |
20160036397 | SEMICONDUCTOR AMPLIFIER CIRCUIT - According to one embodiment, a semiconductor amplifier circuit includes: a first amplifier circuit including first and second P-type transistors; a second amplifier circuit including first and second N-type transistors; and first to seventh current mirror circuits. The first and second current mirror circuits are connected to drains of the first and second P-type transistors. The third and fourth current mirror circuits are connected to drains of the first and second N-type transistors. The sixth current mirror circuit is connected to the first, fourth and fifth current mirror circuits. The seventh current mirror circuit is connected to the second, third and fifth current mirror circuits. | 02-04-2016 |
Masashi Koyanagi, Tokyo JP
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20090247250 | PROGRAM, GAME SYSTEM, AND MOVEMENT CONTROL METHOD - A game system receives special command input information input by the player when a moving object and a target have a predetermined positional relationship, and moves the moving object to a position at which bullets fired from the moving object can hit the target irrespective of movement input information when the game system has received the special command input information. | 10-01-2009 |
Motoki Koyanagi, Tokyo JP
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20120137936 | TABLE AND TABLE SYSTEM - A table is used in combination with another table having a circular top plate in a top view. The table comprises a top plate on a top surface of which an article can be placed and a support portion that supports the top plate from a lower surface side of the top plate. At least a part of a peripheral edge of the top plate is provided with a contact portion which is formed into a shape so as to contact a peripheral edge of the circular top plate of another table along a circumferential direction of the circular top plate. | 06-07-2012 |
Motoyoshi Koyanagi, Tokyo JP
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20140014969 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching circuit in the package. Each transistor chip includes a semiconductor substrate having long sides and short sides that are shorter than the long sides, and a gate electrode, a drain electrode and a source electrode on the semiconductor substrate. The gate electrode has gate fingers arranged along the long sides of the semiconductor substrate and a gate pad commonly connected to the gate fingers and connected to the input matching circuit via a first wire. The drain electrode is connected to the output matching circuit via a second wire. The long sides of the semiconductor substrates of the transistor chips are oblique with respect to an input/output direction extending from the input matching circuit to the output matching circuit. | 01-16-2014 |
Tadashi Koyanagi, Tokyo JP
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20080317984 | Highly Crimped Conjugated Fiber Cheese Package and Process for Its Production - A highly crimped conjugate fiber cheese package which is obtained by layering on a paper bobbin a conjugate fiber consisting of a plurality of single filament composed of polytrimethylene terephthalate components having different intrinsic viscosities and consisting of at least 90 mol % of a trimethylene terephthalate unit and no more than 10 mol % of another ester repeating unit and laminated to each other in a side-by-side type, the cheese package being characterized by satisfying the following conditions (1)-(4). | 12-25-2008 |
20120252166 | SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method is provided. First and second semiconductor chips are prepared, including first and second electrodes on first and second surfaces respectively. The second semiconductor chip includes a third electrode on a third surface opposite to the second surface. The third electrode overlaps the second electrode. The second surface includes an electrode-free region that is free of any electrode. A sealing resin is applied on the first surface of the first semiconductor chip. A second surface of the first semiconductor chip is held by a bonding tool including a pressing surface and a supporting-portion projected from the pressing surface. The pressing surface is made into contact with the second electrode. The supporting-portion is arranged at a position facing the electrode-free region. The second semiconductor chip is stacked over the first semiconductor chip by the bonding tool to electrically connect the third electrode to the first electrode. | 10-04-2012 |
20130001802 | SEMICONDUCTOR DEVICE INCLUDING INSULATING RESIN FILM PROVIDED IN A SPACE BETWEEN SEMICONDUCTOR CHIPS - A semiconductor device includes a first semiconductor, a second semiconductor, and an insulating resin. The first semiconductor chip includes first and second electrodes formed on first and second surfaces thereof, respectively. The second semiconductor chip includes a third electrode formed on a third surface thereof. The insulating resin film includes a flux activator. The insulating resin film is provided a space between the first and the second semiconductor chips. | 01-03-2013 |
20130183799 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device, which includes: preparing a semiconductor wafer; and peeling off an adhesive layer from the semiconductor wafer. The prepared semiconductor wafer includes at least one semiconductor chip having a bump electrode group formed by arraying bump electrodes in a matrix, and the adhesive layer formed on one surface having the bump electrodes. The bump electrode group is formed by arraying the bump electrodes so that the number of bump electrodes in a second direction can be smaller than that in a first direction. To peel off the adhesive layer from the semiconductor wafer, the adhesive layer is peeled off from the semiconductor wafer along the first direction from one end side of the semiconductor wafer. | 07-18-2013 |
20140377886 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING GRINDING SEMICONDUCTOR WAFER - A method of manufacturing a semiconductor device according to one embodiment includes: preparing a semiconductor water which is partitioned into a plurality of first semiconductor chips, the plurality of first semiconductor chips including a first group of first semiconductor chips and a second group of first semiconductor chips; providing a second semiconductor chip over at least one of first semiconductor chips of the first group; providing a sealer on the first semiconductor chips of the second group; and grinding one face of the semiconductor wafer which is on the opposite side from a face on which the second semiconductor chip and the sealer are provided. | 12-25-2014 |
Takashi Koyanagi, Tokyo JP
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20110288687 | SETTING VALUE CONTROLLING METHOD AND DEVICE - A setting value controlling device comprises: a setting value information collecting and storing portion for collecting and storing temperature setting values from an air-conditioner controlling device; a setting value reset evaluating portion for resetting the temperature setting value to a reference setting value if the temperature setting value is not a more energy-conserving setting than the reference setting value when a specific reset time has been reached; and a reference setting value updating portion for updating the reference setting value to the updated temperature setting value if, when the temperature setting value has been updated by a user, the updated temperature setting value is a more energy-conserving setting than the reference setting value and a specific time interval has elapsed since updating of the temperature setting value. | 11-24-2011 |
20150204560 | ENVIRONMENTAL PARAMETER SETTING AIDING DEVICE AND METHOD - An environmental parameter setting aiding device includes: a data acquiring system that acquires, and saves as environmental parameter information, a current parameter value of an environmental parameter of an air conditioning controlling system, and acquires, and saves as complaint information, complaints from various occupants indicating perceptions that a temperature environment, using the parameter value, is too hot or too cold; a complaint proportion calculating portion that calculates, from the complaint information that has been stored, a complaint proportion, indicating a proportion of perceptions of being too hot or too cold, for each individual parameter value; a parameter value selecting portion that selects, as a recommended parameter value, the parameter value wherein the complaint proportion is nearest to 50%; and an aid screen displaying portion that presents the recommended value in an aid screen. | 07-23-2015 |
Takayoshi Koyanagi, Tokyo JP
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20160054909 | ENGINEERING DEVICE AND SCREEN DISPLAY CONTROLLING METHOD - An engineering device including a menu selector selecting an operating menu; a program group display controller displaying, on a display screen, screens relating to each of one or more programs, grouped in advance as a program group relating to the operating menu selected by the menu selector; a program launcher activating a program other than the engineering tool and displaying, on the front-most screen of the display screen, a screen relating to the other program that has been activated; a screen switch switching the display of the display screen so as to move, to the front-most screen of the display screen, screens relating to the individual programs that have been set as the program group, when there has been a screen switching request; and a screen display controller adjusting the size or position of respective windows for each of the screens in response to a display position adjusting instruction. | 02-25-2016 |
Takuya Koyanagi, Tokyo JP
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20090060432 | LIGHT TRANSMITTING BODY AND OPTICAL INTERCONNECTION SYSTEM - An optical transmission medium includes a GI optical fiber that is made of silica glass. The GI optical fiber includes a core having a graded-index refractive index profile and a cladding formed around the core. The GI optical fiber is bent by equal to or more than a quarter turn with a curvature radius equal to or larger than 4 mm and equal to or smaller than 10 mm. | 03-05-2009 |
Tasuku Koyanagi, Tokyo JP
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20150202857 | SEPARATION APPARATUS - A separation apparatus for separating a composite substrate formed from a first substrate and a second substrate joined together includes an exfoliation unit for advancing into a boundary region between the first substrate and the second substrate of the composite substrate supported by a supporting face of a supporting base and a side face supporting unit to exfoliate the composite substrate into the first substrate and the second substrate. The exfoliation unit includes a wedge portion for advancing into the boundary region between the first substrate and the second substrate, an exfoliation member having a gas outlet open at a tip end of the wedge portion, and an exfoliation member advancing and retracting unit for advancing and retracting the wedge portion of the exfoliation member to and from the boundary region between the first substrate and the second substrate which configure the composite substrate. | 07-23-2015 |
20150221818 | LIFT-OFF METHOD - A lift-off method transfers an optical device layer in an optical device wafer to a transfer substrate. The optical device layer is formed on the front side of an epitaxy substrate through a buffer layer. A composite substrate is formed by bonding the transfer substrate through a bonding agent to the front side of the optical device layer, thereby forming a composite substrate. The buffer layer is broken up by applying a laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer from the back side of the epitaxy substrate to the buffer layer after performing the composite substrate forming step, thereby breaking the buffer layer. An optical device layer is transferred by peeling off the epitaxy substrate from the optical device layer after performing the buffer layer breaking step, thereby transferring the optical device layer to the transfer substrate. | 08-06-2015 |
20150328872 | LIFT-OFF METHOD - A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer. | 11-19-2015 |
Tatsunori Koyanagi, Tokyo JP
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20100051324 | DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE - An aspect of the present invention comprises a method of forming holes in a dielectric substrate comprising the steps of applying a layer of photoresist to a dielectric substrate, exposing portions of the photoresist to actinic radiation through a photomask to form a pattern in the photoresist for an array of holes to be etched in the substrate, developing the photoresist, etching the dielectric substrate to form an array of holes, each hole extending at least partially through the dielectric substrate, and removing the excess photoresist. Another aspect of the present invention is a method of simultaneously forming holes in a dielectric substrate some of which extend partially through the substrate and some of which extend completely through the substrate. Other aspects of the present invention are dielectric substrates formed using the methods of the invention. | 03-04-2010 |
Teruo Koyanagi, Tokyo JP
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20130275677 | Method, Device and Computer Program for Identifying Items Having High Frequency of Occurrence Among Items Included in a Text Data Stream - A method, device and computer program for efficiently identifying items having a high frequency of occurrence among items included in a large-volume text data stream. Identification information for identifying an item and a count of items are stored in a higher level of memory and only identification information is stored in a lower level. Text data stream input is received, the increment of the count of an item is increased in response to storage in the higher level memory of identification information for an item included in a bucket divided from the received text data stream input, identification information for the item is transferred with the initial count to the higher level of memory in response to storage in the lower level and the identification information for the item is newly stored with the initial count in the higher level in response to not being stored on any level. | 10-17-2013 |
20140122921 | DATA STORE CAPABLE OF EFFICIENT STORING OF KEYS - Embodiments relate to a computer implemented information processing system, method and program product for data access. The information processing system includes a data store having a top tier store and at least another tier store with the top tier store including a counter for each entry of a symbol and another tier store including a representative frequency value defined for the another tier store. A sorter is also provided configured to sort the symbol in the top tier store and the another tier stores according to a value generated in the counter for the assessed symbol. The said sorter is also configured to restore entry of the symbol in the top tier store, in response to a symbol having moved from said top tier store to another tier store, by using the representative frequency value defined for said another store to which said symbol was moved. | 05-01-2014 |
Tomoaki Koyanagi, Tokyo JP
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20100134576 | FLOTATION APPARATUS - A flotation apparatus F includes a tank | 06-03-2010 |
Toshiro Koyanagi, Tokyo JP
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20160023626 | PASSENGER RETAINING APPARATUS - A passenger retaining apparatus includes a driver seat airbag and a curtain airbag. The curtain airbag includes first and second inflation portions and a recess portion. The first inflation portion is inflated at a passenger side with respect to the inflated driver seat airbag in a vehicle body longitudinal direction. The second inflation portion is inflated at a wind shield side with respect to the inflated driver seat airbag in the vehicle body longitudinal direction. The recess portion is formed between the first and second inflation portions to engage with the inflated driver seat airbag. The driver seat airbag retains a front surface of a head of the passenger and the first inflation portion retains a side surface of the head of the passenger. | 01-28-2016 |
Yohei Koyanagi, Tokyo JP
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20090323222 | Thin film magnetic head, magnetic head slider, head gimbal assembly, head arm assembly, magnetic disk device and method of manufacturing thin film magnetic head - In manufacturing the thin film magnetic head, the rear end face of the MR element and the rear end face of a resistive film pattern are determined with high precision using a mask pattern, in which a first opening and a second opening are collectively formed. The first and second openings are located side by side in a track-width direction. The first opening includes a first edge extending across the MR film in the track-width direction, and the second opening includes a second edge located at a given interval, as measured in a direction orthogonal to the track-width direction, from the first edge, and extending in the track-width direction. In the step of polishing for forming a magnetic-recording-medium-facing-surface, the amount of polishing is determined by monitoring the resistance change of the resistive film pattern, thereby reducing the dimension errors in the MR height when manufacturing the MR element. | 12-31-2009 |
20100177440 | Thin film magnetic head and magnetic disk device - Foundation layers of a thin film magnetic head are disposed between insulating layers and bias magnetic field application layers, and are configured of Cr or Cr alloy. The insulating layers are configured of a Si oxide such that the Si content of the Si oxide is in the range of 30˜56 at % (atom %) and that the atom ratio of oxygen to Si (O/Si) is in the range of 0.8˜1.3. With the configuration, the occurrence rate of noise is reduced. | 07-15-2010 |
Yoko Koyanagi, Tokyo JP
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20150044647 | OPERATION LEARNING LEVEL EVALUATION SYSTEM - There is provided a system that can evaluate an operation learning level of a trainee quantitatively and accurately, with a temporal element taken into account. A learning level evaluation system | 02-12-2015 |
Youhei Koyanagi, Tokyo JP
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20150233769 | THERMISTOR FIXING STRUCTURE, THERMISTOR REMOVING METHOD, AND AIR-CONDITIONING APPARATUS - Provided is a thermistor fixing structure capable of facilitating insertion of a thermistor into a temperature sensitive cylinder, and preventing the thermistor from easily dropping off the temperature sensitive cylinder. In a thermistor fixing structure ( | 08-20-2015 |
20160025328 | COMMUNICATION DEVICE AND AIR-CONDITIONING APPARATUS - A communication device constitutes part of an apparatus and communicates with other apparatuses. The communication device includes a case having an opening; a plurality of indicator lamps accommodated in the case, at a position corresponding to the opening; and an indicator lamp cover that is provided so as to be slidable in a direction in which the plurality of indicator lamps are arranged and that is used to adjust an opening degree of the opening. | 01-28-2016 |
20160025357 | INDOOR UNIT OF AIR CONDITIONING DEVICE - An indoor unit of an air conditioning device which is installed on a wall surface of a room includes an air sending fan which sends room air from an air inlet disposed at an upper part to an air outlet disposed at a lower part of a front side; heat exchangers disposed at the upstream side of the air sending fan; and a back case which is located close to the wall surface with respect to the air sending fan and supports the heat exchangers, wherein the back case is composed of an air outlet passage wall member which forms an air outlet passage for air blown out from the air sending fan and an installation member which is located on a back side of the air outlet passage wall member and is mounted on an installation plate which is fixed on the wall surface with the air outlet passage wall member and the installation member being arranged in parallel in the front and back direction, and a first space is formed between a back surface of an air outlet passage wall of the air outlet passage wall member and the installation member. | 01-28-2016 |
20160033161 | INDOOR UNIT FOR AIR-CONDITIONING APPARATUS - The indoor unit for an air-conditioning apparatus includes: a fan; a heat exchanger located on a front side of the indoor unit with respect to the fan and on an upstream side with respect to the fan; an electrical component unit arranged in front of the heat exchanger in a horizontally long posture; a front designed panel located on a foremost side of the indoor unit in an openable and closeable manner; and an electrical component cover removably mounted to members forming a casing of the indoor unit, the electrical component cover including: a lower cover plate for covering a lower side of the electrical component unit; and a front cover plate for covering a front side of the electrical component unit. The front cover plate is exposed when the front designed panel is opened. | 02-04-2016 |
20160040901 | INDOOR UNIT OF AIR-CONDITIONING APPARATUS - An indoor unit of an air-conditioning apparatus includes a housing having a wall extending in a horizontal direction, and a front panel covering at least a part of a front side of the wall. On a region of the wall covered by the front panel, an opening leading to a front end of a space in which a network repeater for wirelessly communicating with a network is to be contained is formed. The opening is configured to be exposed in a state in which a whole or a part of the front panel is removed or opened. | 02-11-2016 |
Yukio Koyanagi, Tokyo JP
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20090135970 | DIRECT CONVERSION RECEIVER - A direct conversion receiver wherein even when signals are continuously received, the automatic gain control can be implemented in accordance with the signal levels from which DC offset voltages have been removed. The direct conversion receiver comprises a low-noise amplifier | 05-28-2009 |